Abstract: Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.

Abstract: A system and method for facilitating safe use of a medical device is provided. In one aspect, a method includes receiving an indication that a user has entered a set of parameters into a medical device to provide a medical treatment to a patient, receiving a history of previous medical treatment provided to the patient using the medical device, generating one or more alternative parameters for providing the medical treatment to the patient based on the set of parameters and the received history of previous medical treatment, causing, based on the generating of the one or more alternative parameters, a locking of the medical device to restrict operation of the medical device until an override of the lock is received, providing a notification for display to the user regarding the alternative parameters.

Abstract: Thin-film mesh for medical devices and related methods are provided. The thin-film mesh may include slits to be expanded into pores, and the expanded thin-film mesh may be used as a cover for a stent device. The thin-film mesh has a tube-shape and the slits may be angled with respect to a longitudinal axis of the tube-shape thin-film mesh. The angled slits allow for the thin-film mesh to expand in multiple dimensions, including along the longitudinal axis and along the circumferential direction of the tube-shape thin-film mesh. The slits may be provided in diagonal rows arranged in longitudinal columns. Longitudinal columns of different types of slits may be arranged along the circumferential direction on the tube-shape thin-film mesh to form a zig-zag pattern of slits. The thin-film mesh may be formed from thin-film Nitinol (TFN) and may be fabricated via sputter deposition on a micropatterned wafer.

Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for deriving platform feedback data from raw feedback data for dynamic retrieval by downstream subsystems. For example, a method may include detecting a return notification trigger of a user, identifying segment data, determining a return notification form identifier based on the segment data, loading an electronic return notification form corresponding to the return notification form identifier, receiving raw feedback data from the user device, deriving platform feedback data from the raw feedback data using a plurality of mappings stored in one or more electronic mapping databases, and storing the platform feedback data in at least one of a feedback service component and a return notification service component, in one or more formats configured for retrieval by one or more downstream subsystems associated with managing and/or analyzing the one or more wearable items.

Abstract: Methods and devices are provided for the use of thin-film cuffs on endovascular grafts. A method includes forming a fenestrated thin-film Nitinol sheet, expanding the fenestrated thin-film Nitinol sheet to expand the fenestrations, and attaching the expanded thin-film Nitinol sheet to a longitudinal end of a cover for an endovascular graft to form a cuff for the endovascular graft. The method may further include implanting the endovascular graft into a blood vessel. An endovascular graft may include a cover having a proximal and distal end, a proximal thin-film mesh cuff extending from the proximal end, and a distal thin-film mesh cuff extending form the distal end.

Abstract: Systems for use with a medical device for reducing medication errors are provided. In one aspect, a system includes a medical device that is configurable with operating limit parameters for providing medication to a patient, and a limiting system. The limiting system includes a memory that includes patient-specific information for the patient and a database includes acceptable operating parameters for providing the medication to the patient using the medical device, and a processor. The processor is configured to compare the acceptable operating parameters with the patient-specific information, and provide a modification of the operating limit parameters for providing the medication to the patient based on the comparison of the acceptable operating parameters with the patient-specific information. Methods and machine-readable media are also provided.

Abstract: A method, system, and computer-readable medium is described for facilitating interactions between software programs by providing a reliable data queuing service that enables the programs to store and retrieve elements of data queues. In some situations, the data queuing service is provided to users who purchase usage of the data queuing service for application programs executed by or otherwise affiliated with the users. In addition, accessibility of the data queuing service to remote executing programs may be enhanced via a defined API of the data queuing service, such as a Web services-based API. Availability of the data queuing service may also be enhanced in some situations by using multiple alternative distributed systems for a data queue such that each of the alternative systems stores a subset of the elements of the data queue.

Abstract: The disclosed principles provide for implementing low-cost and fast metallic printing processes into the QFN and other no-leads package assembly flow to selectively print solderable material in areas that would otherwise be susceptible to corrosion and thus pose reliability risks. The problem of copper corrosion and poor BLR performance in no-leads packages because of remaining exposed copper areas after package singulation is solved by employing selective metallic printing processes in the assembly flow to coat all risk-prone areas with solder material. For example, for no-leads packages that are formed using printed leadframes, solder can be deposited through inkjet, screen, stencil, or photonic printing into the grooves which are formed after passivating the packages at the strip level. The singulating occurs through the grooves having solder printed therein, and results in wettable upper and sidewall surfaces of the outer ends of the leadframe for each package.

Abstract: An antenna-in-package (AiP) device includes a substrate stack having a ceramic substrate attached to an organic substrate, where a dielectric constant of the ceramic substrate is higher than a dielectric constant of the organic substrate. An antenna is on a top side of the ceramic substrate. An integrated circuit (IC) die is flip chip attached to a bottom side of the ceramic substrate or to a top surface of the organic substrate. The IC die includes a radio circuit including at least a transmitter, and there is at least one interconnect for coupling the radio circuit to the antenna.

Abstract: A three-dimensional (3D) imaging system includes a mobile device that has a display screen configured to display a series of patterns onto an object that is to be imaged. The mobile device also includes a front-facing camera configured to capture reflections of the series of patterns off of the object. The system also includes a controller that is configured to control a timing of the series of patterns that appear on the display screen and activation of the front-facing camera in relation to the appearance of the series of patterns.

