Patents by Inventor Wan Zhang
Wan Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240209222Abstract: An electroluminescent flexographic printing ink and a preparation method thereof. The ink includes, in parts by weight, the following components: 0.5 parts to 2 parts by weight of an electroluminescent material; 120 parts to 150 parts by weight of a monomer; 10 parts to 20 parts by weight of a prepolymer; and 0 part to 5 parts by weight of a leveling agent; wherein the electroluminescent ink for flexographic printing of the luminescent layer of the electroluminescent device does not comprise a pigment; and the electroluminescent ink for flexographic printing of the luminescent layer of the electroluminescent device has a particle size of less than 0.1 ?m, a viscosity of 20 cP to 2,000 cP at 25° C., a surface tension of 18 mN/m to 37 mN/m at 25° C., and a curing time of 10 min to 30 min.Type: ApplicationFiled: December 21, 2023Publication date: June 27, 2024Inventors: Beiqing HUANG, Xiangu WEI, Yongjian WU, Wan ZHANG, Yingqun QI, Yusheng LIAN, Yingjie XU, Hui Wang, Yun QIAO, Lijuan LIANG, Linhong HUANG, Yuxin WANG, Chuangji LIU
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Publication number: 20240113248Abstract: An optical sensor device and a packaging method thereof are disclosed. The optical filter structure includes a light-emitting module, a first structure, a second structure and a mask layer. The first and second structures are formed on opposing ends of light-emitting module and cover portions of light-emitting module. The light-emitting module includes a light exit region, a photosensitive member and an optical filter layer. The light exit region and photosensitive member are both located on a side of light-emitting module close to first structure, the first structure exposes light exit region and photosensitive member. The optical filter layer wraps exposed portion of photosensitive member. The mask layer is arranged on first structure and surface of light-emitting module facing first structure, and the mask layer exposes light exit region and photosensitive member, avoiding influence of external light on optical sensor device through mask layer.Type: ApplicationFiled: October 26, 2022Publication date: April 4, 2024Inventors: Deze YU, Wanning ZHANG
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Publication number: 20240061084Abstract: A driver chip, a packaging method for optical filter structure, an optical sensor device and a packaging method for optical sensor device are disclosed. The packaging method for optical filter structure includes providing first carrier substrate, one side of first carrier substrate provided with first adhesive layer; placing at least one first optical filter and at least one second optical filter on first adhesive layer in such a manner that first and second optical filters are spaced apart from each other; filling plastic encapsulation material between first and second optical filters and curing plastic encapsulation material to form a first plastic encapsulation layer. Opposing sides of the first optical filter and opposing sides of the second optical filter are exposed from the first plastic encapsulation layer; and removing the first carrier substrate. In this way, optical sensor device is allowed to have a reduced size, which results in space savings.Type: ApplicationFiled: August 22, 2022Publication date: February 22, 2024Inventors: Deze YU, Wanning ZHANG
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Patent number: 11282879Abstract: An image sensor packaging method, an image sensor packaging structure and a lens module are disclosed by the present invention provides. With the image sensor packaging method, a plurality of image sensor chips are embedded in a molding layer, thus allowing a greatly reduced thickness and improved slimness of the resulting packaging structure. Moreover, in this packaging method, instead of bonding wires, solder pads are externally connected by thin film metal layer formed on non-photosensitive surface area located on the same side as light-sensing surfaces. This allows a reduced impact on the light-sensing surfaces as well as a shorter distance from each solder pad to a corresponding one of the light-sensing surfaces along the direction parallel to the light-sensing surfaces, when compared to the use of bonding wires.Type: GrantFiled: September 29, 2018Date of Patent: March 22, 2022Assignee: INNO-PACH TECHNOLOGY PTE LTDInventors: Liping Chang, Deze Yu, Wanning Zhang
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Patent number: 10937767Abstract: Disclosed herein are a chip packaging method and a device with packaged chips. The method includes: providing a support plate attached thereon with a first bonding layer; placing a plurality of chips onto the first bonding layer at intervals; performing a plastic packaging process to form a plastic packaging layer filling the gaps between the chips over the support plate, so that the plastic packaged chips are formed; removing the support plate and the first bonding layer to form the plastic packaged chips; forming an insulating layer over the plastic packaged chips, forming openings in the insulating layer and depositing metal in the openings to form a metal conducting layer and an interconnect circuitry; dicing the plastic packaged chips into a plurality of modules. The method reduces the distances between the chips, reduces the size of terminal products, and facilitates the miniaturization of the terminal products.Type: GrantFiled: March 21, 2017Date of Patent: March 2, 2021Assignee: INNO-PACH TECHNOLOGY PTE LTDInventors: Wanning Zhang, Deze Yu
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Patent number: 10889907Abstract: Cyanide-free acidic silver electroplating compositions include one or more acids or salts of tellurium and may be used to electroplate matte silver deposits on metals, such as nickel, copper or copper alloys. Matte silver metal may be electroplated at conventional plating rates or at high plating rates, such as in reel-to-reel and jet plating. The cyanide-free acidic silver electroplating compositions may be used to electroplate matte silver in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, optical devices and decorative applications.Type: GrantFiled: February 21, 2014Date of Patent: January 12, 2021Assignee: Rohm and Haas Electronic Materials LLCInventors: Adolphe Foyet, Wan Zhang-Beglinger, Margit Clauss
