Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Embodiments of the present invention relate to determining process variations using device threshold sensitivities. A computing device determines first and second threshold voltages for first and second transistors, respectively, wherein the first and second transistors are included in an integrated circuit and are n-channel and p-channel field effect transistors, respectively. The computing device also determines process parameters that are associated with the integrated circuit using a combination of determined first and second threshold voltages, wherein the process parameter reflects random sensitivities, timing delay differences, timing delay and slew rate changes, and/or variations between low, high, and regular threshold voltages which are associated with the first and second transistors.

Abstract: A method includes forming a mixed integer linear problem (MILP) capturing at least a plurality of timing windows over which aggressor net(s), electromagnetically coupled to a victim net in a circuit, produce computed cross-talk noise pulses potentially contributing to a maximum noise for the victim net. The MILP is solved to determine the maximum noise at the victim net. Responsive to the maximum noise meeting one or more criteria, at least an indication of the victim net is output. Forming may include forming a linear problem using overlapping timing windows for which noise pulses contribute to the maximum noise and converting the linear problem to the mixed integer linear problem by introducing into the linear problem binary variables that determine whether individual ones of overlapping or non-overlapping noise pulses from the one or more aggressor nets contribute to the maximum noise. Apparatus and program products are also disclosed.

Abstract: A method includes forming a mixed integer linear problem (MILP) capturing at least a plurality of timing windows over which aggressor net(s), electromagnetically coupled to a victim net in a circuit, produce computed cross-talk noise pulses potentially contributing to a maximum noise for the victim net. The MILP is solved to determine the maximum noise at the victim net. Responsive to the maximum noise meeting one or more criteria, at least an indication of the victim net is output. Forming may include forming a linear problem using overlapping timing windows for which noise pulses contribute to the maximum noise and converting the linear problem to the mixed integer linear problem by introducing into the linear problem binary variables that determine whether individual ones of overlapping or non-overlapping noise pulses from the one or more aggressor nets contribute to the maximum noise. Apparatus and program products are also disclosed.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: A method and a system for timing analysis of a VLSI circuit or chip design considering manufacturing and environmental variations, where the design includes multiple instances of a gate or macro instantiated at more than one voltage domain by sharing and re-using abstracts. The timing analysis of the chip includes a macro abstract instantiated in a voltage domain different from the domain during abstract generation. Timing models are re-used across chip voltage domains or across chip designs. Moreover, a statistical timing analysis of a chip design takes into consideration the voltage domains wherein at least one timing abstract model generation time voltage domain condition differs from the macro instantiation domain in the chip. The invention further provides sharing and re-using the statistical timing models or abstracts.

Abstract: Systems and methods for avoiding restrictions on cell placement in a hierarchical design of integrated circuits with multi-patterning requirements are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to assign a color to each pattern shape in a first cell, assign a color to each pattern shape in a second cell, characterize quantities of interest for each pattern shape in the first cell, determine that the colors assigned in the first cell are all one to one mappable to the colors assigned in the second cells, characterize quantities of interest for each pattern shape in the second cell using the quantities of interest characterized for the first cell, and model the quantities of interest for the first cell and the second cell.

Abstract: Systems and methods for accommodating correlated parameters in SSTA are provided. The method includes determining a correlation between at least two parameters. The method further includes calculating a new parameter or a new parameter set based on the correlation between the at least two parameters. The method further includes performing the SSTA such that the new parameter or the new parameter set is propagated into the SSTA. The method further includes projecting slack using the correlation between the at least two parameters and using a processor.

Abstract: Systems and methods for performing static timing analysis during IC design. A method is provided that includes obtaining canonical input data. The method further includes calculating at least one input condition identifier based on the canonical input data. The method further includes comparing the at least one input condition identifier to a table of values. The method further includes that when a match exists between the at least one input condition identifier and at least one value within the table of values, retrieving previously calculated timing data associated with the at least one value, and applying the previously calculated timing data in a timing model for a design under timing analysis.

