Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: An interface circuit having a first signal path and a second signal path is disclosed. The first and second signal paths are coupled between a first and second nodes, wherein the first node is coupled to receive signals from a source external to an integrated circuit upon which the interface circuit is implemented. Each of the first and second signal paths include circuitry implemented with transistors rated at higher voltages than internal circuitry coupled to receive signals therefrom. The first and second signal paths may utilize different circuit topologies. The interface may thus be used in environments where external circuitry coupled to the external input node conforms to one of a number of different standards (e.g., LPDDR1 and LPDDR2).

Abstract: In an embodiment, an integrated circuit comprises core circuitry and at least one driver circuit. The core circuitry is powered by a first supply voltage during use, and comprises a control circuit configured to generate a pull up control signal, a pull down control signal, and at least one reference voltage. The driver circuit is powered by a second supply voltage during use, the second supply voltage having a greater magnitude than the first supply voltage. The driver circuit is connected to a pad to be connected to a pin on a package of the integrated circuit. The driver circuit comprises a cascode connection of a first transistor and a second transistor, and a capacitor coupled between a first gate terminal of the first transistor and a second gate terminal of the second transistor. The first gate terminal is coupled to receive the pull down control signal.

Abstract: In one embodiment, an integrated circuit includes a self calibration unit configured to iterate a test on a logic circuit in the integrated circuit at respectively lower supply voltage magnitudes until the test fails. A lowest supply voltage magnitude at which the test passes is used to generate a requested supply voltage magnitude for the integrated circuit. In an embodiment, an integrated circuit includes a series connection of logic gates physically distributed over an area of the integrated circuit, and a measurement unit configured to launch a logical transition into the series and detect a corresponding transition at the output of the series. The amount of time between the launch and the detection is used to request a supply voltage magnitude for the integrated circuit.

Abstract: In an embodiment, an integrated circuit comprises a plurality of temperature sensors and a power manager coupled thereto. The temperature sensors are physically distributed over an area of the integrated circuit that is occupied by logic circuitry implementing the operations for which the integrated circuit is designed. The power manager is configured to transmit a power supply voltage request to an external power supply module, the power supply voltage request indicating a requested magnitude of the power supply voltage for the integrated circuit. The power manager is configured to modify the requested magnitude responsive to indications from each of the plurality of temperatures sensors that represent a temperature of the integrated circuit sensed by each of the plurality of temperature sensors.

Abstract: In one embodiment, a receiver circuit is provide that may receive either a differential input or a single-ended input corresponding to an interface. The receiver circuit may include at least two current sources to control a gain of an amplification stage in the receiver. If the receiver circuit is receiving a differential input, one of the current sources may be used. If the receiver circuit is receiving a single-ended input, both of the current sources may be used. A larger gain may thus be provided for the single-ended input as compared to the differential input.

Abstract: A delay locked loop (DLL) includes a delay line configured to provide a delayed version of a reference clock as a feedback clock. The DLL also includes a phase detector that may provide an output signal that is indicative of a change in a delay associated with the delay line. The DLL may also include a step size controller that may provide a step size indication corresponding to a first step size in response to detecting the output signal indicating a first change in delay, and to provide a step size indications corresponding to a second step size that is smaller than the first step size in response to detecting the output signal indicating a second change in delay.

Abstract: Modular delay line blocks include a plurality of delay elements, each including a delay unit, an input, an output, a next element output, and an element return path. The delay elements are coupled together in a chain between a block input and a block output. The block input is coupled to the input of a first element in the chain and the block output is coupled to the output of the first element. In addition, the next element output of the first element is coupled to the element input of a next element in the chain, and the element output of the next delay element is coupled to the element return path of a previous element in the chain. In response to a selection control signal, each element may selectively route a signal from the element input to one of the next element output or to the element output.

Abstract: In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ICs (in non-flip chip orientation), and package-on-package packaging of the application IC and the other ICs. The package substrate may include a first set of pads proximate to the application IC to support chip-on-chip connection to the other ICs. The pads may be connected to conductors that extend underneath the application IC, to connect to the application IC. A second set of pads may be connected to package pins for package-on-package solutions. If the chip-on-chip solution proves reliable, support for the package-on-package solution may be eliminated and the package substrate may be reduced in size.

Abstract: In one embodiment, an integrated circuit comprises at least one measurement unit configured to generate an output indicative of a supply voltage at which the integrated circuit is operable for a given operating frequency and a control unit coupled to receive the output. The control unit is configured to generate a voltage control output indicative of a requested supply voltage for the integrated circuit responsive to the output. The voltage control output may be output from the integrated circuit for use by circuitry external to the integrated circuit in generating the supply voltage for the integrated circuit.

