Patents by Inventor Vijayeshwar D. Khanna
Vijayeshwar D. Khanna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7777301Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: GrantFiled: April 8, 2008Date of Patent: August 17, 2010Assignee: International Business Machines CorporationInventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Patent number: 7759787Abstract: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.Type: GrantFiled: November 6, 2007Date of Patent: July 20, 2010Assignee: International Business Machines CorporationInventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna, Arun Sharma
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Patent number: 7732894Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: GrantFiled: February 13, 2008Date of Patent: June 8, 2010Assignee: International Business Machines CorporationInventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Patent number: 7667969Abstract: Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.Type: GrantFiled: March 16, 2007Date of Patent: February 23, 2010Assignee: International Business Machines CorporationInventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
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Patent number: 7612446Abstract: A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottomType: GrantFiled: November 22, 2006Date of Patent: November 3, 2009Assignee: International Business Machines CorporationInventors: Hien P. Dang, Vinod Kamath, Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha, Jung H. Yoon
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Publication number: 20090265028Abstract: A process for large scale production of a laminated organic substrate having reduced thermal warp.Type: ApplicationFiled: April 21, 2008Publication date: October 22, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Sri M. Sri-Jayantha, Arun Sharma, Vijayeshwar D. Khanna, Hien P. Dang, David J. Russell, Douglas O. Powell
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Patent number: 7559132Abstract: Embodiments of the present invention pertain to method for manufacturing a shock absorber that allows a disk drive to move with respect to the chassis of a computer system. In one embodiment, a flexure is formed that is capable of being coupled to an assembly joint. An assembly joint is formed so that the assembly joint is capable of being coupled to the flexure and the chassis of a computer system. A shock absorber is created by coupling the flexure to the assembly joint. The shock absorber has a form that can be used to flexibly couple the disk drive's enclosure with the computer system's chassis without requiring an increase in size of the chassis.Type: GrantFiled: November 5, 2004Date of Patent: July 14, 2009Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Sri M. Sri-Jayantha, Vijayeshwar D. Khanna, Gerard McVicker
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Publication number: 20090169886Abstract: Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.Type: ApplicationFiled: December 31, 2007Publication date: July 2, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth G. Hougham, Vijayeshwar D. Khanna, Xiao Hu Liu, Gerard McVicker
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Publication number: 20090114429Abstract: A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.Type: ApplicationFiled: November 6, 2007Publication date: May 7, 2009Applicant: International Business Machines CorporationInventors: Sri M. Sri-Jayantha, Hien P. Dang, Vijayeshwar D. Khanna, Arun Sharma
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Publication number: 20090085161Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: ApplicationFiled: February 13, 2008Publication date: April 2, 2009Applicant: International Business Machines CorporationInventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Patent number: 7477517Abstract: Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.Type: GrantFiled: January 29, 2007Date of Patent: January 13, 2009Assignee: International Business Machines CorporationInventors: Vijayeshwar D. Khanna, Alok K. Lohia, Gerard McVicker, Sri M. Sri-Jayantha
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Publication number: 20080313879Abstract: A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.Type: ApplicationFiled: June 22, 2007Publication date: December 25, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Virendra R. Jadhav, Vijayeshwar D. Khanna, David C. Long, David L. Questad
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Publication number: 20080226875Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: ApplicationFiled: April 8, 2008Publication date: September 18, 2008Applicant: International Business Machines CorporationInventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Publication number: 20080225488Abstract: Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.Type: ApplicationFiled: March 16, 2007Publication date: September 18, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
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Publication number: 20080218990Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: ApplicationFiled: April 8, 2008Publication date: September 11, 2008Applicant: International Business Machines CorporationInventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Publication number: 20080205024Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: ApplicationFiled: February 13, 2008Publication date: August 28, 2008Applicant: International Business Machines CorporationInventors: David Questad, Vijayeshwar D. Khanna, Jennifer V. Muney, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit
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Publication number: 20080205023Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.Type: ApplicationFiled: February 27, 2007Publication date: August 28, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar D. Khanna, Jennifer V. Muncy, Arun Sharma, Sri M. Sri-Jayantha, Lorenzo Valdevit, David Questad
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Publication number: 20080180914Abstract: Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.Type: ApplicationFiled: January 29, 2007Publication date: July 31, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Vijayeshwar D. Khanna, Alok K. Lohia, Gerard McVicker, Sri M. Sri-Jayantha
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Publication number: 20080159853Abstract: A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.Type: ApplicationFiled: January 3, 2007Publication date: July 3, 2008Applicant: International Business Machines CorporationInventors: Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha
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Publication number: 20080116571Abstract: A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottomType: ApplicationFiled: November 22, 2006Publication date: May 22, 2008Applicant: International Business Machines Corporation, Inc.Inventors: Hien P. Dang, Vinod Kamath, Vijayeshwar D. Khanna, Gerard McVicker, Sri M. Sri-Jayantha, Jung H. Yoon