Patents by Inventor Vibhor Jain

Vibhor Jain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145585
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors (HBTs) with a buried trap rich region and methods of manufacture. The structure includes: a heterojunction bipolar transistor comprising a collector region, a base region and an emitter region; and at least one non-single-crystal semiconductor region in the collector region of the heterojunction bipolar transistor.
    Type: Application
    Filed: November 1, 2022
    Publication date: May 2, 2024
    Inventors: Anupam DUTTA, Rajendran KRISHNASAMY, Vvss Satyasuresh CHOPPALLI, Vibhor JAIN, Robert J. Gauthier, JR.
  • Publication number: 20240136395
    Abstract: Structures for a junction field-effect transistor and methods of forming a structure for a junction field-effect transistor. The structure comprises a first gate on a top surface of a semiconductor substrate, a second gate beneath the top surface of the semiconductor substrate, and a channel region in the semiconductor substrate. The first gate is positioned between a source and a drain, and the channel region positioned between the first gate and the second gate.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 25, 2024
    Inventors: Xinshu Cai, Shyue Seng Tan, Vibhor Jain, John J. Pekarik
  • Publication number: 20240136400
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor with gated collector and methods of manufacture. The structure includes: an extrinsic base region vertically over a semiconductor substrate and comprising asymmetrical sidewall spacers on opposing sidewalls of the extrinsic base region; a collector region on the semiconductor substrate and separated from the extrinsic base region by at least a first spacer of the asymmetrical sidewall spacers; and an emitter region on the semiconductor substrate and separated from the extrinsic base region by a second spacer of the asymmetrical sidewall spacers.
    Type: Application
    Filed: January 5, 2024
    Publication date: April 25, 2024
    Inventors: Alexander Derrickson, Vibhor Jain, Judson R. Holt, Jagar Singh, Mankyu Yang
  • Patent number: 11949004
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor and methods of manufacture. The structure includes: an extrinsic base region; an emitter region on a first side of the extrinsic base region; a collector region on a second side of the extrinsic base region; and a gate structure comprising a gate oxide and a gate control in a same channel region as the extrinsic base region.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: April 2, 2024
    Assignee: GLOBALFOUNDRIES U.S. Inc.
    Inventors: Judson R. Holt, Vibhor Jain, Alexander M. Derrickson
  • Patent number: 11942082
    Abstract: Techniques described herein relate to facilitating end-to-end multilingual communications with automated assistants. In various implementations, speech recognition output may be generated based on voice input in a first language. A first language intent may be identified based on the speech recognition output and fulfilled in order to generate a first natural language output candidate in the first language. At least part of the speech recognition output may be translated to a second language to generate an at least partial translation, which may then be used to identify a second language intent that is fulfilled to generate a second natural language output candidate in the second language. Scores may be determined for the first and second natural language output candidates, and based on the scores, a natural language output may be selected for presentation.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: March 26, 2024
    Assignee: GOOGLE LLC
    Inventors: James Kuczmarski, Vibhor Jain, Amarnag Subramanya, Nimesh Ranjan, Melvin Jose Johnson Premkumar, Vladimir Vuskovic, Luna Dai, Daisuke Ikeda, Nihal Sandeep Balani, Jinna Lei, Mengmeng Niu, Hongjie Chai, Wangqing Yuan
  • Patent number: 11942534
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor with thermal conductor and methods of manufacture. The structure includes: a base formed within a semiconductor substrate; a thermal conductive material under the base and extending to an underlying semiconductor material; an emitter on a first side of the base; and a collector on a second side of the base.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: March 26, 2024
    Assignee: GLOBALFOUNDRIES U.S. Inc.
    Inventors: Hong Yu, Judson R. Holt, Vibhor Jain
  • Patent number: 11935927
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor with a collector contact and methods of manufacture. The structure includes: a lateral bipolar transistor which includes an emitter, a base and a collector; an emitter contact to the emitter; a base contact to the base; and a collector contact to the collector and extending to an underlying substrate underneath the collector.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: March 19, 2024
    Assignee: GLOBALFOUNDRIES U.S. Inc.
    Inventors: Hong Yu, Vibhor Jain
  • Patent number: 11935928
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a bipolar transistor with self-aligned asymmetric spacer and methods of manufacture. The structure includes: a base formed on a semiconductor substrate; an asymmetrical spacer surrounding the base; an emitter on a first side of the base and separated from the base by the asymmetrical spacer; and a collector on a second side of the base and separated from the base by the asymmetrical spacer.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: March 19, 2024
    Assignee: GLOBALFOUNDRIES U.S. Inc.
