Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: A continuous use authentication method includes: acquiring a normal state image and a current image for a user; determining an inferred classification state for the user from among a plurality of classification states by applying the normal state image and the current image to a low-depth inference model for the user; when the inferred classification state is included in an abnormality category, determining a high-depth inference model corresponding to the inferred classification state from among a plurality of high-depth inference models; and determining reliability of the inferred classification state by applying the current image to the high-depth inference model.

Abstract: A semiconductor device including: a first transistor which include a first gate stack on a substrate; and a second transistor which includes a second gate stack on the substrate, wherein the first gate stack includes a first ferroelectric material layer disposed on the substrate, a first work function layer disposed on the first ferroelectric material layer and a first upper gate electrode disposed on the first work function layer, wherein the second gate stack includes a second ferroelectric material layer disposed on the substrate, a second work function layer disposed on the second ferroelectric material layer and a second upper gate electrode disposed on the second work function layer, wherein the first work function layer includes the same material as the second work function layer, and wherein an effective work function of the first gate stack is different from an effective work function of the second gate stack.

Abstract: A high performance packet stream storage method. Original packet data from data traffic transmitted over a network is collected. Collected original packet data is written in a memory. Metadata from the collected original package data is extracted and metadata is written in the memory. The original packet data and the metadata is stored in a storage unit.

Abstract: Provided is an anesthetic composition for locally administering a local anesthetic agent to a subject in need thereof. The anesthetic composition has a lipid based complex prepared by hydrating a lipid cake containing a local anesthetic agent and a lipid mixture with an aqueous buffer solution at a pH higher than 5.5. Also provided is a method to prepare an anesthetic composition using a simpler and more robust for large-scale manufacture and for providing a high molar ratio of local anesthetic agent to phospholipid content as compared to the prior art. This anesthetic composition has a prolonged duration of efficacy adapted to drug delivery.

Abstract: According to an embodiment, a wick structure of a heat pipe that is capable of bending while increasing a heat transferring operation limit value is provided by improving the wick structure provided inside the heat pipe.

Abstract: The present disclosure provides a bracewear for spinal correction and a system for posture training. The system for posture training involves both active and passive corrective forces by using the bracewear and a biofeedback system to address the spinal correction, which can eliminate the adversity of conventional hard braces and reduce the psychological and physiological barriers to treatment.

Abstract: Disclosed herein are an apparatus and method for mutual authentication of quantum entities based on Measurement-Device-Independent Quantum Key Distribution (MDI-QKD). The method may include configuring a quantum input form based on an authentication key shared in advance with a counterpart entity, applying polarization modulation to the configured quantum input form, transmitting the quantum input form to which polarization modulation is applied to a quantum measurement device, and authenticating the counterpart entity by checking whether the counterpart entity configures a quantum input form according to the shared authentication key using a measurement result and information about polarization modulation.

Abstract: A memory controller comprising a DMA master device configured to provide a first data group to a non-volatile memory (NVM) device, a program buffer memory configured to temporarily store the first data group before the DMA master device provides the first data group to the NVM device, an exclusive OR computing circuit configured to perform an exclusive OR computation and an accumulation on a plurality of data included in the first data group provided from the program buffer memory to generate a first recovery data, after the DMA master device provides the first data group to the NVM device, and a buffer slave device including a first program recovery buffer memory configured to store the first recovery data and provide the first recovery data from the first program recovery buffer memory to the program buffer memory, in response to a program failure signal, may be provided.

Abstract: A semiconductor device, and method of manufacturing a semiconductor device, includes second conductive patterns separated from each other above a first stack structure which is penetrated by first channel structures and enclosing second channel structures coupled to the first channel structures, respectively. Each of the second conductive patterns includes electrode portions stacked in a first direction and at least one connecting portion extending in the first direction to be coupled to the electrode portions.

Abstract: A high performance packet stream storage method. Original packet data from data traffic transmitted over a network is collected. Collected original packet data is written in a memory. Metadata from the collected original package data is extracted and metadata is written in the memory. The original packet data and the metadata is stored in a storage unit.

Abstract: A high performance packet stream storage method. Original packet data from data traffic transmitted over a network is collected. Collected original packet data is written in a memory. Metadata from the collected original package data is extracted and metadata is written in the memory. The original packet data and the metadata is stored in a storage unit.

Abstract: A mark printing device includes a driving unit driving along a driving rail of an overhead hoist transport, a printing unit being configured to print on the driving rail a mark for guiding a motion of a vehicle, a data processing unit receiving design data including design information of the driving rail and first information on a position and type of the mark from a server, an encoder unit being configured to calculate a rotation amount of a servo motor provided in the driving unit to detect a current position of the driving unit and a driving distance of the driving unit, and a control unit being configured to control the driving unit and the printing unit to print the mark on the driving rail by using the design data and second information on the current position and the driving distance of the driving unit.

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

Abstract: A memory controller comprising a DMA master device configured to provide a first data group to a non-volatile memory (NVM) device, a program buffer memory configured to temporarily store the first data group before the DMA master device provides the first data group to the NVM device, an exclusive OR computing circuit configured to perform an exclusive OR computation and an accumulation on a plurality of data included in the first data group provided from the program buffer memory to generate a first recovery data, after the DMA master device provides the first data group to the NVM device, and a buffer slave device including a first program recovery buffer memory configured to store the first recovery data and provide the first recovery data from the first program recovery buffer memory to the program buffer memory, in response to a program failure signal, may be provided.

Abstract: A method for identifying anomalous mud flow includes determining an operating rate of a mud pump discharging to a pipe string in a wellbore. Mud returned from the wellbore is moved to a first metering tank. Mud is moved from the first transfer tank to a mud storage tank using a first pump having a flow rate directly related to an operating rate thereof. A first parameter related to volume of mud in the first metering tank is measured. Anomalous mud flow is identified by detecting changes in the operating rate of the first pump wherein the operating rate is adjusted to maintain the first parameter substantially constant.

Abstract: Disclosed herein are ladder polymers comprising fused aromatic and non-aromatic rings. Also disclosed are the manufacture and use of these ladder polymers, e.g., in separation membranes, such as membrane for gas separation.

Abstract: The invention discloses a bicycle drive system (10) and a kit. The drive system comprises a drive unit (15) comprising a housing, a motor unit (20) having a stator (21), a rotor (22) and an output shaft and accommodated in the housing, and a first stage deceleration unit (30) having an input part connected to the output shaft of the motor unit and an output part; a mounting unit (50) configured to secure and hold the drive unit on a bicycle body (70); and a second stage deceleration unit (40) arranged external to the drive unit and detachably mounted on the first stage deceleration unit for connection to a pedal assembly (80) to transfer a drive force from the output part of the first stage deceleration unit to chainrings (82) of the pedal assembly. The drive unit, the mounting unit and the second stage deceleration unit are each provided as a modular part for assembling to the bicycle. The invention provides a customizability of the drive system.

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor device also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor device additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.