Patents by Inventor Venkatesan Murali

Venkatesan Murali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6869882
    Abstract: A photonic via is made in a substrate by making a hole in the substrate, depositing a cladding into the hole, and then depositing an optical core material into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: March 22, 2005
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Publication number: 20050032384
    Abstract: A photonic via is made in a substrate by making a hole in the substrate, depositing a cladding into the hole, and then depositing an optical core material into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
    Type: Application
    Filed: December 19, 2000
    Publication date: February 10, 2005
    Inventor: Venkatesan Murali
  • Patent number: 6819836
    Abstract: A device has both electronic and photonic components on a shared substrate. The electronic components may include a light source for providing a photonic signal through the substrate to the photonic components.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: November 16, 2004
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Patent number: 6788836
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: September 7, 2004
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Patent number: 6778727
    Abstract: An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: August 17, 2004
    Assignee: Intel Corporation
    Inventors: Suresh Ramalingam, Venkatesan Murali
  • Publication number: 20040126075
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Application
    Filed: June 17, 2003
    Publication date: July 1, 2004
    Inventor: Venkatesan Murali
  • Publication number: 20040096144
    Abstract: An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.
    Type: Application
    Filed: November 14, 2003
    Publication date: May 20, 2004
    Inventors: Suresh Ramalingam, Venkatesan Murali
  • Patent number: 6731843
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: May 4, 2004
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Publication number: 20040057668
    Abstract: A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 25, 2004
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Publication number: 20040028335
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Application
    Filed: December 29, 2000
    Publication date: February 12, 2004
    Inventor: Venkatesan Murali
  • Patent number: 6687427
    Abstract: An apparatus comprising a body having dimensions suitable for light transmission therethrough, the body comprising a core extending therethrough, a first portion of the core comprising an index of refraction different than a second portion of the core and a cladding disposed about the core. An optical electronic integrated circuit (OEIC) substrate comprising a plurality of waveguides and a light source emitter coupled to at least one of the plurality of waveguides. A method comprising providing optical signals to an optical electronic integrated circuit (OEIC) through a plurality of waveguides are arranged in a circuit of different paths; and selecting an optical path by the index of refraction of a portion of the core.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: February 3, 2004
    Assignee: Intel Corporation
    Inventors: Suresh Ramalingam, Venkatesan Murali
  • Patent number: 6650823
    Abstract: A photonic via is made in a substrate by making a hole in the substrate, heating the substrate, and inserting a fiber optic into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: November 18, 2003
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Patent number: 6650817
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: November 18, 2003
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Publication number: 20030206679
    Abstract: A photonic via is made in a substrate by making a hole in the substrate, heating the substrate, and inserting a fiber optic into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
    Type: Application
    Filed: December 19, 2000
    Publication date: November 6, 2003
    Inventor: Venkatesan Murali
  • Publication number: 20030202751
    Abstract: A two-dimensional lithographically defined optic array to transmit light through a substrates and aid alignment of multiple substrates. The 2-D lithographically defined optic array can be made up of transparent material filled vias. Additionally, markers can be placed on the substrates relative to either the vias or the optical centers of the transparent material in the vias to aid alignment between multiple substrates containing 2-D lithographically defined optic arrays. Transparent materials such as optical fiber, cladding, and gas may be used in the 2-D optic array to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate with a 2-D optic array. The conductive layer can then interact with the 2-D optic array through light detecting devices such as photodetectors.
    Type: Application
    Filed: December 29, 2000
    Publication date: October 30, 2003
    Inventor: Venkatesan Murali
  • Patent number: 6636671
    Abstract: A lithographic process is used to place a marking on a waveguide to indicate optical channels within the waveguide. A photonic component is positioned against the waveguide based on the markings and adjusted until aligned.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 21, 2003
    Assignee: Intel Corporation
    Inventors: Venkatesan Murali, Rama K. Shukla
  • Patent number: 6633707
    Abstract: A two-dimensional lithographically defined optic array to transmit light through a substrates and aid alignment of multiple substrates. The 2-D lithographically defined optic array tan be made up of transparent material filled vias. Additionally, markers can be placed on the substrates relative to either the vias or the optical centers of the transparent material in the vias to aid alignment between multiple substrates containing 2-D lithographically defined optic arrays. Transparent materials such as optical fiber, cladding, and gas may be used in the 2-D optic array to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate with a 2-D optic array. The conductive layer can then interact with the 2-D optic array through light detecting devices such as photodetectors.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: October 14, 2003
    Assignee: Intel Corporation
    Inventor: Venkatesan Murali
  • Publication number: 20030174949
    Abstract: A planar lightwave circuit generalized for handling any given band of multiple bands of a wavelength range, including a first grating element handling a first group of bands; and a second grating element handling a second group of bands. The first and second groups of bands overlap in the wavelength range, and may be spaced apart by a fixed wavelength value. By providing two periodic grating elements handling alternating bands, their free spectral range is allowed to expand, improving their roll-off characteristics. By providing separate inputs for each band, wavelength accuracy can be improved. Device flexibility can be further improved by using switch and interleaver fabrics at the inputs and outputs. The resultant device, generalized to handle any given band within a wavelength range, eliminates the need for separate component design and inventory tracking otherwise necessary.
    Type: Application
    Filed: March 15, 2002
    Publication date: September 18, 2003
    Applicant: Scion Photonics, Inc.
    Inventors: Jyoti Bhardwaj, David Dougherty, Venkatesan Murali, Hiroaki Yamada
  • Publication number: 20030174967
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Application
    Filed: October 15, 2002
    Publication date: September 18, 2003
    Inventor: Venkatesan Murali
  • Publication number: 20030174966
    Abstract: A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.
    Type: Application
    Filed: October 15, 2002
    Publication date: September 18, 2003
    Inventor: Venkatesan Murali