Abstract: A system and method for controlling a locking device used in logistic management, the method including the step of receiving a command associated with an operation of a mechanical locking device; validating the received command and a protocol associated with the command; and manipulating the mechanical locking device operable in at least a locking state and an unlocking state; wherein the mechanical locking device is arranged to operate in response to a successful validation of the command associated with one of at least two protocols.

Abstract: An Ethernet Physical layer (PHY) device includes a PHY interface and PHY circuitry. The PHY interface is configured to connect to a physical link. The PHY circuitry is configured to generate layer-1 frames that carry data for transmission to a peer Ethernet PHY device, to insert among the layer-1 frames one or more management frames that are separate from the layer-1 frames and that are configured to control a General-Purpose Input-Output (GPIO) port associated with the peer Ethernet PHY device, to transmit the layer-1 frames and the inserted management frames, via the PHY interface, to the peer Ethernet PHY device over the physical link, for controlling one or more operations of the GPIO port associated with the peer Ethernet PHY device, and to receive, via the PHY interface, one or more verifications acknowledging that the one or more management frames were received successfully at the peer Ethernet PHY device.

Abstract: An optical subassembly for non-reciprocal coupling of light from a planar optical waveguide output outside the optical subassembly to an optical fiber includes a carrier configured to support the optical subassembly, an optical fiber fixed to the optical subassembly, a focusing optical system consisting two foci with one focus coincident with the input of optical fiber, an optical isolator to transmit light unidirectionally between two foci, an input boundary provided by the carrier to align the optical subassembly with the planar optical waveguide output. In particular, the optical subassembly is operably configured to provide a low transmission loss for light traveling from the planar optical waveguide output to the optical fiber.

Abstract: An asymmetric tetradentate metal complex of a N{circumflex over (?)}C{circumflex over (?)}C{circumflex over (?)}N comprising tetradentate ligand has a metal connected to binding sites which are connected to each other via three or four covalent bonds that can be either single or double bonds with bridging linkers reside between C{circumflex over (?)}C and C{circumflex over (?)}N moieties. These linkers result in three-dimension metal complexes with distorted square planar geometries. The four donor atoms coordinate to a metal center. Upon metal binding a 5-6-6 membered metallocycle is formed upon chelation including a first nitrogen donor bond, a first metal-carbon bond, a second metal-carbon bond, and a second nitrogen donor bond. The light emission from these metal complexes can be tuned by the ligand structure over the entire visible spectrum.

Abstract: System and method for providing a crowd-sourced knowledge repository and interactive hub for communicating information about clinical trials through an application interface. The application provides access to a database which stores information related to clinical trials and enables authorized users to manage these entries. The application also includes features to facilitate recruitment and further information gathering. Embodiments of the invention are built to provide news and updated information in real-time in a manner that streamlines both the transmission and access aspects for clinical trials. Embodiments of this invention could be applied to similar activities where aggregation of knowledge and efficient recruitment would be desirable, such as event planning across multiple venues or volunteer coordination of numerous projects.

Abstract: The present disclosure relates to a method of singulation of dies from a wafer, the wafer includes a semiconductor layer and a coating applied to the backside of the wafer after backgrinding, and the coating includes at least one metallization layer, the dies being separated along saw streets running in multiple directions. The method includes the steps of: dicing the wafer along the saw streets from a topside of the wafer; and the dicing is performed through plasma dicing for a dicing depth corresponding to the interface between the semiconductor layer and the coating. The method further includes the step of: etching the wafer in accordance with an etch mask corresponding to the saw streets, for each of the remaining metallization layers in the coating, and for singulating the dies from the wafer.

Abstract: Early exit of a loop is performed. A determination is made as to whether a loop within computer code reaches a fixed point of processing, which is predefined. Based on determining that the loop reaches the fixed point of processing, at least one indication is included in the loop to perform an early exit of the loop prior to a last iteration of the loop.

Abstract: Structures and active alignment methods thereof of a Transmitter Optical Sub-Assembly (TOSA) Structure are provided, that includes a light source sub-assembly including a light source component assembled on a light source bench; an optical sub-assembly including an optical component assembled on an optical bench; and a silicon chip including a coupler. A light emitted by the light source component is received by the coupler via the optical component along an optical path, the light source bench and the optical bench are thermally conductive to dissipate heat. The light source sub-assembly and the optical sub-assembly are actively aligned at the same time to optimize optical coupling between the light source sub-assembly and the optical sub-assembly by optimizing positions and a distance of the light source sub-assembly and the optical sub-assembly, the positions and the distance are flexibly adjusted during the active alignment process.

