Patents by Inventor Wan In Lee

Wan In Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984559
    Abstract: A systems and methods for tracking a position of an electrode. The system may include: a notching controller configured to store pitch information of a unit electrode and to acquire electrode coordinate information of the electrode in a roll-to-roll state during a notching process and a cell identification (ID) of the unit electrode; a calculator configured to calculate coordinates of the cell ID from the pitch information and the cell ID; a roll map generator configured to generate a roll map based on the electrode coordinate information transmitted from the notching controller; and a mapping part configured to compare the coordinates of the roll map with the coordinates of the cell ID to derive an electrode position of the electrode during the electrode manufacturing process from which the unit electrode originates.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: May 14, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Jae Hwan Lee, Jong Seok Park, Dong Yeop Lee, Jun Hyo Su, Ki Deok Han, Byoung Eun Han, Seung Huh, Su Wan Park, Gi Yeong Jeon, Min Su Kim
  • Patent number: 11981276
    Abstract: An external material for vehicles may include a non-woven fabric having a honeycomb structure and a wheel guard including the same.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: May 14, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, HADO FNC CO., LTD., YONG SAN CO., LTD.
    Inventors: Seong Je Kim, Keun Young Kim, Ji Wan Kim, Jung Wook Lee, Jong Eun Ha, Young Su Kim, Sang Hoon Lee, Mu Jin Kim
  • Publication number: 20240151524
    Abstract: An apparatus for generating a roll map of a merge-wound electrode includes a position measurement device configured to acquire coordinate value data for a longitudinal position of an electrode according to an amount of rotation of the rewinder. The apparatus includes an input device configured to input an input signal indicating a start of merge-winding or an end of merge-winding, a seam detector configured to detect a seam, a reference point detector configured to detect a plurality of reference points of the merge-wound electrode, and a roll map generator configured to generate a roll map for simulating the merge-wound electrode moving in a roll-to-roll state based on the input signal of the input device, and to display the longitudinal coordinate values of the electrode, the electrode coordinate values of the seam, and the electrode coordinate values of the plurality of reference points of the merge-wound electrode on the roll map.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 9, 2024
    Inventors: Dong Yeop LEE, Jong Seok PARK, Jun Hyo SU, Ki Deok HAN, Byoung Eun HAN, Seung HUH, Su Wan PARK, Gi Yeong JEON, Jae Hwan LEE, Min Su KIM
  • Publication number: 20240151361
    Abstract: A hydrogen supply method includes a two-side heat exchange mode in which both introducing a second fluid into a hydrogen storage part after the second fluid exchanges heat with a first fluid in a second heat exchanger in a state in which a compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in a thermal device are performed. The method also includes a one-side heat exchange mode in which one of introducing the second fluid into the hydrogen storage part after the second fluid exchanges heat with the first fluid in the second heat exchanger in a state in which the compressor is driven to compress the first fluid and introducing the second fluid into the hydrogen storage part after the second fluid is heated or cooled in the thermal device is performed.
    Type: Application
    Filed: August 30, 2023
    Publication date: May 9, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Yeon Ho Kim, Hoon Mo Park, Kyung Moon Lee, Dong Hoon Nam, Ji Hye Park, Young Jin Cho, Jea Wan Kim, Byeong Soo Shin, Ji Hoon Lee, Ho Young Jeong, Suk Hoon Hong, Man Hee Park, Yeong Jun Kim, Jae Yeon Kim, Ho Chan An
  • Publication number: 20240151440
    Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.
    Type: Application
    Filed: May 10, 2023
    Publication date: May 9, 2024
    Inventors: Wan Je Cho, Namho Park, Seong-Bin Jeong, Yeonho Kim, Tae Hee Kim, Jae-Eun Jeong, Man Hee Park, Jae Yeon Kim, Hyunjae Lee, Seong Woo Jeong, Jung Bum Choi, Ho Sung Kang, Jeong Wan Han
  • Patent number: 11978654
    Abstract: The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 7, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Min Sung Han, Wan Jae Park, Yoon Jong Ju, Jaehoo Lee
  • Patent number: 11975091
    Abstract: A composition for enhancing protein strength according to the present invention contains an aminosilane compound capable of covalent binding with a protein of hair, scalp, skin, nails, leather, or textile, so that the protein and the amino silane compound form a covalent bond, and thus the composition can improve the protein strength enhancement effect and maximize the semi-permanent protein strength enhancement effect.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: May 7, 2024
    Assignee: LG Household & Health Care Ltd.