Abstract: The systems and methods described herein can include a digital assistant application that receives sensor signals from sensors installed in a vehicle and determines an entry event into the vehicle. The digital assistant application can receive, responsive to the entry event into the vehicle, a plurality authentication input signals from a plurality of sensors associated with the vehicle. The digital assistant application can determine a plurality of authentication states based on the plurality of authentication input signals and a plurality of authentication credentials. The digital assistant application can identify an access permission level of a plurality of access permission levels based at least in part on the plurality of identifies authentication states. The digital assistant application can identify, responsive to the access permission level, a subset of a set of functionalities available via the vehicle, and provide vehicular access to the subset of functionalities.

Abstract: An intrasaccular flow diverter includes a wire structure (e.g., a braided wire or a laser-cut hypotube), a thin-film mesh placed over the wire structure, and crimps fixing the thin-film mesh to the wire structure at each crimp. The wire structure and the thin-film mesh between adjacent crimps are expanded radially to form thin-film covered spheroid structures. When deployed in an aneurysm, the spheroid structures may volumetrically fill the aneurysm sac. An intrasaccular flow diverter with an umbrella structure includes a wire structure with a plurality of crimps along the wire structure, and a thin-film covered umbrella structure at one end of the wire structure. The wire structure between adjacent crimps is expanded radially to form a spheroid structure. When deployed in an aneurysm, the thin-film covered umbrella structure may cover the aneurysm neck.

Abstract: Described examples include a sensor device having at least one conductive elongated first pillar positioned on a central pad of a first conductor layer over a semiconductor substrate, the first pillar extending in a first direction normal to a plane of a surface of the first conductor layer. Conductive elongated second pillars are positioned in normal orientation on a second conductor layer over the semiconductor substrate, the conductive elongated second pillars at locations coincident to via openings in the first conductor layer. The second conductor layer is parallel to and spaced from the first conductor layer by at least an insulator layer, the conductive elongated second pillars extending in the first direction through a respective one of the via openings. The at least one conductive elongated first pillar is spaced from surrounding conductive elongated second pillars by gaps.

Abstract: An antenna-in-package (AiP) device includes a substrate stack having a ceramic substrate attached to an organic substrate, where a dielectric constant of the ceramic substrate is higher than a dielectric constant of the organic substrate. An antenna is on a top side of the ceramic substrate. An integrated circuit (IC) die is flip chip attached to a bottom side of the ceramic substrate or to a top surface of the organic substrate. The IC die includes a radio circuit including at least a transmitter, and there is at least one interconnect for coupling the radio circuit to the antenna.

Abstract: Methods for facilitating safe use of a medical item are provided. In one aspect, a method includes receiving a first identifier for a medical entity located in an institution. The medical entity includes at least one of a patient, medical device, medical location, or medical item. The method also includes receiving a second identifier for a first course of action associated with the medical entity. The method further includes generating, based on a history of the medical entity and the first course of action associated with the medical entity, a second course of action for the medical entity, and providing a notification to a device indicating the second course of action. Systems and machine-readable media are also provided.

Abstract: Embodiments of a method and system for sharing toy robot programs enabling toy robots to interact with physical surroundings can include receiving a robot program; automatically processing a token for the robot program; and processing a program request for the robot program based on the token. The embodiments can additionally or alternatively include controlling a toy robot based on a robot program; recommending a robot program; publishing a robot program; processing modifications of robot programs S160; and/or any other suitable functionality.

Abstract: A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.

Abstract: Disclosed are methods, systems, and non-transitory computer-readable medium for deriving platform feedback data from raw feedback data for dynamic retrieval by downstream subsystems. For example, a method may include detecting a return notification trigger of a user, identifying segment data, determining a return notification form identifier based on the segment data, loading an electronic return notification form corresponding to the return notification form identifier, receiving raw feedback data from the user device, deriving platform feedback data from the raw feedback data using a plurality of mappings stored in one or more electronic mapping databases, and storing the platform feedback data in at least one of a feedback service component and a return notification service component, in one or more formats configured for retrieval by one or more downstream subsystems associated with managing and/or analyzing the one or more wearable items.

Abstract: The systems and methods described herein can include a digital assistant application that receives sensor signals from sensors installed in a vehicle and determines an entry event into the vehicle. The digital assistant application can receive, responsive to the entry event into the vehicle, a plurality authentication input signals from a plurality of sensors associated with the vehicle. The digital assistant application can determine a plurality of authentication states based on the plurality of authentication input signals and a plurality of authentication credentials. The digital assistant application can identify an access permission level of a plurality of access permission levels based at least in part on the plurality of identifies authentication states. The digital assistant application can identify, responsive to the access permission level, a subset of a set of functionalities available via the vehicle, and provide vehicular access to the subset of functionalities.

Abstract: A device includes a multilayer substrate having a first surface and a second surface opposite the first surface. An integrated circuit is mounted on the second surface of the multilayer substrate, the integrated circuit having transmission circuitry configured to process millimeter wave signals. A substrate waveguide having a substantially solid wall is formed within a portion of the multilayer substrate perpendicular to the first surface. The substrate waveguide has a first end with the wall having an edge exposed on the first surface of the multilayer substrate. A reflector is located in one of the layers of the substrate and is coupled to an edge of the wall on an opposite end of the substrate waveguide.