Abstract: Footwear includes memory foam in at least a non-load bearing portion of the footwear to provide three-dimensional contouring to a foot. The footwear includes a top portion, a bottom portion, a pair of sides connecting the top portion with the bottom portion, and an opening formed between the top portion and the pair of sides to receive a foot. At least one of the top portion and the pair of sides includes memory foam providing three-dimensional contouring.

Abstract: Footwear includes memory foam in at least a non-load bearing portion of the footwear to provide three-dimensional contouring to a foot. The footwear includes a top portion, a bottom portion, a pair of sides connecting the top portion with the bottom portion, and an opening formed between the top portion and the pair of sides to receive a foot. At least one of the top portion and the pair of sides includes memory foam providing three-dimensional contouring.

Abstract: Footwear includes memory foam in at least a non-load bearing portion of the footwear to provide three-dimensional contouring to a foot. The footwear includes a top portion, a bottom portion, a pair of sides connecting the top portion with the bottom portion, and an opening formed between the top portion and the pair of sides to receive a foot. At least one of the top portion and the pair of sides includes memory foam providing three-dimensional contouring.

Abstract: Footwear includes memory foam in at least a non-load bearing portion of the footwear to provide three-dimensional contouring to a foot. The footwear includes a top portion, a bottom portion, a pair of sides connecting the top portion with the bottom portion, and an opening formed between the top portion and the pair of sides to receive a foot. At least one of the top portion and the pair of sides includes memory foam providing three-dimensional contouring.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: A footwear slipper arrangement is described. The slipper arrangement comprises a pillow top secured to an outsole member. The pillow top is a cushion member. The pillow top billows or projects upwardly.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: An insole is described that can be placed with an insole receiving area of a slipper. The insole can be prepared by compression molding a structure comprising a foam layer having a first foam side and a second foam side. The insole includes a heel region, an arch region, and a toe region. The heel region includes a heel cushioning portion and a heel perimeter portion. The heel perimeter portion includes a retaining wall that extends above the top surface of the heel cushioning portion. The arch region includes an arch cushioning portion and an arch perimeter portion. The arch perimeter portion includes an arch support that extends above the top surface of the arch cushioning portion. The toe region includes a toe cushioning portion and a toe perimeter portion. A slipper and a method for manufacturing a slipper are described.

Abstract: A slipper and a method of manufacturing a slipper is described where the slipper includes an outsole having a sidewall extending along a perimeter of the outsole. The outsole also includes a supporting sole structure including a platform surface. The supporting sole may include lattice walls defining open cells. The slipper also includes an insole and a vamp. The insole covers the platform of the outsole and fits within the sidewall. The method of manufacture includes the steps of providing the outsole, providing the vamp, and attaching a lower perimeter of the vamp to at least a portion of the sidewall extending along a perimeter of the outsole.