Patents by Inventor Vijayeshwar D. Khanna
Vijayeshwar D. Khanna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11570928Abstract: A server node connection system uses two or more proximity sensors per server node to determine progressive, real time changes in wipe length for each individual connector on the node that is connected to an opposing header connector on header connected to a midplane of the server assembly/rack. The system is capable of scanning, monitoring, trending, and alarming.Type: GrantFiled: August 22, 2020Date of Patent: January 31, 2023Assignee: International Business Machines CorporationInventors: Sri M Sri-Jayantha, Hien P Dang, Vijayeshwar D Khanna
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Publication number: 20200389994Abstract: A server node connection system uses two or more proximity sensors per server node to determine progressive, real time changes in wipe length for each individual connector on the node that is connected to an opposing header connector on header connected to a midplane of the server assembly/rack. The system is capable of scanning, monitoring, trending, and alarming.Type: ApplicationFiled: August 22, 2020Publication date: December 10, 2020Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna
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Patent number: 10834844Abstract: A server node connection system uses two or more proximity sensors per server node to determine progressive, real time changes in wipe length for each individual connector on the node that is connected to an opposing header connector on header connected to a midplane of the server assembly/rack. The system is capable of scanning, monitoring, trending, and alarming.Type: GrantFiled: November 4, 2018Date of Patent: November 10, 2020Assignee: International Business Machines CorporationInventors: Sri M Sri-Jayantha, Hien P Dang, Vijayeshwar D Khanna
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Publication number: 20200146172Abstract: A server node connection system uses two or more proximity sensors per server node to determine progressive, real time changes in wipe length for each individual connector on the node that is connected to an opposing header connector on header connected to a midplane of the server assembly/rack. The system is capable of scanning, monitoring, trending, and alarming.Type: ApplicationFiled: November 4, 2018Publication date: May 7, 2020Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna
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Patent number: 10276534Abstract: A first electrical contact and second contact is upon an interposer and/or upon a processing device. The first contact includes a minor axis and a major axis. The second contact includes diameter axes. The first contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The first electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The first electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring first electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring first electrical contacts within the electrical contact grid may differ relative thereto.Type: GrantFiled: August 8, 2017Date of Patent: April 30, 2019Assignee: International Business Machines CorporationInventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Patent number: 10276535Abstract: An electrical contact upon an interposer and/or upon a processing device includes a minor axis and a major axis. The contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring electrical contacts within the electrical contact grid may differ relative thereto.Type: GrantFiled: October 26, 2017Date of Patent: April 30, 2019Assignee: International Business Machines CorporationInventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Patent number: 10108753Abstract: Method of designing a laminate substrate having upper laminate layers and an equal plurality of lower laminate layers including: dividing the laminate substrate into regions having corresponding laminate layer pairs consisting of an upper laminate layer and a lower laminate layer; calculating a net stretching value for each corresponding laminate layer pair in each region to result in net stretching values in each region; summing the net stretching values in each region to result in a net stretching value for each region proportional to a curvature of each local region; calculating a relative out-of-plane displacement for the laminate substrate from the curvature of each local region; calculating a predicted thermal warpage for the laminate substrate; and finalizing a design of the laminate substrate when the predicted thermal warpage is within a predetermined acceptable range.Type: GrantFiled: June 7, 2016Date of Patent: October 23, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Publication number: 20180061800Abstract: An electrical contact upon an interposer and/or upon a processing device includes a minor axis and a major axis. The contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring electrical contacts within the electrical contact grid may differ relative thereto.Type: ApplicationFiled: October 26, 2017Publication date: March 1, 2018Inventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Publication number: 20180061799Abstract: A first electrical contact and second contact is upon an interposer and/or upon a processing device. The first contact includes a minor axis and a major axis. The second contact includes diameter axes. The first contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The first electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The first electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring first electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring first electrical contacts within the electrical contact grid may differ relative thereto.Type: ApplicationFiled: August 8, 2017Publication date: March 1, 2018Inventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Patent number: 9865557Abstract: An electrical contact upon an interposer and/or upon a processing device includes a minor axis and a major axis. The contact is positioned such that the major axis is generally aligned with the direction of expansion of the interposer and/or the processing device. The electrical contact may further be positioned within a power/ground or input/output (I/O) region of the interposer and/or processing device. The electrical contact may further be positioned within a center region that is surrounded by a perimeter region of the interposer and/or the processing device. The dimensions or aspect ratios of major and minor axes of neighboring electrical contacts within an electrical contact grid may differ relative thereto. Further, the angle of respective major and minor axes of neighboring electrical contacts within the electrical contact grid may differ relative thereto.Type: GrantFiled: August 30, 2016Date of Patent: January 9, 2018Assignee: International Business Machines CorporationInventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Publication number: 20170351783Abstract: Method of designing a laminate substrate having upper laminate layers and an equal plurality of lower laminate layers including: dividing the laminate substrate into regions having corresponding laminate layer pairs consisting of an upper laminate layer and a lower laminate layer; calculating a net stretching value for each corresponding laminate layer pair in each region to result in net stretching values in each region; summing the net stretching values in each region to result in a net stretching value for each region proportional to a curvature of each local region; calculating a relative out-of-plane displacement for the laminate substrate from the curvature of each local region; calculating a predicted thermal warpage for the laminate substrate; and finalizing a design of the laminate substrate when the predicted thermal warpage is within a predetermined acceptable range.Type: ApplicationFiled: June 7, 2016Publication date: December 7, 2017Inventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Patent number: 9630269Abstract: A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.Type: GrantFiled: October 30, 2013Date of Patent: April 25, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Vijayeshwar D. Khanna, Mohammed S. Shaikh
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Patent number: 9563732Abstract: A method of predicting warpage of a laminate is disclosed in which in-plane copper imbalance is calculated. A method of designing an organic build-up laminate is provided in which in-plane copper imbalance is calculated and imbalances are corrected.Type: GrantFiled: January 26, 2016Date of Patent: February 7, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anson J. Call, Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga
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Patent number: 9550258Abstract: A structure and method of mounting a heat sink having a body and mounting points configured so as to connect to a mounting medium, at least one of the mounting points being configured to allow movement in a thermally-induced expansion direction.Type: GrantFiled: June 28, 2013Date of Patent: January 24, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Sri M Sri-Jayantha, Gerard McVicker, Jr., Vijayeshwar D Khanna, Jr.
