Patents by Inventor Vikas Gupta

Vikas Gupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200078932
    Abstract: A method for robot interaction, preferably including: receiving a user input, determining a robot-associated response based on the user input, and presenting the robot-associated response. A system, preferably including: a robot, a conversation client, and a response module.
    Type: Application
    Filed: February 8, 2019
    Publication date: March 12, 2020
    Inventors: Leisen Huang, Chris Rettstatt, Vikas Gupta, Kevin Liang, Steven Levis, Anthony Fudd, Tim Reardon
  • Publication number: 20200083149
    Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Inventors: Vikas Gupta, Daniel Yong Lin
  • Patent number: 10581581
    Abstract: Techniques are described for managing QoS parameters of a bearer for which at least a portion of bearer data is served over a WLAN radio access technology. According to these techniques, a first device may identify a first set of one or more QoS parameters for serving a bearer over a wireless wide area network (WWAN). The first device may also determine a second set of one or more QoS parameters for serving the bearer over the WLAN based on an association between the first set of QoS parameters and the second set of one or more QoS parameters.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: March 3, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Gavin Bernard Horn, Abhijit S. Khobare, Ajay Gupta, Fang Chen, Vikas Jain
  • Publication number: 20200068400
    Abstract: The systems and methods described herein can include a digital assistant application that receives sensor signals from sensors installed in a vehicle and determines an entry event into the vehicle. The digital assistant application can receive, responsive to the entry event into the vehicle, a plurality authentication input signals from a plurality of sensors associated with the vehicle. The digital assistant application can determine a plurality of authentication states based on the plurality of authentication input signals and a plurality of authentication credentials. The digital assistant application can identify an access permission level of a plurality of access permission levels based at least in part on the plurality of identifies authentication states. The digital assistant application can identify, responsive to the access permission level, a subset of a set of functionalities available via the vehicle, and provide vehicular access to the subset of functionalities.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 27, 2020
    Inventors: Haris Ramic, Victor Chan, Vikas Gupta, Lingjun Li
  • Publication number: 20200047909
    Abstract: A fluid system includes a controller, a control valve, and a fluid manifold. At least one solenoid may be connected to the fluid manifold, the control valve, and/or the controller. A first pressure sensor may be in fluid communication with an output of the control valve. A second pressure sensor may be in fluid communication with the fluid manifold. The controller may be configured to control operation of the control valve via the at least one solenoid according to a first fluid pressure obtained via the first pressure sensor and according to a second fluid pressure obtained via the second pressure sensor.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Gilbert P. Freeth, Parag More, Robert L. Sbonek, Jaspal Rawat, Harshad P. Pawale, Chandrashekhar S. Nehete, Vikas Pandey, Balakrishnan Arumugam, Rajan Y. Tribhuvan, Bhupesh Jingar, Rohit Gupta
  • Patent number: 10559524
    Abstract: A packaged semiconductor device includes a leadframe (LF) having a plurality of laminate-supporting pedestals. A cured first die attach (DA) material is on an outer edge of the pedestals being an ultraviolet (UV)-curing DA material having a photoinitiator or a cured B-stage DA material. A cured thermally-curing DA material is on an area of the pedestals not occupied by the UV-curing DA material. A laminate component having bond pads on a top side is mounted top side up on the plurality of pedestals.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: February 11, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sadia Naseem, Vikas Gupta, Rongwei Zhang
  • Patent number: 10555246
    Abstract: Systems and methods are disclosed for sharing network feedback information. The method may include establishing, at a first access terminal, a wireless link with an access point, receiving network configuration data from the access point, composing a network feedback expression that indicates a status or availability of at least one network service associated with the access point, and transmitting the network feedback expression to a second access terminal via a D2D link.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: February 4, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Parthasarathy Krishnamoorthy, Prashanth Mohan, KrishnaKumar Vasanthasenan, Ammar Kitabi, Pavan Kaivaram, Praveen Kumar Appani, Jayesh Bathija, Eduardo Esteves, Vikas Gupta, Georgios Tsirtsis
  • Publication number: 20200030126
    Abstract: Thin-film mesh for medical devices and related methods are provided. The thin-film mesh may include slits to be expanded into pores, and the expanded thin-film mesh may be used as a cover for a stent device. The thin-film mesh has a tube-shape and the slits may be angled with respect to a longitudinal axis of the tube-shape thin-film mesh. The angled slits allow for the thin-film mesh to expand in multiple dimensions, including along the longitudinal axis and along the circumferential direction of the tube-shape thin-film mesh. The slits may be provided in diagonal rows arranged in longitudinal columns. Longitudinal columns of different types of slits may be arranged along the circumferential direction on the tube-shape thin-film mesh to form a zig-zag pattern of slits. The thin-film mesh may be formed from thin-film Nitinol (TFN) and may be fabricated via sputter deposition on a micropatterned wafer.