Abstract: The multi-purpose video monitoring camera includes a microprocessor, a CMOS video camera, a thermographic video camera, a display unit and a mic array. The microprocessor includes a baby presence detection module, a warning module, a motion detection module, a breathing detection module, a hot air exhalation detection module, a chest movement detection module, a breathing sound detection module, a suffocation detection module, a temperature measurement module, a urination and defecation detection module, an air conditioning module and a baby growth rate module. By using inputs from both the CMOS video camera and the thermographic video camera, the accuracy of the baby presence detection module is improved.

Abstract: Feedback-directed pass pipeline optimization in static compilation includes receiving a set of source input of source code by a static compiler. The static compiler initiates a compilation operation on the source code in which, in a pass pipeline during the compilation operation that creates an intermediate representation (IR) representing the source code, a set of optimization diagnostics identified during a first pass of the pass pipeline is emitted into a side file. The pass pipeline is then optimized using the set of optimization diagnostics.

Abstract: An intelligent system (100) and method (400) for event tracking which can assist a user to predict event types and occurrence times of upcoming events the user needs to handle. The intelligent event tracking system (100) comprises: a cloud server (110) and a tracking device (120). The cloud server (110) is configured for determining an event type and an occurrence time of a current event and predicting an event type and an occurrence time of a next event based on the determined event type and occurrence time of the current event as well as statistical data related to occurrence time and frequency associated with the determined event type and/or at least one related event type.

Abstract: An optical transceiver sub-assembly (100) integrated with a silicon photonic platform having a folded optical path for transmitting and detecting a plurality of optical signals includes a housing chamber (105) and a top cover (110) to enclose elements of the optical transceiver sub-assembly (100) other than the housing chamber (105) and the top cover (110), a bottom housing module (115) accommodating an optical micro integration (130). In particular, the optical transceiver sub-assembly (100) is operably configured to establish an optical-electrical communication with an outside surrounding.

Abstract: Feedback-directed pass pipeline optimization in static compilation includes receiving a set of source input of source code by a static compiler. The static compiler initiates a compilation operation on the source code in which, in a pass pipeline during the compilation operation that creates an intermediate representation (IR) representing the source code, a set of optimization diagnostics identified during a first pass of the pass pipeline is emitted into a side file. The pass pipeline is then optimized using the set of optimization diagnostics.

Abstract: Code pattern matching is performed within computer code to determine whether the computer code includes an idiom from a predefined set of idioms. Based on determining that the computer code includes the idiom, a set of data items of the idiom to be analyzed is determined. The set of data items is analyzed with respect to one or more corresponding values from the computer code based on a set of constraints defined for the idiom to determine whether the set of data items satisfy one or more predefined conditions for the idiom. Based on the analyzing indicating that the one or more predefined conditions are satisfied, one or more code segments of the computer code including the idiom are replaced with replacement code to provide revised computer code.

Abstract: This disclosure relates to a new package concept that eliminates the need for epoxy or epoxy solder used in traditional clip/lead frame-based power packages. The disclosure overcomes this disadvantage in clip-based packages by depositing the interconnect structure directly to the bod pads. The formation of the interconnect done at lower temperature leads to lower stress induced onto the die. Another advantage of the present disclosure is that semiconductor dies packaged using a method according to the present disclosure will have smaller footprint as the pads are directly built up/deposited. Another advantage of the method according to the present disclosure is that it allows large scale, i.e., panel level processing. Such a panel may include multiple ICs, or transistor or any other semiconductor devices.

Abstract: Aspects include modeling data cache utilization for each loop in a loop nest; estimating total data cache lines fetched in one iteration of the loop; and determining the possibility of data cache reuse across loop iterations using data cache lines fetched and associativity constraints. Aspects also include estimating, for memory reference pairs, reuse by one reference of data cache line fetched by another; estimating total number of cache misses for all iterations of the loop; and estimating total number of cache misses of a reference for iterations of a next outer loop as equal to total cache misses for an entire inner loop. Aspects further include estimating memory cost of a loop unroll and jam transformation, without performing the transformation; and extending a data cache model to estimate best unroll-and-jam factors for the loop nest, capable of minimizing total cache misses incurred by the memory references in the loop body.

Abstract: A radial adsorber can be configured to facilitate utilization of different layers of material. The radial adsorber, system using at least one radial adsorber, and methods of utilizing embodiments of the radial adsorber can help permit improved efficient operation of fluid purification processing while also being configured to minimize, if not fully avoid, being susceptible to the effect of fluidization.