Abstract: A high-durability and long-scale-distance fiber grating sensor and a manufacturing method therefor, which relate to the technical field of fiber grating sensors. A fiber grating is disposed on the middle segment of a commercial optical fiber. A bushing, a woven fiber jacket layer, and a packaging structure are disposed on the periphery of the commercial optical fiber. The commercial optical fiber and the bushing therebetween are fixed by using fixing points in the bushing. Anchoring segments are disposed between the fixing points in the bushing and the woven fiber jacket layer. Two ends of the commercial optical fiber are sequentially connected to optical fibers on the anchoring segments and connecting optical fibers. Tail ends of the connecting optical fibers are connected to a transmission cable by using connecting flanges.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Abstract: An apparatus for exchanging a probe includes a stacker configured to receive a probe and to align the probe, a probe connector connected to the probe, and a laser alignment unit including a light emitter and a light receiver. The light emitter is configured to emit a laser beam to the probe, and the light receiver is configured to detect the laser beam reflected by the probe. The laser alignment unit is configured to detect when the probe is properly aligned on the probe connector using the light receiver, and the laser alignment unit is configured to stop moving the stacker when it is detected that the probe is properly aligned.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: A high-durability and long-scale-distance fiber grating sensor and a manufacturing method therefor, which relate to the technical field of fiber grating sensors. A fiber grating is disposed on the middle segment of a commercial optical fiber. A bushing, a woven fiber jacket layer, and a packaging structure are disposed on the periphery of the commercial optical fiber. The commercial optical fiber and the bushing therebetween are fixed by using fixing points in the bushing. Anchoring segments are disposed between the fixing points in the, bushing and the woven fiber jacket layer. Two ends of the commercial optical fiber are sequentially connected to optical fibers on the anchoring segments and connecting optical fibers. Tail ends of the connecting optical fibers are connected to a transmission cable by using connecting flanges.

Abstract: The present invention relates to a pharmaceutical composition for cancer treatment containing gossypol and phenformin as active ingredients. Specifically, the combinative treatment with gossypol and phenformin was verified to have a significantly higher anticancer activity than a single treatment with gossypol and phenformin alone. Therefore, the pharmaceutical composition of the present invention containing gossypol and phenformin having a synergetic anticancer activity can be favorably used for cancer treatment.

Abstract: Provided is an automatic reduction apparatus for pre-treating a sample for radiocarbon dating, and more particularly, an automatic reduction apparatus for pre-treating a sample for radiocarbon dating capable of preventing peripheral devices of a liquid nitrogen container from being cooled due to scattering of liquid nitrogen supplied to the liquid nitrogen container of a carbon dioxide collector and preventing the peripheral devices from being heated by heat of a reaction furnace at the time of heating the reaction furnace of a reduction reactor.

Abstract: A washing machine includes a door and an auxiliary washing unit that may be readily fastened to each other by a locking unit for fastening the door and the auxiliary washing unit. The washing machine includes a main body in which an opening is formed, a door that opens and closes the opening, an auxiliary washing unit that is provided on an inner side of the door to form an auxiliary washing space, and a locking unit that locks the door and the auxiliary washing unit. Here, the locking unit may perform linear motion in one direction to lock or unlock the door and the auxiliary washing unit.

Abstract: A touch panel is provided. The touch panel includes a receiver configured to receive response signals from a plurality of objects, and a controller configured to identify positions of the plurality of objects based on different frequencies emitted from each of the plurality of objects in response to the response signals being simultaneously received through the receiver.

Abstract: Provided is a method for manufacturing a silicon carbide single crystal using a solution process including coming a seed crystal substrate for growing silicon carbide into contact with a Si—C alloy solution including at least one additive metal and growing the silicon carbide single crystal on a seed crystal for growing silicon carbide, including feeding a silicon feedstock into an alloy solution when a molar ratio of Si and the additive metal is lower than an initially set value as the reaction progresses. The method increases a crystal growth speed, maintains the growth speed, and prevents the growth from unwillingly stopping when the silicon carbide single crystal is manufactured using a solution growth process.

Abstract: A high-durability and long-scale-distance fiber grating sensor and a manufacturing method therefor, which relate to the technical field of fiber grating sensors. A fiber grating is disposed on the middle segment of a commercial optical fiber. A bushing, a woven fiber jacket layer, and a packaging structure are disposed on the periphery of the commercial optical fiber. The commercial optical fiber and the bushing therebetween are fixed by using fixing points in the bushing. Anchoring segments are disposed between the fixing points in the, bushing and the woven fiber jacket layer. Two ends of the commercial optical fiber are sequentially connected to optical fibers on the anchoring segments and connecting optical fibers. Tail ends of the connecting optical fibers are connected to a transmission cable by using connecting flanges.