    Inventors: Seong Kil Son, Won Kyung Choi, Dong Wan Kim, Ji Hee Yoo, Jeong Rae Lee, Sang Min Lee
  • Publication number: 20240142322
    Abstract: A battery pressure measuring sensor according to an embodiment of the present disclosure includes a substrate; a plurality of variable resistor units provided at a plurality of locations in consideration of a swelling characteristic of a battery on the substrate and configured to change a resistance value within a corresponding resistance range according to a pressure applied to each unit; and a plurality of sensing lines configured to be connected to the plurality of variable resistor units, respectively.
    Type: Application
    Filed: November 16, 2022
    Publication date: May 2, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Ki-Young Lee, Dong-Wan Ko, Do-Yul Kim, Hye-Yun Bae
  • Publication number: 20240147620
    Abstract: The present disclosure relates to a printed circuit board including, a first insulating layer, a first metal layer disposed on the first insulating layer, a bridge disposed on the first metal layer and including a bridge insulating layer and a bridge circuit layer, a second insulating layer disposed on the first insulating layer and covering at least a portion of the bridge, a second metal layer disposed on the second insulating layer, and a connecting via penetrating the bridge and the second insulating layer to connect the first metal layer to the second insulating layer. The connecting via is spaced apart from the bridge circuit layer.
    Type: Application
    Filed: April 17, 2023
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk LEE, Youn Gyu HAN, Jin Oh PARK, Yong Wan JI, Yong Duk LEE, Eun Sun KIM
  • Publication number: 20240145935
    Abstract: An antenna apparatus includes: a parabolic reflector; a dielectric support pedestal; a sub-reflector connected to an upper part of the dielectric support pedestal; and a waveguide connected to a lower part of the dielectric support pedestal, wherein the parabolic reflector has a curved surface in which a ratio of a focal length to a diameter is greater than a preset value, and at least one corrugation configured to suppress a cross polarization is formed in a region of the dielectric support pedestal.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 2, 2024
    Inventors: Byung Chul PARK, Seung Ho KIM, Kun Sup KWON, Jong Wan HEO, Sung Jae LEE, Ki Min HWANG
  • Publication number: 20240145268
    Abstract: A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 2, 2024
    Inventors: Jun Woo Park, Gyu Hyeong Kim, Seung Hwan Kim, Jung Joo Kim, Jong Wan Kim, Yong Kwan Lee
  • Publication number: 20240135147
    Abstract: A device including processors configured to execute instructions and memories storing the instructions, which when executed by the processors configure the processors to perform an operation for training a transformer model having a plurality of encoders and a plurality of decoders by configuring the processors to identify the batches of training data into a plurality of micro-batches, select layer pairs for the plurality of micro-batches, assemble a processing order of the layer pairs, determining resource information to be allocated to the layer pairs, and allocate resources to the layer pairs based on the determined resource information to be allocated to the layer pairs, dependent con the processing order of the layer pairs.
