Abstract: The method for producing an electrical connecting element is essentially characterized in that a plastic deformable substrate is formed with an embossing tool in an embossing step in such a way that recesses are made in said substrate in the areas in which conductive strips and, for instance, through holes or contact surfaces should be formed. The substrate is then coated with a thin conductive layer. In a following step, conductive material is galvanically deposited on the substrate until the recesses are filled with conductive material. Subsequently, the conductive material is removed the corresponding areas of the substrate that should not have any conductive surface are free from any metal coating.

Abstract: The surge arrester has a cylindrically symmetrical housing which can be grounded and through which a plug connection is passed which can be brought to a high-voltage potential. An active part which is aligned along the axis of symmetry is arranged in the housing and has two connection fittings and at least one varistor element arranged between the two connection fittings. The connection fittings and the at least one varistor element are braced with respect to one another by at least one loop forming a contact force. The insulation between the active part and the housing is ensured by a dielectric sleeve. The housing is in the form of a dielectric sleeve. The housing is in the form of a bottle and has a housing section in the form of a bottle neck, in which an electrical conductor is routed, which is connected to one of the two connection fittings, is electrically conductively connected to the plug connection, and is cylindrically symmetrical.

Abstract: The invention comprises a method for manufacturing electrical connecting elements or semifinished products. Microvias are formed in a dielectric substrate layer by piercing a substrate layer (1) through a first conducting layer (3), which essentially covers an entire side of the substrate. The perforation depth (d) is at least equal to the total thickness of the substrate and the first conducting layer. The conductor material of the first conducting layer (3) during the piercing step is deformed so that it partially covers the wall of the hole fabricated by the piercing process. The little remaining distance between the conductor material and the opposite side of the substrate layer can easily be bridged by plating the side of the first conducting layer with additional conductor material. In this way, a reliable via contact is formed.

Abstract: According to the invention, a microperforation (PMP) process step is combined with the lamination process. To this end, a dielectric layer are and a prefabricated product are placed between a support and a perforation die. The prefabricated product is partially covered by a conducting layer forming structures to be contacted by microvias. Pressure is applied on the perforation die, perforation tips of the perforation die forming microvias for contacting the structures. A surface of the dielectric layer or the prefabricated product is configured or coated to in a manner that the prefabricated product and the dielectric layer stick to each other after the pressure has been applied.

Abstract: The technology is based on the anisotropic plasma etching of organic polymer sheets partially protected by a metallic mask. The originality of the process is to pattern the surface properties by the same physical means as the one used for the three dimensional fabrication and simultaneously to this fabrication. Surface properties means, but are not limited to hydrophobicity, hydrophilicity, conductivity, reflectability, rugosity and more precisely the chemical and/or physical state of the surface. It is also possible to generate the desired fonctionalities, for instance carboxylic acid, ester, ether, amid or imid, during the etching process. The patterning of the different properties may be achieved by two different techniques that may be used separately or simultaneously.

Abstract: Pharmaceutical preparation comprising a peptide of the formula

Abstract: The component with fault arc protection has an insulator in the form of a pillar, a first electrical conductor system which is provided on the insulator head and can be connected to high-voltage potential, and a second electrical conductor system which is provided on the insulator foot and can be connected to a ground potential. Each of the two electrical conductor systems contains an arcing electrode (7) for dissipating any fault arc which occurs in the event of a discharge between the two electrical conductor systems.

Abstract: The polymer compound contains a polymer matrix and a filler embedded in the matrix. The filler comprises two filler components with nonlinear current-voltage characteristics deviating from one another. By selection of suitable amounts of these filler components, a polymer compound with a predetermined nonlinear current-voltage characteristic deviating from these two characteristics can be formed in this way.

Abstract: The invention disclose a pharmaceutical composition comprising an antigen, an immunogenic CpG-ODN and a polycationic polymer.

Abstract: A method for the manufacture of screened or shielded interconnecting conductors (1) begins with semifinished foil products (H1, H2, H3), a first semifinished foil product (H1) having at least one layer of conductors (10, 10′, 12, 12′, 13, 13′) including signal conductors (10, 10′) and shielding conductors (12, 12′, 13, 13′). Another semifinished foil product (H2, H3) has shielding material (23, 33), which is joined by a dielectric (15, 25, 35) to at least one layer of conductors (10, 10′, 12, 12′, 13, 13′), in which the shielding material (23, 33) is provided by photochemical structuring near the shielding conductors (12, 12′, 13, 13′) with openings (22, 22′, 32, 32′) extending to the dielectric (15, 25, 35).

Abstract: Tumor vaccine and process for the preparation thereof. The tumor vaccine contains tumor cells at least some of which contain at least one MHC-I-haplotype of the patient on the cell surface, and which are charged with one or more peptides binding to the MHC-I molecule in such a way that the tumor cells are recognized as foreign by the patient's immune system in context with the peptides and trigger a cellular immune response. The charging is carried out in the presence of a polycation such as polylysine.