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Patent number: 9508789Abstract: An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.Type: GrantFiled: January 17, 2014Date of Patent: November 29, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: David Questad, Vijayeshwar D Khanna, Jennifer V Muncy, Arun Sharma, Sri M Sri-Jayantha, Lorenzo Valdevit
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Publication number: 20160211161Abstract: A clamping apparatus applies a force to a workpiece during processing. The clamping apparatus includes a base defining a work area configured to receive a joined structure having multiple elements. The base defines a recess in the work area. An adjustable mechanism is configured to releasably couple to the base and apply a adjustable downward force to the joined structure to bend the joined structure downwardly into the recess during a process. A resilient plunger is part of the adjustable mechanism. The resilient plunger extends downwardly from a top plate of the adjustable mechanism, and the resilient plunger is configured to contact a top of a first element of the joined structure to apply the downward force.Type: ApplicationFiled: March 30, 2016Publication date: July 21, 2016Inventors: Edmund Blackshear, Vijayeshwar D. Khanna, Oswald J. Mantilla
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Patent number: 9305894Abstract: A clamping apparatus applies a force to a workpiece during processing. The clamping apparatus includes a base defining a work area configured to receive a joined structure having multiple elements. The base defines a recess in the work area. An adjustable mechanism is configured to releasably couple to the base and apply a adjustable downward force to the joined structure to bend the joined structure downwardly into the recess during a process. A resilient plunger is part of the adjustable mechanism. The resilient plunger extends downwardly from a top plate of the adjustable mechanism, and the resilient plunger is configured to contact a top of a first element of the joined structure to apply the downward force.Type: GrantFiled: June 5, 2013Date of Patent: April 5, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Edmund Blackshear, Vijayeshwar D. Khanna, Oswald J. Mantilla
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Patent number: 9227261Abstract: A vacuum carrier can be employed to provide a partial vacuum on a back side surface of a substrate thereby holding the substrate flat against a rigid surface of the carrier throughout the duration of a bonding process. The magnitude of vacuum can be optimized to limit the warping of the substrate during and after bonding with another substrate, and to limit the mechanical stress induced in the solder balls during cooling. The vacuum carrier can include a base plate, a seal plate with at least one opening configured to accommodate at least one substrate, and vacuum seal elements configured to create a vacuum environment that pushes the substrate against the base plate when the vacuum carrier is under vacuum. The configuration of the vacuum carrier is chosen to avoid distortion of the substrate due to the vacuum seal elements, while allowing adjustment of the magnitude of the partial vacuum.Type: GrantFiled: August 6, 2013Date of Patent: January 5, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Vijayeshwar D. Khanna, Sri M. Sri-Jayantha
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Patent number: 9171742Abstract: The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.Type: GrantFiled: July 22, 2013Date of Patent: October 27, 2015Assignee: GLOBALFOUNDRIES U.S. 2 LLCInventors: Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth Latzko, Qinghuang Lin, Peter J. Sorce, Sri M. Sri-Jayantha, Robert L. Wisnieff, Roy R. Yu
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Publication number: 20150118799Abstract: A mechanism to attach a die to a substrate and method of use are disclosed. The vacuum carrier includes a frame composed of material compatible with solder reflow process. The vacuum carrier further includes a vacuum port extending from a top surface to an underside surface of the frame. The vacuum carrier further includes a seal mechanism provided about a perimeter on the underside surface of the frame of the vacuum carrier. The frame and seal mechanism are structured to maintain a flatness of a die attached to the vacuum carrier by a vacuum source during the solder reflow process.Type: ApplicationFiled: October 30, 2013Publication date: April 30, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar D. KHANNA, Mohammed S. SHAIKH