Abstract: The present invention relates to A MEMS sensor with movable and fixed components for measuring linear acceleration. The MEMS sensor includes at least two mutually independent differential sensor elements disposed inside a common frame structure providing walls for hermetic sealing of the MEMS sensor. The mutually independent differential sensor elements are pairwise configured to perform double differential detection of linear acceleration. The MEMS sensor includes a common anchoring area to which the at least two differential sensor elements are anchored. The common anchoring area is located at the centroid of the pairwise configured differential sensor elements. A self-test capability of the MEMS sensor is also provided.

Abstract: The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.

Abstract: A microelectromechanical structure, comprises a first element that includes a first element surface, and a second element that includes a second element surface, and an element gap between the first element surface and the second element surface. At least one of the first element and the second element is mobile. One of the first and second element surfaces includes a convex contact surface and the other one of the first and second element surfaces includes a concave contact surface.

Abstract: A MEMS structure comprises an anchor, a spring, and a seismic mass that is suspended to the anchor via the spring to pivot around an axis of rotation. Errors from unwanted vibration modes are reduced by including in the MEMS structure a spring structure that extends from the seismic mass to the anchor. Said spring structure comprises a side arm that is connected to the seismic mass or the anchor. At least part of the spring structure is formed by a side arm that extends in the spring structure in a direction parallel to the axis of rotation of the seismic mass; and is attached to one end of the spring.

Abstract: A microelectromechanical sensor device that comprises a seismic mass, and a spring structure that defines for the seismic mass a drive direction, and a sense direction that is perpendicular to the drive direction. A capacitive transducer structure includes a stator to be anchored to a static support structure, and a rotor mechanically connected to the seismic mass. The capacitive transducer structure is arranged into a slanted orientation where a non-zero angle is formed between the drive direction and a tangent of the stator surface. The slated capacitive transducer structure creates an electrostatic force to decrease quadrature error of the linear oscillation.

Abstract: The MEMS sensor of the invention has movable and fixed components for measuring acceleration in a rotational mode in a direction in-plane perpendicular to spring axis. The components include an element frame, a substrate, a proof-mass a spring connected to the proof-mass and to the substrate, and comb electrodes. The MEMS sensor is mainly characterized by an arrangement of the components causing an inherent sensitivity for measuring accelerations in a range covering longitudinal and transversal accelerations. One or more of the components are tilted compared to the element frame. The semiconductor package of the invention comprises at least one MEMS sensor.

Abstract: A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated.

Abstract: A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated.

Abstract: The invention relates to a capacitive micromechanical sensor structure comprising a stator structure rigidly anchored to a substrate and a rotor structure movably anchored by means of spring structures to the substrate. The stator structure has a plurality of stator finger support beams and the rotor structure has a plurality of rotor finger support beams. Stator fingers along the stator finger support beam of the stator structure extend into rotor gaps along the rotor finger support beam of the rotor structure, and rotor fingers along the rotor finger support beam of the rotor structure extend into stator gaps along the stator finger support beam of the stator structure.

Abstract: A robust microelectromechanical structure that is less prone to internal or external electrical disturbances. The structure includes a mobile element with a rotor suspended to a support, a first frame anchored to the support and circumscribing the mobile element, and a second frame anchored to the support and circumscribing the mobile element between the mobile element and the first frame, electrically isolated from the first frame. The rotor and the second frame are galvanically coupled to have a same electric potential.

Abstract: A microelectromechanical structure, comprises a first element that includes a first element surface, and a second element that includes a second element surface, and an element gap between the first element surface and the second element surface. At least one of the first element and the second element is mobile. One of the first and second element surfaces includes a convex contact surface and the other one of the first and second element surfaces includes a concave contact surface.

Abstract: The invention relates to a capacitive micromechanical acceleration sensor comprising a first sensor, a second sensor, and a third sensor. The first sensor comprises a rotor electrode and stator electrode. The sensor comprises a first beam that is connected to a rotor electrode support structure and that is connected to the rotor electrode. The sensor comprises a second beam that is connected to the rotor electrode support structure and that is connected to the rotor electrode. The second sensor is situated in a first space circumscribed by the first beam, the first sensor, and the rotor electrode support structure. The third sensor is situated in a second space circumscribed by the second beam, the first sensor, and the rotor electrode support structure.