Abstract: Disclosed herein are a washing machine including an air-stream guide configured to guide a rotating air-stream generated by rotation of the drum toward the spray opening. The washing machine having the circulation apparatus can prevent water or bubbles remaining in the tub and the pump room from flowing into the inside of the drum along the circulation path of the circulation apparatus, due to a pressure difference made between the center area and the outer area of the tub during spin-drying in which the drum rotates at high speed.

Abstract: Disclosed is a washing machine having an improved structure so as to enable noise reduction. The disclosed washing machine comprises: a main body; a drum rotatably disposed inside the main body; and a detergent supply device provided in the main body and supplying detergent into the drum, wherein the detergent supply device includes: a housing; a detergent container containing the detergent and movably coupled to the housing; and a water supply frame having an inflow hole through which water supplied from the outside flows in, and a flow velocity mitigation part provided at the lower side of the inflow hole so as to mitigate the flow velocity of the water.

Abstract: Disclosed are a polyimide film for a semiconductor package reflow process, and a manufacturing method therefor, the polyimide film being capable of ensuring ease of attachment/detachment of a semiconductor chip after a reflow process is completed, by means of the application of a thermoplastic polyimide layer having a glass transition temperature less than or equal to a reflow process temperature.

Abstract: A centrifugal casting apparatus for different materials may include a mold having a shape corresponding to a shape of an outer surface of a casting to be produced, and having a cavity receiving molten metals therein, a molten metal guide inserted into the mold and configured to guide the molten metals so that the molten metals are separately injected into the mold, a guide fixing support fixing the molten metal guide to a predetermined position, and a motor configured to rotate the mold around a rotation axis.

Abstract: Provided is a laundry treating apparatus including a cabinet, a laundry care device movably provided inside the cabinet, wherein the laundry care device includes a jetting unit configured to jet air to the laundry, and a suction unit into which air jetted by the jetting unit, after passing through the laundry, is suctioned. Inside of the laundry treating apparatus is kept pleasant and laundry care efficiency is enhanced.

Abstract: A washing machine having a bubble generator includes a bubble spray part provided at an upper side of a tub and configured to discharge bubbles from a top to a bottom inside the tub, a wash liquid jet nozzle provided inside the bubble spray part and configured to jet wash liquid; a blowing fan provided in the bubble spray part and configured to blow air in a direction in which the wash liquid jet nozzle jets the wash liquid; and a porous plate member provided at a front end of the bubble spray part and including a plurality of holes, wherein when the wash liquid jetted from the wash liquid jet nozzle collides with the porous plate member, bubbles are generated.

Abstract: A dish washing machine having a structure improved to increase washing efficiency is provided. The dish washing machine includes a washing tub for washing dishes, an injection unit to inject washing water into the washing tub, and a deflection unit to move inside the washing tub to deflect the washing water injected from the injection unit toward the dishes. The deflection unit includes a first vane to be linearly movable in a direction in which the washing water is injected and a second vane to interwork with the first vane.

Abstract: Provided is a washing machine having an improved structure for efficiently controlling a distribution of washing water to improve washing performance. The washing machine includes a tub, a rotary tub rotatably provided inside of the tub, a tub cover coupled to the tub to prevent washing water from overflowing the tub, and a plurality of guide units formed on a bottom surface of the tub cover to guide the washing water into the inside of the rotary tub. The plurality of guide units includes a first guide having an outer end spaced from an edge of the tub cover in an inward direction of the tub cover, a second guide having an outer end spaced from the edge of the tub cover in the inward direction of the tub cover, and disposed to be spaced apart from the first guide in a circumferential direction of the tub cover, and a third guide connecting the outer end of the first guide and the outer end of the second guide.

Abstract: A golf information service method realized in a screen golf system, the golf information service method, includes: a mobile terminal of each of a plurality of users accessing a server connected to a simulator, configured to realize an image in which a virtual ball is simulated on a virtual golf course such that the users play a virtual golf game, over a network; the server receiving information about the golf game that is being performed by the simulator from the simulator; the server transmitting the information about the golf game, received from the simulator, and information about a course map based thereon to the mobile terminal; and the mobile terminal displaying information about progress of the golf game on the course map of a hole on which the golf game is being played based on the information about the golf game.

Abstract: A differential carrier case with an inserted pipe for high pressure casting may include a mold core into which a first end of a pipe is inserted, a mold core pin fixed to the mold core to fix the mold core and the first end of the pipe, a drive core pin inserted into a second end of the pipe, and a thick portion surrounding an outer portion of the pipe.

Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: It has been established that optimizing cell seeding onto tissue engineering vascular grafts (TEVG) is associated with reduced inflammatory responses and reduced post-operative stenosis of TEVG. Cell seeding increased TEVG patency in a dose dependent manner, and TEVG patency improved when more cells were seeded, however duration of incubation time showed minimal effect on TEVG patency. Methods of engineering patient specific TEVG including optimal numbers of cells to maintain graft patency and reduce post-operative stenosis are provided. Closed, single-use customizable systems for seeding TEVG are also provided. Preferably the systems are custom-designed based on morphology of the patient specific graft, to enhance the efficacy of cell seeding.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A method of manufacturing a hollow salt core may include an injection operation, in which molten salt including an ingredient of a salt core is injected into a mold through pressurization; a primary maintenance operation, in which a pressure is maintained in the mold including the injected molten salt; a primary decompressing operation, in which a portion of the molten salt maintained with the pressure is collected in the mold through decompression of the mold; a secondary maintenance operation, in which a pressure is maintained in the mold including the residual molten salt after the primary decompressing operation; and a secondary decompressing operation, in which the pressure of the mold is decreased after the secondary maintenance operation.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Abstract: Provided herein are a saltcore for casting with aluminum and a manufacturing method thereof, and more particularly, a saltcore and a manufacturing method thereof capable of reducing shrinkage while satisfying strength during die-casting by including at least one cation of K+, Na+ and Mg2+ and at least one anion of Cl? and C032?, wherein a saltcore for casting with aluminum may include at least one cation of K+, Na+ and Mg2+ and at least one anion of Cl? and C032?.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package.