Abstract: The present invention relates to a pressure-sensitive adhesive film and a semiconductor wafer backgrinding method using the same. The present invention provides a pressure-sensitive adhesive film capable of remarkably improving production efficiency in a wafer backgrinding of a semiconductor manufacturing process due to its superior cutting and adherence properties in the semiconductor manufacturing process and an excellent cushioning property. Moreover, the present invention also provides a pressure-sensitive adhesive film having superior peeling and re-peeling properties and wettability to the wafer while providing excellent water resistance, and a backgrinding method using the pressure-sensitive adhesive film.

Abstract: The present invention relates to a dicing die bonding film employed in a semiconductor packaging process, and a semiconductor device using the same. The dicing die bonding film is configured such that a ratio X/Y of adhesive power X between the wafer and the adhesive layer of the die bonding portion to tacky power Y between the die bonding portion and the tacky layer of the dicing portion is 0.15 to 1, and the adhesive layer of the die bonding portion has a storage modulus of 100 to 1000 MPa at a normal temperature. The dicing die bonding film according to the present invention reduces burr generation in dicing process, and thereby preparing a semiconductor device having excellent reliability without inferiority caused by bad connection reliability due to the burr covering a bonding pad.

Abstract: An apparatus for repairing a photo mask, including a repairing atomic force microscope configured to repair a defective portion of the photo mask in a photo mask repair process, an electron microscope configured to navigate the repairing atomic electron microscope to the defective portion of the photo mask and to observe the photo mask repair process, and an imaging atomic microscope configured to image in-situ a shape of a repaired photo mask.

Abstract: A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

Abstract: The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 ?m. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

Abstract: Disclosed is a display apparatus including: a display unit; a power supply unit which supplies power to at least one external device; and a controller which displays on the display unit an at least one indicating image indicating an at least one power supply area of the display unit supplying power to the at least one external device, and controls the power supply unit to supply power to the at least one external device placed on the at least one power supply area in a wireless manner.

Abstract: A method of manufacturing a non-volatile memory device providing a semiconductor layer in which a cell region and a peripheral region are defined, sequentially forming a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer on the cell region and the peripheral region, forming a trench for exposing a portion of the first conductive layer of the peripheral region, wherein the trench is formed by removing portions of the second conductive layer and the second insulating layer in the peripheral region, performing a trimming operation for removing portions of the second conductive layer and the second insulating layer of the cell region, forming a spacer on a side surface of the trench, and forming a silicide layer that is electrically connected to the first conductive layer, wherein the silicide layer is formed by performing a silicidation process on the spacer.

Abstract: The present disclosure relates to a method for fabricating a scanning probe microscope (SPM) nanoneedle probe using an ion beam, a SPM nanoneedle probe, a method of fabricating a critical dimension scanning probe microscope (CD-SPM) nanoneedle probe using an ion beam, a CD-SPM nanoneedle probe, and uses thereof. A disclosed method can comprise: positioning the probe so that a tip of the probe on which the nanoneedle is attached faces toward a direction in which the ion beam is irradiated; and aligning the nanoneedle attached on the tip of the probe with the ion beam in parallel by irradiating the ion beam toward the tip of the probe on which the nanoneedle is attached.

Abstract: A bearing system includes a bearing, a shaft extending in the bearing, and a layer of nano-structured coating coated on one of the bearing and the shaft. A space is formed between the bearing and the shaft, and a lubricant is filled in the space. The lubricant is made of polymer material with hydrophilic and hydropholic properties. The nano-structured coating has a high surface tension which results in the coating being capable of adsorbing the lubricant to form a layer of lubricant film between the coating and the other of the bearing and the shaft, thereby reducing possibility of direct contact between the lubricant and the other of the shaft and the bearing. Thus, loss of the lubricant is reduced to avoid contacting frication between the shaft and the bearing. Accordingly, noise generated by the bearing system is decreased and life of the bearing system is extended.

Abstract: A method of making a fluid dynamic bearing (10) includes the flowing steps. At least two bearing parts (10a, 10b) are firstly provided. Each of the bearing parts has its shape corresponding to a portion of the fluid dynamic bearing to be formed. Then, the bearing parts are combined to form a profile of the fluid dynamic bearing to be formed. Finally, the combined bearing parts are sintered to form an integral body. The fluid dynamic bearing is thus obtained.

Abstract: The present invention relates to a method for fabricating a scanning probe microscope (SPM) nanoneedle probe using ion beam which is preferably focused ion beam and a nanoneedle probe thereby. More particularly, the present invention relates to a method for fabricating a SPM nanoneedle probe capable of being easily adjusted with an intended pointing direction of a nanoneedle attached on a tip of the SPM nanoneedle probe and of being easily straightened with the nanoneedle attached on the tip of the SPM nanoneedle probe along the intended pointing direction, and to a SPM nanoneedle probe thereby. Also, the present invention relates to a method for fabricating a critical dimension SPM (CD-SPM) nanoneedle probe capable of precisely scanning the sidewall of an sample object in nanoscale using ion beam which is preferably focused ion beam, and to a CD-SPM nanoneedle probe thereby.

Abstract: The present invention relates to a deformation method of nanometer-scale material using a particle beam and a nano-tool thereby. The deformation method of the nanometer-scale material using the particle beam according to the present invention is characterized in that the nanometer-scale material is bent toward a direction of the particle beam by irradiating the particle beam on the nanometer-scale material.

Abstract: A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

Abstract: A display device and method for supplying stable electric power for a light source are provided. A display device comprises a plurality of light sources, a variable electrical power supply which supplies electric power for the light sources, a switching unit which is connected in series with the light sources, and a controller which controls the variable electrical power supply so that voltage across both ends of the switching unit is consistently held in relation to voltage across both ends of the light sources.

Abstract: A fluid dynamic bearing assembly includes a bearing sleeve (30) having an inner surface and a rotary shaft (30) rotatably received in the bearing sleeve. The rotary shaft has an outer surface. One of the inner surface of the bearing sleeve and the outer surface of the rotary shaft forms a dynamic pressure generating groove pattern (10). The groove pattern includes a plurality of grooves (12) extending from a center area toward one edge of the groove pattern. Each of the grooves has at least one of a depth and a width decreasing from the center area toward the edge.

Abstract: The present invention relates to a deformation method of nanometer-scale material using a particle beam and a nano-tool thereby. The deformation method of the nanometer-scale material using the particle beam according to the present invention is characterized in that the nanometer-scale material is bent toward a direction of the particle beam by irradiating the particle beam on the nanometer-scale material.

Abstract: An electronic component is disclosed. In one embodiment, the electronic component includes a frame having a base layer, a first layer, a second layer including palladium placed on the first layer, and a third layer including gold placed on the second layer. A semiconductor chip is positioned on the frame.

Abstract: A lead frame (1) has a first portion (2) adapted to have a semiconductor device (10) mounted thereon and a second portion (3) including a main member (5), a number of first contact members (6) and a number of second contact members (7). The first and second contact members (6, 7) depend from the main member (5). The second portion (3) at least partially surrounds the first portion (6). The first contact members (6) extend form the main member (5) in a direction away for the first portion (2) and the second contact members (7) extend from the main member (5) in a direction towards the first portion (2).