Abstract: Systems and methods for avoiding restrictions on cell placement in a hierarchical design of integrated circuits with multi-patterning requirements are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to assign a color to each pattern shape in a first cell, assign a color to each pattern shape in a second cell, characterize quantities of interest for each pattern shape in the first cell, determine that the colors assigned in the first cell are all one to one mappable to the colors assigned in the second cells, characterize quantities of interest for each pattern shape in the second cell using the quantities of interest characterized for the first cell, and model the quantities of interest for the first cell and the second cell.

Abstract: Systems and methods for performing static timing analysis during IC design. A method is provided that includes obtaining canonical input data. The method further includes calculating at least one input condition identifier based on the canonical input data. The method further includes comparing the at least one input condition identifier to a table of values. The method further includes that when a match exists between the at least one input condition identifier and at least one value within the table of values, retrieving previously calculated timing data associated with the at least one value, and applying the previously calculated timing data in a timing model for a design under timing analysis.

Abstract: Systems and methods for accommodating correlated parameters in SSTA are provided. The method includes determining a correlation between at least two parameters. The method further includes calculating a new parameter or a new parameter set based on the correlation between the at least two parameters. The method further includes performing the SSTA such that the new parameter or the new parameter set is propagated into the SSTA. The method further includes projecting slack using the correlation between the at least two parameters and using a processor.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Techniques for improving parametric chip yield of manufactured chips are provided. In one aspect, a method for optimizing parametric chip yield is provided. The method includes the following steps. Parametric chip yield is computed based on performance and power consumption of a plurality of manufactured chips subject to a given voltage binning scheme. It is then determined whether the parametric chip yield computed is optimal. If the parametric chip yield is not optimal, the voltage binning scheme is altered and the compute and determine steps are repeated. Otherwise the binning scheme is left unaltered.

Abstract: Systems and methods are provided for extracting parasitics in a design of an integrated circuit with multi-patterning requirements. The method includes determining resistance solutions and capacitance solutions. The method further includes performing parasitic extraction of the resistance solutions and the capacitance solutions to generate mean values for the resistance solutions and the capacitance solutions. The method further includes capturing a multi-patterning source of variation for each of the resistance solutions and the capacitance solutions during the parasitic extraction. The method further includes determining a sensitivity for each captured source of variation to a respective vector of parameters. The method further includes determining statistical parasitics by multiplying each of the resistance solutions and the capacitance solutions by the determined sensitivity for each respective captured source of variation.

Abstract: Systems and methods are provided for extracting parasitics in a design of an integrated circuit with multi-patterning requirements. The method includes determining resistance solutions and capacitance solutions. The method further includes performing parasitic extraction of the resistance solutions and the capacitance solutions to generate mean values for the resistance solutions and the capacitance solutions. The method further includes capturing a multi-patterning source of variation for each of the resistance solutions and the capacitance solutions during the parasitic extraction. The method further includes determining a sensitivity for each captured source of variation to a respective vector of parameters. The method further includes determining statistical parasitics by multiplying each of the resistance solutions and the capacitance solutions by the determined sensitivity for each respective captured source of variation.

Abstract: Approaches for binning integrated circuits using timing are provided. A method includes performing a statistical timing analysis of a design. The method also includes identifying bin sub-spaces within a process space of the design. The method further includes determining a frequency limit for each said bin sub-space. The method additionally includes closing timing to the frequency limit for each said bin sub-space.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Systems and methods are provided for extracting parasitics in a design of an integrated circuit with multi-patterning requirements. The method includes determining resistance solutions and capacitance solutions. The method further includes performing parasitic extraction of the resistance solutions and the capacitance solutions to generate mean values for the resistance solutions and the capacitance solutions. The method further includes capturing a multi-patterning source of variation for each of the resistance solutions and the capacitance solutions during the parasitic extraction. The method further includes determining a sensitivity for each captured source of variation to a respective vector of parameters. The method further includes determining statistical parasitics by multiplying each of the resistance solutions and the capacitance solutions by the determined sensitivity for each respective captured source of variation.