Abstract: A memory circuit is disclosed that comprises a plurality of memory cells coupled to a virtual voltage rail. The plurality of memory cells may form, for example, a sub-array of an SRAM array. A switching circuit may be coupled between the virtual voltage rail and a voltage supply node, and a comparator may be coupled to compare a voltage level present on the virtual voltage rail to a reference voltage to thereby provide an output signal based on the comparison. The switching circuit may be configured to electrically couple the virtual voltage rail to the voltage supply node depending upon the output signal. In some embodiments, the switching circuit may be implemented using either a PMOS transistor or an NMOS transistor, although other embodiments may employ other switching circuits.

Abstract: In one embodiment, an integrated circuit includes a self calibration unit configured to iterate a test on a logic circuit in the integrated circuit at respectively lower supply voltage magnitudes until the test fails. A lowest supply voltage magnitude at which the test passes is used to generate a requested supply voltage magnitude for the integrated circuit. In an embodiment, an integrated circuit includes a series connection of logic gates physically distributed over an area of the integrated circuit, and a measurement unit configured to launch a logical transition into the series and detect a corresponding transition at the output of the series. The amount of time between the launch and the detection is used to request a supply voltage magnitude for the integrated circuit.

Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ICs (in non-flip chip orientation), and package-on-package packaging of the application IC and the other ICs. The package substrate may include a first set of pads proximate to the application IC to support chip-on-chip connection to the other ICs. The pads may be connected to conductors that extend underneath the application IC, to connect to the application IC. A second set of pads may be connected to package pins for package-on-package solutions. If the chip-on-chip solution proves reliable, support for the package-on-package solution may be eliminated and the package substrate may be reduced in size.

Abstract: In an embodiment, an integrated circuit comprises core circuitry and at least one driver circuit. The core circuitry is powered by a first supply voltage during use, and comprises a control circuit configured to generate a pull up control signal, a pull down control signal, and at least one reference voltage. The driver circuit is powered by a second supply voltage during use, the second supply voltage having a greater magnitude than the first supply voltage. The driver circuit is connected to a pad to be connected to a pin on a package of the integrated circuit. The driver circuit comprises a cascode connection of a first transistor and a second transistor, and a capacitor coupled between a first gate terminal of the first transistor and a second gate terminal of the second transistor. The first gate terminal is coupled to receive the pull down control signal.

Abstract: In one embodiment, a level shifter circuit may include a shift stage that also embeds transistors that implement a logic operation on two or more inputs to the level shifter. At least one of the inputs may be sourced from circuitry that is powered by a different power supply than the level shifter and circuitry that receives the level shifter output. Additionally, the level shifter includes one or more dummy transistors that match transistors the perform the logic operation, to improve symmetry of the level shifter circuit. In some embodiments, certain design and layout rules may be applied to the level shifter circuit to limit variation in the symmetry over various manufacturing variations.

Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: In an embodiment, an integrated circuit comprises core circuitry and at least one driver circuit. The core circuitry is powered by a first supply voltage during use, and comprises a control circuit configured to generate a pull up control signal, a pull down control signal, and at least one reference voltage. The driver circuit is powered by a second supply voltage during use, the second supply voltage having a greater magnitude than the first supply voltage. The driver circuit is connected to a pad to be connected to a pin on a package of the integrated circuit. The driver circuit comprises a cascode connection of a first transistor and a second transistor, and a capacitor coupled between a first gate terminal of the first transistor and a second gate terminal of the second transistor. The first gate terminal is coupled to receive the pull down control signal.

Abstract: In one embodiment, a receiver circuit is provide that may receive either a differential input or a single-ended input corresponding to an interface. The receiver circuit may include at least two current sources to control a gain of an amplification stage in the receiver. If the receiver circuit is receiving a differential input, one of the current sources may be used. If the receiver circuit is receiving a single-ended input, both of the current sources may be used. A larger gain may thus be provided for the single-ended input as compared to the differential input.

Abstract: In an embodiment, an integrated circuit may include one or more power managed blocks and a power manager circuit. The power manager circuit may be configured to generate a block enable for each power managed block and a block enable clock. The power managed block may generate local block enables to various power switches in the power managed block, staggering the block enables over two or more block enable clock cycles. In particular, the power managed block may include a set of series-connected flops that receive the block enable from the power manager circuit. The output of each flop may be coupled to a respective set of power switches and may enabled those switches. The change in current flow due to enabling and/or disabling the power managed block may thus be controlled. In an embodiment, the frequency of the block enable clock may be set to a defined value independent of process, voltage, and temperature conditions in the integrated circuit.