Abstract: Disclosed is a method and system for providing to a user rapid access to search resources while interacting with electronic documents by providing for recognition of user initiated search triggers that result in searches being performed with minimal user input or page navigation. The method and system includes generating, by a server computer, a web page, injecting code into the web page, and transmitting the web page to a client computer. The code, when executed on the client computer, detects a search interface trigger occurring during display of the web page, the search interface trigger not associated with an input focus of the web page or of a browser on the client computer, detects a search execution trigger after the detecting of the search interface trigger, and transmits, to a search entity, a request for search results related to content associated with the search interface trigger.

Abstract: An optical engine for data communication includes a substrate, an array of optical semiconductor devices mounted on the substrate, a device lens block mounted on the substrate and formed with a cavity for accommodating the array of optical semiconductor devices, a jumper lens block coupled with the device lens block at an upper surface thereof, and a fiber array mounted on the jumper lens block and optically coupled with the array of optical semiconductor devices. The jumper lens block is aligned with the device lens block by alignment posts and notches. A metal latch is used to hold the jumper lens block on the device lens block.

Abstract: A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Abstract: An optical transmitter module includes a coupling optical element configured to couple a first optical signal from a transmitting optoelectronic component to a first light guiding structure. An optical power monitor system is connected with the first light guiding structure and is provided with a beam splitter for splitting the first optical signal into a transmitted optical signal and a reflected optical signal to be directed to a receiving optoelectronic component for measuring power of the reflected optical signal.

Abstract: A water pressure power-generating system includes a hydroelectric generator, a rotatable feeder, and at least two drain units all provided underwater. The drain units are disposed around the hydroelectric generator. Each drain unit includes a water catchment and a compression cylinder. The distance between the catchment and water surface is less than the distance between the compression cylinder and the water surface. The system further includes a gas compressor which can be connected with the compression cylinder through a pipeline. The rotatable feeder is provided with a first connection port for connection with the water outlet of the hydroelectric generator, and a second connection port for connection with the water inlet pipe of the water catchment. The first connection port is connected with the second connection port. When the system is provided in deep water, water pressure can be utilized to generate electricity.

Abstract: A power monitoring device includes: a silicon support layer being attached to a PCB board; a glass layer disposed above the silicon support layer; at least one sensing element disposed on the glass layer; and at least one metal pad disposed on the glass layer. The sensing element is suspended over a laser element that is attached to the PCB board and configured for sensing light directed thereto that is emitted by the laser element. A cavity is defined in the silicon support layer and configured for accommodating the laser element. A transmitter that includes the power monitoring device is also provided.

Abstract: A water pressure power-generating system includes a hydroelectric generator, a rotatable feeder, and at least two drain units all provided underwater. The drain units are disposed around the hydroelectric generator. Each drain unit includes a water catchment and a compression cylinder. The distance between the catchment and water surface is less than the distance between the compression cylinder and the water surface. The system further includes a gas compressor which can be connected with the compression cylinder through a pipeline. The rotatable feeder is provided with a first connection port for connection with the water outlet of the hydroelectric generator, and a second connection port for connection with the water inlet pipe of the water catchment. The first connection port is connected with the second connection port. When the system is provided in deep water, water pressure can be utilized to generate electricity.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: A method of forming semiconductor devices on a leadframe structure. The leadframe structure comprising an array of leadframe sub-structures each having a semiconductor die arranged thereon. The method comprises; providing electrical connections between terminals of said lead frame sub-structures and said leadframe structure; encapsulating said leadframe structure, said electrical connections and said terminals in an encapsulation layer; performing a first series of parallel cuts extending through the leadframe structure and the encapsulation layer to expose a side portion of said terminals; electro-plating said terminals to form metal side pads; and performing a second series of parallel cuts angled with respect to the first series of parallel cuts, the second series of cuts extending through the lead frame structure and the encapsulation layer to singulate a semiconductor device from the leadframe structure.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: Consistent with an example embodiment, there is leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. There are at least five I/O terminals wherein each of said terminals comprise a respective metal side pad wherein the respective metal side pad is disposed in a recess. A feature of this embodiment is that the each of the side pads is electroplated. The electroplated side pads accept solder and the solder menisci are contained by the recesses.

Abstract: A pluggable optical connector with a lock and release mechanism having a slider. The slider includes a handle, two spaced apart longitudinal arms extending from the handle and along two opposite sidewalls of a housing of the connector, two wedges formed at two free ends of the two arms respectively for forcing two deflectable locking tabs formed on a cage outwards when the connector is plugged into the cage and locked therein, and a bridge extending between the two arms. A single transverse leaf spring is positioned between the bridge and a transverse vertical wall extending inwardly from the housing of the connector. The leaf spring exerts spring force in a longitudinal direction, and locking of the connector is released with a reverse movement of the connector countering the spring force.