Abstract: The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure.

Abstract: A method for producing a foil circuit board including a plurality of flexible electrically non-conductive and flexible conductive layers, which are laminated together. The non-conductive layers are positioned between the conductive layers and two of the conductive layers are the outermost surface layers of the foil circuit board. The circuit board includes flexible areas and rigid areas, and the flexible areas are provided by etching the board to remove at least part of one of the outermost surface layers and an adjacent underlying non-conductive layer.

Abstract: A method for the manufacture of printed circuit boards, foil circuit boards and semifinished products for printed and foil circuit boards formed from preliminary products with electrically conductive coatings (7, 8) structurable to conductor patterns and structurable substrates (4), for the formation of connectors (V), contours (K) and conductor patterns (L), the connectors (V), contours (K) and conductor patterns (L) being structured simultaneously or in the same method steps from the preliminary products, and the connectors (V) and contours (K) are part of the structured preliminary product substrate, the connectors (V) being brought for electrical or mechanical connection into a position in which they are connectable and the finished conductor patterns (L) can be separated at contours (K).

Abstract: The multilayer foil circuit board according to the invention has rigid (s) and flexible (f) areas and in the rigid areas has more foil layers than in the flexible areas. The foil circuit board according to the invention is produced so that in the intended flexible areas (f) at least on one side at least the outermost foil layer (1.2) is removed by etching. By a corresponding etching mask design, it is possible to allow the flexible areas (f) to pass continuously into the rigid areas (s) in that the removal of the layers in the marginal areas (u) is less than in the center (z) of the flexible area (f), so that there are no marginal areas which have a tendency to break. The etching of the flexible areas can be performed in the same method stage as the etching of the plated through holes through the corresponding foil layer (1.2) or in a separate etching stage.

Abstract: The electrical apparatus, which is preferably designed as a surge arrester (3), has an apparatus, which contains a current sensor, for indicating a fault state caused by a fault current (I). The indicating apparatus furthermore contains a receiver (read station 9), which can be operated from ground potential, for electromagnetic waves as well as an information carrier (8) which interacts with the current sensor and emits electromagnetic waves to the receiver (9). In such an apparatus, the fault state can be identified independently of optical signals.

Abstract: The electrical apparatus, which is designed in particular as a surge arrestor (3), has a dielectric housing (8) which can be loaded with high voltage as well as an apparatus for optical indication of a fault state caused by a fault current. The indicating apparatus is designed as an information carrier (9) which covers at least a portion of the outer surface of the dielectric housing (8). This information carrier (9) emits an optically detectable signal when heated to a limiting temperature which is above a permissible operating temperature of the apparatus. The information carrier (9) is advantageously designed as a thermocolor. A faulty apparatus can then be identified by the maintenance personnel for a system containing the electrical apparatus, in a simple and reliable manner by means of a color change.

Abstract: The overvoltage suppressor contains two connecting fittings (1, 2), which are spaced apart from one another along an axis (z) and between which at least one cylindrical varistor element (8) is arranged. The connecting fittings (1, 2) and the at least one varistor element (8) are braced with respect to one another, forming a contact force, to form a mechanically robust active part of the overvoltage suppressor. The active part is sheathed by a molded housing made of insulating material. In each case one material cutout is formed in each of the two connecting fittings (1, 2) with a section (15, 16) which runs essentially transversely with respect to the axis (z), is designed in the form of a slot and extends from the outer surface of the fitting (1, 2) to beyond the axis (z).

Abstract: The surge arrester has an axially symmetrical active portion (2) arranged between two connection fittings (1, 2). This active portion (2) contains varistor elements (12) stacked one above the other and also an axially symmetrical connecting element (13) of electrically conductive material arranged in the active portion (2) of the arrester between two successive varistor elements (12). At least four mounting places (16, 16'), which are uniformly distributed around the axis in the circumferential direction, are formed in the connecting element (13). Two first (16) of the mounting places support respectively one of two first loops (15) which act with contact force on the connecting element (13) and on the varistor elements (12) abutting the connecting element (13). Two second (16') of the mounting places support respectively one of two second loops (15) which act with contact force on the connecting element (13) and on the varistor elements (12) located under the connecting element.

Abstract: A process for structuring polymer films, such as printed circuit boards and film boards, uses a plasma, which is formed in a container by the excitation of gas mixtures by microwaves, in which there is a control of the surface temperature of the polymer films during structuring by the plasma. By adjusting the parameters it is possible to operate just below a material-damaging temperature limit for polymer films, so that structures or microshapes are carefully plasma-eroded in polymer films. At high surface temperatures and with a dense plasma, structures or microshapes are rapidly eroded by the plasma, in which the structures or microshapes are homogeneously plasma-eroded with a uniform distribution of the surface temperature and gas flow.