    Type: Application
    Filed: August 15, 2023
    Publication date: April 25, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., Seoul National University R&DB Foundation
    Inventors: Jung Ho AHN, Sun Jung LEE, Jae Wan CHOI
  • Publication number: 20240135863
    Abstract: A display device includes a display unit including pixels connected to data lines and scan lines, first and second temperature sensors for sensing first and second temperatures of the display unit, a data driver configured to generate a data signal configured to be supplied to the data lines using output data, and attached to a first printed circuit board configured to be fixed to a rear surface of the display unit, a timing controller configured to generate the output data using input data, and attached to a second printed circuit board configured to be fixed to the rear surface of the display unit, and a storage having a temperature weight table including a weight corresponding to the first and second temperatures and a plurality of temperature tables including temperature information of the display unit corresponding to an attachment position of the second printed circuit board.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 25, 2024
    Inventors: Won Jin SEO, Tae Wan KIM, Hwa An SUNG, Hyun Sik YOON, Jeong Ah LEE, Dae Ho HWANG
  • Publication number: 20240136482
    Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(?0)/log(?28 )) of the logarithm of the viscosity ((log(?0)) of the composite encapsulation material at the shear rate of 1×10?3 s?1 to the logarithm of the viscosity (log(??)) of the composite encapsulation material at the shear rate of 1×102 s?1 is 1.1-2.5.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Inventors: Deng Kong SOH, Wen Wan TAI, Yu-Chun LEE
  • Patent number: 11967381
    Abstract: A semiconductor memory device includes a memory cell array, a row decoder, a plurality of page buffers, and a voltage switching circuit. The memory cell array includes a plurality of memory cells. The row decoder is connected to the memory cell array through word lines. The plurality of page buffers are connected to the memory cell array through bit lines. The voltage switching circuit decodes an operation voltage and transmits the decoded operation voltage to the row decoder. The plurality of page buffers are formed in a first under cell region among first and second under cell regions, the first and second under cell regions being adjacent to each other in a first direction under the memory cell array. At least a portion of the voltage switching circuit is formed in an under slim region that is adjacent to the first under cell region and the second under cell region in a second direction.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: April 23, 2024
    Assignee: SK hynix Inc.
    Inventors: Seung Wan Chae, Young Ki Kim, Jong Il Lee, Eun Woo Jo
  • Patent number: 11966712
    Abstract: Provided are a server and a method for providing a multilingual subtitle service using an artificial intelligence learning model, and a method for controlling the server. The server includes: a communication unit configured to perform data communication with either or both of a first user terminal device of a client requesting translation of a content image and a second user terminal device of a worker performing a translation task; a storage configured to store a worker search list based on learned worker information, and an artificial intelligence learning model for performing a worker's task performance evaluation; and a controller configured to input image information on the content image to the artificial intelligence learning model in accordance with a worker recommendation command of the client to acquire a worker list of workers capable of translating the content image, and control the communication unit to transmit the acquired worker list to the first user terminal device.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 23, 2024
    Assignee: GLOZ INC.
    Inventors: Kug Koung Lee, Ho Kyun Kim, Bong Wan Kim
  • Publication number: 20240129890
    Abstract: An indoor wireless positioning method according to one embodiment of the present invention includes receiving initial received signal strength indicator (RSSI) information from a reception unit; searching for a fingerprint matching measured initial RSSI information in a fingerprint database; determining a first location corresponding to the retrieved fingerprint to be an initial location of the reception unit; receiving additional RSSI information from the reception unit; extracting features of variability between the additional RSSI information and the initial RSSI information; searching for variability fingerprints matching the initial location and extracted RSSI variability features in a variability fingerprint database; and updating a second location to a current location of the reception unit when the second location corresponding to the retrieved variability fingerprint is different from the initial location, wherein the second location is a location in a candidate area within a preset distance range ce
    Type: Application
    Filed: July 19, 2023
    Publication date: April 18, 2024
    Applicants: SKAIChips Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Kang Yoon LEE, Dong Gyun KIM, Ju Won OH, Jong Wan JO
  • Patent number: 11963410
    Abstract: A display device includes a substrate including a pixel region and a peripheral region. A plurality of pixels is disposed in the pixel region of the substrate. Each of the plurality of pixels includes a light emitting element. Data lines and scan lines are connected to each of the plurality of pixels. A power line is configured to supply power to the plurality of pixels. The power line includes a plurality of first conductive lines and a plurality of second conductive lines intersecting the plurality of first conductive lines. The plurality of second conductive lines is arranged in a region between adjacent light emitting elements of the plurality of pixels. At least some of the plurality of second conductive lines extend in a direction oblique to a direction of extension of the data lines or the scan lines.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Yang Wan Kim, Byung Sun Kim, Jae Yong Lee, Chung Yi, Hyung Jun Park, Su Jin Lee
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 11963445
    Abstract: Provided are a compound capable of improving the light-emitting efficiency, stability, and lifespan of an element; an organic electronic element using same; and an electronic device thereof.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: April 16, 2024
    Assignee: DUK SAN NEOLUX CO., LTD.
    Inventors: Ji Hyun Park, Se Hoon Lee, Jae Wan Jang, Hyung Dong Lee, Yun Suk Lee