Abstract: The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

Abstract: The present invention provides a printing medium, a printing method, and a printing apparatus using a photonic crystal characteristic. According to the present invention, the printing medium using the photonic crystal characteristic comprises a medium in which a plurality of particles having electric charges are dispersed, wherein the inter-particle distances of the particles are controlled as a result of at least one of electric fields and magnetic fields are applied to the medium, and the inter-particle distances of the particles are fixed as the energy is applied to the medium.

Abstract: An asynchronous bridge includes a transmission unit and a receiving unit. The transmission unit receives a write valid signal and input data from a master circuit, outputs write addresses increment under control of the write valid signal, sequentially stores the input data in memory cells, as directed by write addresses, and then sequentially outputs the stored input data, as directed by read addresses. The receiving unit receives a read ready signal from a slave circuit, determines whether memory cells are valid, based on the write addresses and the read addresses, and then outputs a read valid signal and the input data, based on the determination.

Abstract: Provided are an AFM measuring method and a system thereof. The tip of a cantilever is provided to a plurality of points on a substrate, to which incident light is radiated from a light source. Scattered light is generated between the tip of the cantilever and the substrate by the incident light and the intensity of the scattered light is measured. The measured intensity of the scattered light is input to a data processing unit so as to find a point where the intensity of the incident is highest. The tip of the cantilever is moved to the point where the intensity of the incident light is highest.

Abstract: A mixed water control valve having a body and a spindle is disclosed. The body has two inlet pipes and two outlet pipes which are longitudinally corresponding to the two inlet pipes. The two inlet pipes are branched into a upper inlet pipe and a lower inlet pipe which are disposed in different height positions. The spindle is rotatably assembled in the body. The spindle has an upper and a lower inlets corresponding to the height of the upper and the lower inlet pipe and. The spindle also has an upper outlet and a lower outlet respectively corresponding to the two outlet pipe. Thereby, the spindle is detachable and convenient to repair and replace and the spindle is also capable of changing mounting directions to change the flowing directions of water and then to match the different arrangements of the inlet pipes of cold and hot water.

Abstract: A test card includes a power interface, a controller, a test interface, and a test point. The test interface includes a power pin, a start pin, and a data signal pin. The power interface is connected to the controller and the power pin, and also connected to an external power to receive a work voltage. The controller transmits a turn-on signal to the start pin. The test point is connected to the data signal pin. When an interface of a motherboard is connected to the test interface, the power pin, the start pin, and the data signal pin are connected to corresponding pins of the interface of the motherboard. The motherboard outputs a data signal to the test point through the motherboard interface and the test interface after the controller receives the turn-on signal.

Abstract: The present disclosure relates to a display method and device using an electromagnetophoretic property. The display method includes: applying at least one of an electric field and magnetic field to a plurality of particles configured to possess an electric charge and magnetic property and to exhibit a first color, in a state in which the particles are dispersed in a solvent configured to exhibit a second color, so that at least one of the first and second colors is exhibited; and changing at least one of intensity and orientation of the applied electric field or magnetic field, so that the particles are moved in a predetermined direction to exhibit at least one of the first and second colors.

Abstract: An updating device connected to a network adapter card ROM, the updating device includes a baseboard management controller. The baseboard management controller is electrically connected to the network adapter card ROM. The baseboard management controller stores an update data for the network adapter card ROM. When the baseboard management controller starts, the baseboard management controller writes the update data into the network adapter card ROM. A method of updating a network adapter card ROM is also provided.

Abstract: Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.

Abstract: The present invention relates to a water level monitoring device and method, which has an advantage of efficient water level monitoring and high device reliability by setting a portion of an area including the water area and the shore area in the image data, monitoring an area in the horizontal direction other than the vertical direction through the image, decreasing complexity by significantly reducing the computational amount over an existing vertical direction water level measuring system, excluding noises such as floating matters, irregular reflection and so on through a water level model generating process for area distinction, and generating a water level model adaptive to environmental factors such as algal bloom, muddy water and so on.

Abstract: A method of removing a Moire pattern in a 3D image display apparatus using complete parallax. The method of removing a Moire pattern in a 3D image displaying system with an image display device having an image display panel and a unit for providing complete parallax, by intersecting the image display panel and the unit with each other at a predetermined angle. The unit is an intersection lenticular plate or a micro lens array plate located at a front or rear of the image display panel.

Abstract: The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 ?m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Abstract: An electronic component and method of making an electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: A method of manufacturing a wiring structure and a semiconductor device, the method of manufacturing a wiring structure including forming a first insulating interlayer on a substrate; forming a contact plug in an opening in the first insulating interlayer; forming a second insulating interlayer on the contact plug and the first insulating interlayer; removing a portion of the second insulating interlayer to form an opening therethrough such that the opening exposes the contact plug; filling a portion of the opening to form a wiring such that the wiring is electrically connected to the contact plug; and forming a diffusion barrier layer pattern on the wiring such that the diffusion barrier layer pattern fills a remaining portion of the opening.

Abstract: A method of manufacturing a non-volatile memory device providing a semiconductor layer in which a cell region and a peripheral region are defined, sequentially forming a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer on the cell region and the peripheral region, forming a trench for exposing a portion of the first conductive layer of the peripheral region, wherein the trench is formed by removing portions of the second conductive layer and the second insulating layer in the peripheral region, performing a trimming operation for removing portions of the second conductive layer and the second insulating layer of the cell region, forming a spacer on a side surface of the trench, and forming a silicide layer that is electrically connected to the first conductive layer, wherein the silicide layer is formed by performing a silicidation process on the spacer.

Abstract: Provided are an AFM measuring method and a system thereof. The tip of a cantilever is provided to a plurality of points on a substrate, to which incident light is radiated from a light source. Scattered light is generated between the tip of the cantilever and the substrate by the incident light and the intensity of the scattered light is measured. The measured intensity of the scattered light is input to a data processing unit so as to find a point where the intensity of the incident is highest. The tip of the cantilever is moved to the point where the intensity of the incident light is highest.

Abstract: An apparatus for repairing a photo mask, including a repairing atomic force microscope configured to repair a defective portion of the photo mask in a photo mask repair process, an electron microscope configured to navigate the repairing atomic electron microscope to the defective portion of the photo mask and to observe the photo mask repair process, and an imaging atomic microscope configured to image in-situ a shape of a repaired photo mask.

Abstract: An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: The present invention provides a printing medium, a printing method, and a printing apparatus using a photonic crystal characteristic. According to the present invention, the printing medium using the photonic crystal characteristic comprises a medium in which a plurality of particles having electric charges are dispersed, wherein the inter-particle distances of the particles are controlled as a result of at least one of electric fields and magnetic fields are applied to the medium, and the inter-particle distances of the particles are fixed as the energy is applied to the medium.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of buns during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.