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Publication number: 20200343284Abstract: An image sensor packaging method, an image sensor packaging structure and a lens module are disclosed by the present invention provides. With the image sensor packaging method, a plurality of image sensor chips are embedded in a molding layer, thus allowing a greatly reduced thickness and improved slimness of the resulting packaging structure. Moreover, in this packaging method, instead of bonding wires, solder pads are externally connected by thin film metal layer formed on non-photosensitive surface area located on the same side as light-sensing surfaces. This allows a reduced impact on the light-sensing surfaces as well as a shorter distance from each solder pad to a corresponding one of the light-sensing surfaces along the direction parallel to the light-sensing surfaces, when compared to the use of bonding wires.Type: ApplicationFiled: September 29, 2018Publication date: October 29, 2020Inventors: Liping CHANG, Deze YU, Wanning ZHANG
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Patent number: 10777718Abstract: A display device and a method for packaging the display device are disclosed. The display device includes an optical module including multiple light-emitting units disposed apart from one another and a first plastic layer. Each light-emitting unit includes at least three LEDs, and the first plastic layer fills the gaps between the light-emitting units. The display device further includes a driver IC including a second plastic layer, driving chips, through-holes, a first structure and a second structure. The second plastic layer fills the gaps between the driving chips, and the second plastic layer has a third layer. The through-holes penetrate through the second plastic layer along a thickness direction of the through-holes and are filled with a conductive material. The first structure is electrically connected to the driving chips and to the conductive material in the through-holes. The second structure is electrically connected to the conductive material in the through-holes.Type: GrantFiled: March 14, 2019Date of Patent: September 15, 2020Assignee: INNO-PACH TECHNOLOGY PTE LTD.Inventors: Deze Yu, Wanning Zhang
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Patent number: 10727260Abstract: An image sensor packaging method, an image sensor package and a lens module are disclosed. In the image sensor packaging method, plural image sensor dies are formed within a molded layer, resulting in a package with a significantly reduced thickness which is favorable to the slimming of the package. The packaging method does not involve any wire bonding process. Instead, metal pads are led out through a thin metal film formed in non-photosensitive areas on the same side of micro lens surfaces of the image sensor dies. This approach has a less adverse impact on micro lens surfaces and, compared to the wire bonding process, allows a smaller spacing from metal pads to the micro lens surfaces with respect to a direction parallel to the micro lens surfaces, which enables more compact image sensor dies usable in a lens module for an optimized spatial design and ease of miniaturization.Type: GrantFiled: February 26, 2018Date of Patent: July 28, 2020Assignee: Inno-Pach Technology Pte Ltd.Inventors: Liping Chang, Deze Yu, Wanning Zhang
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Patent number: 10624604Abstract: This disclosure relates to medical diagnostic high-frequency X-ray machines and power supply devices thereof. One power supply device can convert an alternating current into a direct current, which is further raised by a boost circuit and stored by a capacitor module, so that the power supply device can provide high voltage and sufficient power to an inverter. Another power supply device can use a lithium iron phosphate battery to power the X-ray machine. Accordingly, the X-ray machine can be lighter, smaller, resistant to high temperature, fast in electrical charging and discharging, and safer, and the usage life of the X-ray machine can be prolonged due to the long cycle life of the lithium iron phosphate battery.Type: GrantFiled: October 13, 2016Date of Patent: April 21, 2020Assignee: Shenzhen Mindray Bio-Medical Electronics Co., Ltd.Inventors: Wan Zhang, Xuedong Liu
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Publication number: 20200119243Abstract: A display device and a method for packaging the display device are disclosed. The display device includes an optical module including multiple light-emitting units disposed apart from one another and a first plastic layer. Each light-emitting unit includes at least three LEDs, and the first plastic layer fills the gaps between the light-emitting units. The display device further includes a driver IC including a second plastic layer, driving chips, through-holes, a first structure and a second structure. The second plastic layer fills the gaps between the driving chips, and the second plastic layer has a third layer. The through-holes penetrate through the second plastic layer along a thickness direction of the through-holes and are filled with a conductive material. The first structure is electrically connected to the driving chips and to the conductive material in the through-holes. The second structure is electrically connected to the conductive material in the through-holes.Type: ApplicationFiled: March 14, 2019Publication date: April 16, 2020Inventors: Deze YU, Wanning ZHANG