Abstract: The present invention provides a site-specific pegylated arginase conjugate and method for producing thereof. The site-specific pegylated arginase is homogeneous in molecular weight and shows therapeutic effect for treating cancers and viral infections. The method for producing the arginase conjugate comprises genetically modifying the gene encoding an arginase so that the PEG moiety can be attached to the enzyme at a predetermined, specific intended sites. This is achieved by removing the PEG-attaching amino acid residue(s) at undesirable site(s) while keeping or adding cysteine(s) at the desirable site(s) of the enzyme. Two exemplary embodiments of the pegylated arginase conjugate are directed to human arginase I (HAI) where a polyethylene glycol (PEG) moiety is site-specific covalently bonded to Cys45 of the enzyme and Bacillus caldovelox arginase (BCA) where a polyethylene glycol (PEG) moiety is site-specific covalently bonded to Cys161 of the enzyme.

Abstract: A controller for a persistent display device has an overall table of waveform data corresponding to different transitions of pixels from all pixel states to all others for differing operating parameters. A hardware LUT module receives input values containing new and current pixel state data and indexes to identify update requests, stores in LUT table memory space mapping values that are segments of waveform data generated in run time according to the operating parameters of each update request, and places segments of waveform data corresponding to the update requests into LUT output memory space. A SIMD module transposes waveform data of the update requests from the LUT output memory space, and places the transposed waveform data in respective frame scan buffers. An interface receives the transposed waveform data for the display device to update an image displayed on the panel.

Abstract: A pluggable optical connector with a lock and release mechanism having a slider. The slider includes a handle, two spaced apart longitudinal arms extending from the handle and along two opposite sidewalls of a housing of the connector, two wedges formed at two free ends of the two arms respectively for forcing two deflectable locking tabs formed on a cage outwards when the connector is plugged into the cage and locked therein, and a bridge extending between the two arms. A single transverse leaf spring is positioned between the bridge and a transverse vertical wall extending inwardly from the housing of the connector. The leaf spring exerts spring force in a longitudinal direction, and locking of the connector is released with a reverse movement of the connector countering the spring force.

Abstract: An optical subassembly includes: a TSV submount layer carrying an active optical component and a sandwich cap bonded to the TSV submount layer. The sandwich cap includes a bottom spacer layer disposed above the TSV submount layer, a glass layer above the bottom spacer layer, and an upper spacer layer above the glass layer. A cavity is defined in the bottom spacer layer and configured for accommodating the active optical component. At least one first lens is formed on the glass layer and is opposite to the active optical component. An alignment feature is formed in the upper spacer layer.

Abstract: Consistent with an example embodiment, there is leadless packaged semiconductor device having top and bottom opposing major surfaces and sidewalls extending there between. The leadless packaged semiconductor device comprises a lead frame sub-assembly having an array of two or more lead frame portions each having a semiconductor die arranged thereon. There are at least five I/O terminals wherein each of said terminals comprise a respective metal side pad wherein the respective metal side pad is disposed in a recess. A feature of this embodiment is that the each of the side pads is electroplated. The electroplated side pads accept solder and the solder menisci are contained by the recesses.

Abstract: A method for generating a sharp image based on a blurry image is provided. The method includes acquiring pixel values of pixels in the blurry image, and a convolution kernel of the blurry image, determining a deconvolution kernel of the blurry image based on a preset image gradient operator and the convolution kernel, determining pixel values of pixels in the sharp image based on the deconvolution kernel and the pixel values of the pixels in the blurry image, and generating the sharp image based on the pixel values of the pixels in the sharp image. A deconvolution kernel in the embodiments of the present disclosure is determined based on a gradient operator and a convolution kernel, in other words, the deconvolution kernel introduces the gradient operator as a regularization constraint, which prevents noise from affecting an image recovery process, and improves the quality of a recovered sharp image.

Abstract: A method of forming semiconductor devices on a leadframe structure. The leadframe structure comprising an array of leadframe sub-structures each having a semiconductor die arranged thereon. The method comprises; providing electrical connections between terminals of said lead frame sub-structures and said leadframe structure; encapsulating said leadframe structure, said electrical connections and said terminals in an encapsulation layer; performing a first series of parallel cuts extending through the leadframe structure and the encapsulation layer to expose a side portion of said terminals; electro-plating said terminals to form metal side pads; and performing a second series of parallel cuts angled with respect to the first series of parallel cuts, the second series of cuts extending through the lead frame structure and the encapsulation layer to singulate a semiconductor device from the leadframe structure.