    Inventors: Hong Yu, Jianwei Peng, Vibhor Jain
  • Patent number: 11935923
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor with gated collector and methods of manufacture. The structure includes: an extrinsic base region vertically over a semiconductor substrate and comprising asymmetrical sidewall spacers on opposing sidewalls of the extrinsic base region; a collector region on the semiconductor substrate and separated from the extrinsic base region by at least a first spacer of the asymmetrical sidewall spacers; and an emitter region on the semiconductor substrate and separated from the extrinsic base region by a second spacer of the asymmetrical sidewall spacers.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: March 19, 2024
    Assignee: GLOBALFOUNDRIES U.S. Inc.
    Inventors: Alexander Derrickson, Vibhor Jain, Judson R. Holt, Jagar Singh, Mankyu Yang
  • Publication number: 20240088272
    Abstract: Embodiments of the disclosure provide a bipolar transistor and gate structure on a semiconductor fin and methods to form the same. A structure according to the disclosure includes a semiconductor fin including an intrinsic base region and an extrinsic base region adjacent the intrinsic base region along a length of the semiconductor fin. Sidewalls of the intrinsic base region of the semiconductor fin are adjacent an emitter and a collector along a width of the semiconductor fin. A gate structure is on the semiconductor fin and between the intrinsic base region and the extrinsic base region.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: Shesh Mani Pandey, Vibhor Jain
  • Patent number: 11923446
    Abstract: The present disclosure relates generally to structures in semiconductor devices and methods of forming the same. More particularly, the present disclosure relates to high electron mobility transistor (HEMT) devices having a silicided polysilicon layer. The present disclosure may provide an active region above a substrate, source and drain electrodes in contact with the active region, a gate above the active region, the gate being laterally between the source and drain electrodes, a polysilicon layer above the substrate, and a silicide layer on the polysilicon layer. The active region includes at least two material layers with different band gaps. The polysilicon layer may be configured as an electronic fuse, a resistor, or a diode.
    Type: Grant
    Filed: October 17, 2021
    Date of Patent: March 5, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Vibhor Jain, Johnatan Avraham Kantarovsky, Mark David Levy, Ephrem Gebreselasie, Yves Ngu, Siva P. Adusumilli
  • Publication number: 20240072180
    Abstract: Structures for a varactor diode and methods of forming same. The structure comprises a first semiconductor layer including a section on a substrate, a second semiconductor layer on the section of the first semiconductor layer, a third semiconductor layer on the second semiconductor layer, and a doped region in the section of the first semiconductor layer. The section of the first semiconductor layer and the doped region have a first conductivity type, and the second semiconductor layer comprises silicon-germanium having a second conductivity type opposite to the first conductivity type, and the third semiconductor layer has the second conductivity type. The doped region contains a higher concentration of a dopant of the first conductivity type than the section of the first semiconductor layer. The second semiconductor layer abuts the first section of the first semiconductor layer along an interface, and the doped region is positioned adjacent to the interface.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Saloni Chaurasia, Jeffrey Johnson, Vibhor Jain, Crystal R. Kenney, Sudesh Saroop, Teng-Yin Lin, John J. Pekarik
  • Patent number: 11915692
    Abstract: Techniques described herein relate to facilitating end-to-end multilingual communications with automated assistants. In various implementations, speech recognition output may be generated based on voice input in a first language. A first language intent may be identified based on the speech recognition output and fulfilled in order to generate a first natural language output candidate in the first language. At least part of the speech recognition output may be translated to a second language to generate an at least partial translation, which may then be used to identify a second language intent that is fulfilled to generate a second natural language output candidate in the second language. Scores may be determined for the first and second natural language output candidates, and based on the scores, a natural language output may be selected for presentation.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: February 27, 2024
    Assignee: GOOGLE LLC
    Inventors: James Kuczmarski, Vibhor Jain, Amarnag Subramanya, Nimesh Ranjan, Melvin Jose Johnson Premkumar, Vladimir Vuskovic, Luna Dai, Daisuke Ikeda, Nihal Sandeep Balani, Jinna Lei, Mengmeng Niu
  • Patent number: 11901304
    Abstract: The disclosure provides an integrated circuit (IC) structure with fluorescent materials, and related methods. An IC structure according to the disclosure may include a layer of fluorescent material on an IC component. The layer of fluorescent material defines a portion of an identification marker for the IC structure.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: February 13, 2024