    Type: Application
    Filed: July 27, 2018
    Publication date: January 30, 2020
    Inventors: Colin Kealey, Vikas Gupta
  • Patent number: 10532821
    Abstract: A fluid system includes a controller, a control valve, and a fluid manifold. A first solenoid may be connected to the fluid manifold, the control valve, and/or the controller. A second solenoid may be connected to the fluid manifold, the control valve, and/or the controller. A first pressure sensor may be in fluid communication with an output of the control valve. A second pressure sensor may be in fluid communication with the fluid manifold. The controller may be configured to control operation of the control valve via the first solenoid and the second solenoid according to a first fluid pressure obtained via the first pressure sensor and according to a second fluid pressure obtained via the second pressure sensor.
    Type: Grant
    Filed: November 3, 2017
    Date of Patent: January 14, 2020
    Assignee: Eaton Intelligent Power Limited
    Inventors: Gilbert P. Freeth, Parag More, Robert Sbonek, Jaspal Rawat, Harshad P. Pawale, Chandrashekhar Nehete, Vikas Pandey, Balakrishnan Arumugam, Rajan Y. Tribhuvan, Bhupesh Jingar, Rohit Gupta
  • Publication number: 20200013634
    Abstract: The disclosed principles provide for implementing low-cost and fast metallic printing processes into the QFN and other no-leads package assembly flow to selectively print solderable material in areas that would otherwise be susceptible to corrosion and thus pose reliability risks. The problem of copper corrosion and poor BLR performance in no-leads packages because of remaining exposed copper areas after package singulation is solved by employing selective metallic printing processes in the assembly flow to coat all risk-prone areas with solder material. For example, for no-leads packages that are formed using printed leadframes, solder can be deposited through inkjet, screen, stencil, or photonic printing into the grooves which are formed after passivating the packages at the strip level. The singulating occurs through the grooves having solder printed therein, and results in wettable upper and sidewall surfaces of the outer ends of the leadframe for each package.
    Type: Application
    Filed: July 5, 2018
    Publication date: January 9, 2020
    Inventors: Sadia Naseem, Vikas Gupta
  • Publication number: 20200000612
    Abstract: A spiral-based thin-film mesh for medical devices and related methods is provided. The spiral-based thin-film mesh may be used as a stent cover for a stent device. The thin-film mesh may include a plurality of spirals. The spirals allow the thin-film mesh to expand omni-directionally. In one or more embodiments, the spirals may be logarithmic spirals, golden spirals, approximated golden spirals, box Phi spirals, or Fibonacci spirals. The thin-film mesh may be formed from thin-film Nitinol (TFN), and may be fabricated via sputter deposition on a micropattemed wafer.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 2, 2020
    Inventors: Colin Kealey, Vikas Gupta
  • Patent number: 10507123
    Abstract: A stent includes a first longitudinally extended cylinder having a C-shaped cross-section and a second longitudinally extended cylinder having a C-shaped cross-section. The first cylinder includes a plurality of first longitudinal struts and an array of first radial struts extending between the first longitudinal struts. The second cylinder includes a plurality of second longitudinal struts and an array of second radial struts extending between the second longitudinal struts. The first cylinder and the second cylinder are configured to form a dense mesh structure when assembled. When assembled, the second cylinder may be disposed in the first cylinder. The first cylinder may overlap with the second cylinder to form the dense mesh structure.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: December 17, 2019
    Assignee: MONARCH BIOSCIENCES, INC.
    Inventor: Vikas Gupta
  • Publication number: 20190375096
    Abstract: A method for toy robot programming, the toy robot including a set of sensors, the method including, at a user device remote from the toy robot: receiving sensor measurements from the toy robot during physical robot manipulation; in response to detecting a programming trigger event, automatically converting the sensor measurements into a series of puppeted programming inputs; and displaying graphical representations of the set of puppeted programming inputs on a programming interface application on the user device.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 12, 2019
    Inventors: Saurabh Gupta, Vikas Gupta
  • Publication number: 20190370617
    Abstract: Sketch completion using machine learning in a digital medium environment is described. Initially, a user sketches a digital image, e.g., using a stylus in a digital sketch application. A model trained using machine learning is leveraged to identify and describe visual characteristics of the user sketch. The visual characteristics describing the user sketch are compared to clusters of data generated by the model and that describe visual characteristics of a set of digital sketch images. Based on the comparison, digital sketch images having visual characteristics similar to the user sketch are identified from similar clusters. The similar images are returned for presentation as selectable suggestions for sketch completion of the sketched object.