Abstract: A touch panel is provided. The touch panel includes a channel electrode unit configured to include a plurality of first electrodes disposed in a first direction and a plurality of second electrodes disposed in a second direction intersecting with the first direction, and a controlling unit configured to apply a driving signal to the electrodes in the channel electrode unit in a unit of a plurality of electrodes, transmit the driving signal to a resonance circuit of a stylus pen approaching the touch panel through a capacitive coupling, and receive response signals generated from the resonance circuit of the stylus pen from each of the plurality of electrodes to determine a location of the stylus pen including the resonance circuit.

Abstract: An infrared sensor includes a first emitting module, a second emitting module, and a receiving module. The first emitting module includes a first emitter and a first lens; the second emitting module includes a second emitter and a second lens. The first emitter and the second emitter respectively emit an infrared ray along an optical axis, wherein an acute angle is formed between the optical axes. The receiving module is located between the first emitting module and the second emitting module, wherein the receiving module includes a receiver and a third lens. The infrared rays emitted from the first and the second emitter respectively pass through the first and the second lens, afterwards, the infrared rays are reflected to pass through the third lens, and thus received by the receiver. Additionally, the infrared sensor may be applied to a sensor faucet for controlling a water valve in the sensor faucet.

Abstract: A wire winding machine (100) is disclosed which includes holders (106, 108) for holding a workpiece having a body (104a) with a hole (104b). A wire manipulator includes wire holders (116a, 116b, 116c) which are adapted for moving a piece of wire through the hole of the workpiece to form turns of winding of the piece of wire on the body of the workpiece.

Abstract: A mounting assembly contains a plate including a first fringe, a second fringe, a third fringe, and a fourth fringe. The first fringe has a first raised portion, and the second fringe has a semi-circular groove. The plate includes a plurality of first adjusting apertures, at least one pair of second adjusting apertures, and at least one pair of third adjusting apertures. The at least one pair of third adjusting apertures is defined between the at least one pair of second adjusting apertures, a distance between the at least one pair of second adjusting apertures is equal to that of two opposite orifices, two supporting members are symmetrically connected with the third fringe and the fourth fringe, and each supporting member has a plurality of first eyelets so that the first bolt inserts through the through hole to screw with one of the plurality of first eyelets.

Abstract: An asynchronous bridge includes a transmission unit and a receiving unit. The transmission unit receives a write valid signal and input data from a master circuit, outputs write addresses increment under control of the write valid signal, sequentially stores the input data in memory cells, as directed by write addresses, and then sequentially outputs the stored input data, as directed by read addresses. The receiving unit receives a read ready signal from a slave circuit, determines whether memory cells are valid, based on the write addresses and the read addresses, and then outputs a read valid signal and the input data, based on the determination.

Abstract: A thermostatic assembly (c) and a manufacturing method therefor. The thermostatic assembly (c) comprises a metal casing (30), a housing (40), a heat sensitive material (50), a diaphragm (60) and a piston (70). A metal structural body (301) is formed in a chamber (34) of the metal casing (30), and the metal structural body (301) comprises countless granular metal powders (35), and countless cavities (36) mutually communicating with one another. The metal powders (35) are mutually consolidated with one another, and the metal powders (35) located at a peripheral position are mutually consolidated with the inner wall surface (37) of the metal casing (30). The cavities (36) are defined by gaps naturally formed among the metal powders (35), and between the inner wall surface (37) of the metal casing (30) and each adjacent metal powder (35). The heat sensitive material (50) is filled and injected into the cavities (36) in the form of a liquid.

Abstract: A protective circuit includes a first jack, a second jack, a first control unit, a detecting circuit, and a logic control circuit. The first jack is connected to a power supply, and includes a grounding wire and a live wire. The second jack is connected to a load, and includes a grounding wire and a live wire. The first control unit includes a first relay, the first relay is connected to the live wire of the first jack and the live wire of the second jack. The detecting circuit detects whether the grounding wire of the first jack is grounded, and outputs indication signals accordingly. The logic control circuit outputs a control signal to the first control unit according to the indication signals to turn on/off the first relay, for allowing the live wire of the first jack to be connected to/disconnected from the live wire of the second jack.

Abstract: Provided is a fusion measurement apparatus which increases or maximizes the reliability of a measurement. The fusion measurement apparatus includes an atomic microscope for measuring a surface of a substrate at an atomic level, an electron microscope for measuring the atomic microscope and the substrate, and at least one electrode which distorts the path of a secondary electron on the substrate covered by a cantilever of the atomic microscope so that the secondary electron proceeds to an electron detector of the electron microscope.