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Sunil K. Singh, Vibhor Jain, Siva P. Adusumilli, Sebastian T. Ventrone, Johnatan A. Kantarovsky, Yves T. Ngu
  • Publication number: 20240045156
    Abstract: A structure includes a dielectric waveguide, and at least one grating coupler adjacent the dielectric waveguide. Each grating coupler includes a set of parallel optofluidic grating channels oriented orthogonally to the dielectric waveguide. The structure may also include a radiation source operatively coupled to the dielectric waveguide, and an optical receiver such as a photosensor adjacent the grating coupler(s). The structure may be used as part of an optofluidic sensor system for, for example, biochemical applications.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 8, 2024
    Inventors: Yusheng Bian, Vibhor Jain, Steven M. Shank
  • Publication number: 20240038881
    Abstract: The present disclosure relates generally to structures in semiconductor devices and methods of forming the same. More particularly, the present disclosure relates to high electron mobility transistor (HEMT) devices having a silicided polysilicon layer. The present disclosure may provide an active region above a substrate, source and drain electrodes in contact with the active region, a gate above the active region, the gate being laterally between the source and drain electrodes, a polysilicon layer above the substrate, and a silicide layer on the polysilicon layer. The active region includes at least two material layers with different band gaps. The polysilicon layer may be configured as an electronic fuse, a resistor, or a diode.
    Type: Application
    Filed: October 15, 2023
    Publication date: February 1, 2024
    Inventors: VIBHOR JAIN, JOHNATAN AVRAHAM KANTAROVSKY, MARK DAVID LEVY, EPHREM GEBRESELASIE, YVES NGU, SIVA P. ADUSUMILLI
  • Publication number: 20240038882
    Abstract: The present disclosure relates generally to structures in semiconductor devices and methods of forming the same. More particularly, the present disclosure relates to high electron mobility transistor (HEMT) devices having a silicided polysilicon layer. The present disclosure may provide an active region above a substrate, source and drain electrodes in contact with the active region, a gate above the active region, the gate being laterally between the source and drain electrodes, a polysilicon layer above the substrate, and a silicide layer on the polysilicon layer. The active region includes at least two material layers with different band gaps. The polysilicon layer may be configured as an electronic fuse, a resistor, or a diode.
    Type: Application
    Filed: October 15, 2023
    Publication date: February 1, 2024
    Inventors: VIBHOR JAIN, JOHNATAN AVRAHAM KANTAROVSKY, MARK DAVID LEVY, EPHREM GEBRESELASIE, YVES NGU, SIVA P. ADUSUMILLI
  • Patent number: 11881523
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a subcollector under a buried insulator layer; a collector above the subcollector; a base within the buried insulator layer; an emitter above the base; and contacts to the subcollector, the base and the emitter.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: January 23, 2024
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Shesh Mani Pandey, Vibhor Jain, Judson R. Holt
  • Publication number: 20240021713
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a lateral bipolar transistor and methods of manufacture. A structure includes: an intrinsic base comprising semiconductor material in a channel region of a semiconductor substrate; an extrinsic base vertically above the intrinsic base; a raised collector region on the semiconductor substrate and laterally connected to the intrinsic base; and a raised emitter region on the semiconductor substate and laterally connected to the intrinsic base.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Inventors: Haiting Wang, Alexander Derrickson, Jagar Singh, Vibhor Jain, Andreas Knorr, Alexander Martin, Judson R. Holt, Zhenyu Hu
  • Patent number: 11875788
    Abstract: Techniques described herein relate to facilitating end-to-end multilingual communications with automated assistants. In various implementations, speech recognition output may be generated based on voice input in a first language. A first language intent may be identified based on the speech recognition output and fulfilled in order to generate a first natural language output candidate in the first language. At least part of the speech recognition output may be translated to a second language to generate an at least partial translation, which may then be used to identify a second language intent that is fulfilled to generate a second natural language output candidate in the second language. Scores may be determined for the first and second natural language output candidates, and based on the scores, a natural language output may be selected for presentation.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: January 16, 2024
    Assignee: GOOGLE LLC
    Inventors: James Kuczmarski, Vibhor Jain, Amarnag Subramanya, Nimesh Ranjan, Melvin Jose Johnson Premkumar, Vladimir Vuskovic, Luna Dai, Daisuke Ikeda, Nihal Sandeep Balani, Jinna Lei, Mengmeng Niu