    Type: Application
    Filed: June 4, 2018
    Publication date: December 5, 2019
    Applicant: Adobe Inc.
    Inventors: Piyush Singh, Vikas Kumar, Sourabh Gupta, Nandan Jha, Nishchey Arya, Rachit Gupta
  • Patent number: 10484483
    Abstract: In general, embodiments of the technology relate to a method for providing software functionalities to users of multi-tenant applications via inheritance. The method includes defining a functionality to be inheritable by a tenant application, in a master application, including selecting the functionality from a set of implemented functionalities, and defining a scope for the selected functionality, and publishing the master application. The method further includes, after publishing the master application, receiving a request to generate a tenant application. The request specifies the master application and the functionality to be inheritable by the tenant application. The method also includes generating the tenant application in response to the request. Further, the method includes publishing the tenant application, including the functionality, to a set of users; and receiving a request to access the published tenant application from a user of the first set of users.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: November 19, 2019
    Assignee: EMC IP Holding Company LLC
    Inventors: Gaurav Gupta, Mridul Mudgal, Vikas Ranganatha, Shalini Sharma, Manish Gurumoorthy
  • Publication number: 20190348746
    Abstract: A high frequency wireless device includes a three-dimensional (3D) antenna structure mounted on a PCB including a first antenna connected to a first waveguide feed and second antenna connected to a second waveguide feed. A packaged device on the PCB has a top metal surface including a transmit (Tx) radiating structure under the second waveguide feed and a receive (Rx) radiating structure under the first waveguide feed, and an RF connection from the top metal surface to its bottom surface. An IC die is flipchip attached to the bottom surface including at least one Rx channel and at least one Tx channel connected by the RF connection to the Rx and Tx radiating structures. Protruding metal features are on the dielectric layer under the first and second waveguide feeds on ?2 sides of the Tx and the Rx radiating structure to create a waveguiding wall structure for directing signals.
    Type: Application
    Filed: October 4, 2018
    Publication date: November 14, 2019
    Inventors: VIKAS GUPTA, MEYSAM MOALLEM, SADIA NASEEM
  • Patent number: 10475729
    Abstract: A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame. A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the lead frame and with a reflow wall that surrounds a portion of the solder joint that couples the semiconductor device to the lead frame. A packaged semiconductor device with a reflow wall that surrounds a portion of a solder joint that couples a semiconductor device to a lead frame.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: November 12, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Vikas Gupta, Daniel Yong Lin
  • Patent number: 10469575
    Abstract: Techniques for contact exploring are described. An apparatus may comprise a web component and a data retrieval component. The web component may be operative to receive a remote command from a web server, and to transmit a plurality of contacts to the web serve. The data retrieval component operative to retrieve the plurality of contacts from a contacts storage on the device in response to the received remote command. Other embodiments are described.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: November 5, 2019
    Assignee: FACEBOOK, INC.
    Inventors: Vikas Gupta, Lior Tal
  • Patent number: 10467370
    Abstract: Disclosed are methods, systems, and articles of manufacture for implementing a schematic circuit design component as a transmission line model in a schematic driven extracted view for an electronic design. These techniques identify a schematic circuit component design form a schematic design of an electronic design and identify or determine layout device information of a layout circuit component design corresponding to the schematic circuit component design. An extracted view may be generated or identified for the electronic design at least by using a transmission line model based in part or in whole upon connectivity information or a hierarchical structure of the electronic design. The electronic design may then be modified or updated based in part or in whole upon results of performing one or more analyses on the extracted view with the transmission line model.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: November 5, 2019
    Assignee: Cadence Design Systems, Inc.
    Inventors: Taranjit Singh Kukal, Arnold Jean Marie Gustave Ginetti, Preeti Chauhan, Nikhil Gupta, Vikas Aggarwal, Vikrant Khanna
  • Publication number: 20190304881
    Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 3, 2019
    Inventors: Rongwei Zhang, Vikas Gupta