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Patent number: 10610561Abstract: The present invention provides a pharmaceutical composition or a cosmetic product which can accelerate production of ceramide in cells. The ceramide production-accelerating agent contains a plant selected from the group consisting of Radix Heraclei Scabridi, Rhizoma Dioscoreae, Radix Rehmanniae, Rhizoma Atractylodis Macrocephalae, Radix Glycyrrhizae, Radix Et Rhizoma Rhei, Pseudobulbus Bletillae, Radix Polygoni Multiflori, Radix Platycodi, and Herba Leonuri, or an extract thereof as an active ingredient. Further, the present invention provides a moisturizing agent containing a plant selected from the group consisting of Herba Leonuri and Rhizoma Dioscoreae, or an extract thereof as an active ingredient.Type: GrantFiled: January 20, 2015Date of Patent: April 7, 2020Assignees: Zhongshan Hospital of Fudan University, Kao CorporationInventors: Wan Zhang Qin, Chun Xin Yang, Fan Qi Kong, Hiroshi Nojiri, Shotaro Ito
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Publication number: 20190385986Abstract: Disclosed herein are a chip packaging method and a device with packaged chips. The method includes: providing a support plate attached thereon with a first bonding layer; placing a plurality of chips onto the first bonding layer at intervals; performing a plastic packaging process to form a plastic packaging layer filling the gaps between the chips over the support plate, so that the plastic packaged chips are formed; removing the support plate and the first bonding layer to form the plastic packaged chips; forming an insulating layer over the plastic packaged chips, forming openings in the insulating layer and depositing metal in the openings to form a metal conducting layer and an interconnect circuitry; dicing the plastic packaged chips into a plurality of modules. The method reduces the distances between the chips, reduces the size of terminal products, and facilitates the miniaturization of the terminal products.Type: ApplicationFiled: March 21, 2017Publication date: December 19, 2019Inventors: Wanning ZHANG, Deze YU
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Publication number: 20190123081Abstract: An image sensor packaging method, an image sensor package and a lens module are disclosed. In the image sensor packaging method, plural image sensor dies are formed within a molded layer, resulting in a package with a significantly reduced thickness which is favorable to the slimming of the package. The packaging method does not involve any wire bonding process. Instead, metal pads are led out through a thin metal film formed in non-photosensitive areas on the same side of micro lens surfaces of the image sensor dies. This approach has a less adverse impact on micro lens surfaces and, compared to the wire bonding process, allows a smaller spacing from metal pads to the micro lens surfaces with respect to a direction parallel to the micro lens surfaces, which enables more compact image sensor dies usable in a lens module for an optimized spatial design and ease of miniaturization.Type: ApplicationFiled: February 26, 2018Publication date: April 25, 2019Inventors: Liping CHANG, Deze YU, Wanning ZHANG
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Publication number: 20170027537Abstract: This disclosure relates to medical diagnostic high-frequency X-ray machines and power supply devices thereof. One power supply device can convert an alternating current into a direct current, which is further raised by a boost circuit and stored by a capacitor module, so that the power supply device can provide high voltage and sufficient power to an inverter. Another power supply device can use a lithium iron phosphate battery to power the X-ray machine. Accordingly, the X-ray machine can be lighter, smaller, resistant to high temperature, fast in electrical charging and discharging, and safer, and the usage life of the X-ray machine can be prolonged due to the long cycle life of the lithium iron phosphate battery.Type: ApplicationFiled: October 13, 2016Publication date: February 2, 2017Inventors: Wan ZHANG, Xuedong LIU
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Patent number: 9512529Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.Type: GrantFiled: June 4, 2013Date of Patent: December 6, 2016Inventors: Adolphe Foyet, Margit Clauss, Wan Zhang-Beglinger, Julia Woertink, Yi Qin, Jonathan Prange, Pedro O Lopez Montesinos
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Patent number: 9506150Abstract: The plastisol coated plating tools are used to secure polymer containing substrates in electroless plating baths during electroless plating of the polymers. To prevent metallization of the plastisol coated plating tools during electroless metallization, compositions of sulfur compounds are applied to the plastisol. After metallization the plastisol coated plating tools may be re-used without the need to strip the unwanted metal from the tools.Type: GrantFiled: October 1, 2015Date of Patent: November 29, 2016Inventors: Katharina Weitershaus, Andreas Scheybal, Wan Zhang-Beglinger
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Patent number: 9435046Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.Type: GrantFiled: June 22, 2013Date of Patent: September 6, 2016Inventors: Wan Zhang-Beglinger, Margit Clauss, Jonas Guebey, Felix J. Schwager
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Publication number: 20160102403Abstract: The plastisol coated plating tools are used to secure polymer containing substrates in electroless plating baths during electroless plating of the polymers. To prevent metallization of the plastisol coated plating tools during electroless metallization, compositions of sulfur compounds are applied to the plastisol. After metallization the plastisol coated plating tools may be re-used without the need to strip the unwanted metal from the tools.Type: ApplicationFiled: October 1, 2015Publication date: April 14, 2016Inventors: Katharina Weitershaus, Andreas Scheybal, Wan Zhang-Beglinger
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Patent number: 9267077Abstract: A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.Type: GrantFiled: April 16, 2013Date of Patent: February 23, 2016Inventors: Katharina Weitershaus, Wan Zhang-Beglinger, Andreas Scheybal, Jonas Guebey