Patents by Inventor VIA Technologies, Inc.

VIA Technologies, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130076404
    Abstract: A low voltage differential signal driving circuit including positive and negative differential output terminals, an automatic level selector, an output level detector and a transition accelerator. The positive and negative differential output terminals provide a transmission interface with a differential output signal for transmission of a data signal. The automatic level selector outputs a reference voltage corresponding to the transmission interface. The output level detector generates a low-high (or high-low) transition acceleration control signal based on the data signal, the reference voltage, and VTXP signal at the positive differential output terminal (or VTXN signal at the negative differential output terminal).
    Type: Application
    Filed: November 26, 2012
    Publication date: March 28, 2013
    Applicant: VIA TECHNOLOGIES, INC.
    Inventor: VIA TECHNOLOGIES, INC.
  • Publication number: 20130059453
    Abstract: An integrated circuit for accessing a universal serial bus (USB) device via a USB 3.0 receptacle is provided. The integrated circuit includes a plurality of pins and a controlling unit. The pins include a first group for coupling to a first pair of differential pins of the USB receptacle, a second group for coupling to a second pair of differential pins of the USB receptacle, a third group for coupling to a third pair of differential pins to the USB receptacle, a ground pin, a first and second power pins. The second group is disposed between the first and third groups. The controlling unit controls the plurality of pins to receive or transmit the USB 2.0 or USB 3.0 signals.
    Type: Application
    Filed: November 1, 2012
    Publication date: March 7, 2013
    Applicant: VIA TECHNOLOGIES, INC.
    Inventor: VIA TECHNOLOGIES, INC.
  • Publication number: 20130025926
    Abstract: A circuit substrate having a base layer, a patterned conductive layer, a dielectric layer and a conductive block is provided. The patterned conductive layer is disposed on the base layer and having an inner pad. The dielectric layer is disposed on the base layer and covering the patterned conductive layer. The conductive block penetrates the dielectric layer, the conductive block being substantially coplanar with the dielectric layer and connecting the inner pad.
    Type: Application
    Filed: October 4, 2012
    Publication date: January 31, 2013
    Applicant: VIA TECHNOLOGIES, INC.
    Inventor: VIA Technologies, Inc.