Abstract: A printhead integrated circuit comprises a substrate having drive circuitry and a plurality of nozzle assemblies positioned on the substrate. Each nozzle assembly has a moving portion moveable relative to a stationary portion for ejection of ink. The printhead integrated circuit is covered with a polymeric layer. The polymeric layer covers a gap defined between each moving portion and each stationary portion.

Abstract: A method of actuating a thermal bend actuator having an active beam fused to a passive beam. The method comprises passing an electrical current through the active beam so as to cause thermoelastic expansion of the active beam relative to the passive beam and bending of the actuator. The current is delivered in an actuation pulse having a pulse width of less than 0.2 microseconds.

Abstract: A thermal bend actuator comprising: (a) a pair of electrical contacts positioned at one end of the actuator; (b) an active beam connected to the electrical contacts and extending longitudinally away from the contacts, the active beam defining a bent current flow path between the contacts; and (c) a passive beam fused to the active beam. When a current is passed through the active beam, the active beam heats and expands relative to the passive beam, resulting in bending of the actuator. The active beam comprises a resistive heating bar having a relatively smaller cross-sectional area than any other part of the current flow path. Heating of the active beam is concentrated in the heating bar.

Abstract: A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.

Abstract: An inkjet printhead comprising a plurality of nozzle assemblies is provided. Each nozzle assembly has a moving portion for ejection of ink. The printhead includes a seal membrane joining the moving portions to the printhead.

Abstract: A method of fabricating a printhead having a hydrophobic ink ejection face is provided. The method comprises the steps of: (a) providing a partially-fabricated printhead comprising a plurality of nozzle chambers and a relatively hydrophilic nozzle surface, the nozzle surface at least partially defining the ink ejection face; (b) depositing a layer of relatively hydrophobic polymeric material onto the nozzle surface, the polymeric material being resistant to removal by ashing; and (c) defining a plurality of nozzle openings in the nozzle surface, thereby providing a printhead having a relatively hydrophobic ink ejection face. Steps (b) and (c) may be performed in any order.

Abstract: A nozzle assembly for an inkjet printhead is provided. The nozzle assembly comprises a nozzle chamber having a roof, the roof having a moving portion moveable relative to a static portion and a nozzle opening defined in the roof, such that movement of the moving portion relative to the static portion causes ejection of ink through the nozzle opening. The nozzle assembly also comprises an actuator for moving the moving portion relative to the static portion, and a mechanical seal interconnecting the moving portion and the static portion. The mechanical seal comprises a polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins.

Abstract: A printhead having a hydrophobic ink ejection face is provided. At least part of the ink ejection face is coated with a hydrophobic polymeric material selected from the group comprising: polymerized siloxanes and fluorinated polyolefins.

Abstract: An inkjet printhead comprising a plurality of nozzle assemblies is provided. Each nozzle assembly has a moving portion for ejection of ink. The printhead includes a seal membrane joining the moving portions to the printhead.

Abstract: A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.

Abstract: A thermal bend actuator, having a plurality of elements, is provided. The actuator comprises a first active element for connection to drive circuitry a second passive element mechanically cooperating with the first element. When a current is passed through the first element, the first element expands relative to the second element, resulting in bending of the actuator. The second element is comprised of a material having negative thermal expansion.

Abstract: A thermal bend actuator, having a plurality of elements, is provided. The actuator comprises a first active element for connection to drive circuitry a second passive element mechanically cooperating with the first element. When a current is passed through the first element, the first element expands relative to the second element, resulting in bending of the actuator. The first element is comprised of an aluminium alloy.

Abstract: A thermal bend actuator, having a plurality of elements, is provided. The actuator comprises a first active element for connection to drive circuitry and a second passive element mechanically cooperating with the first element. When a current is passed through the first element, the first element expands relative to the second element, resulting in bending of the actuator. One of the plurality of elements is comprised of a porous material.