Abstract: An electroluminescent flexographic printing ink and a preparation method thereof. The ink includes, in parts by weight, the following components: 0.5 parts to 2 parts by weight of an electroluminescent material; 120 parts to 150 parts by weight of a monomer; 10 parts to 20 parts by weight of a prepolymer; and 0 part to 5 parts by weight of a leveling agent; wherein the electroluminescent ink for flexographic printing of the luminescent layer of the electroluminescent device does not comprise a pigment; and the electroluminescent ink for flexographic printing of the luminescent layer of the electroluminescent device has a particle size of less than 0.1 ?m, a viscosity of 20 cP to 2,000 cP at 25° C., a surface tension of 18 mN/m to 37 mN/m at 25° C., and a curing time of 10 min to 30 min.

Abstract: An optical sensor device and a packaging method thereof are disclosed. The optical filter structure includes a light-emitting module, a first structure, a second structure and a mask layer. The first and second structures are formed on opposing ends of light-emitting module and cover portions of light-emitting module. The light-emitting module includes a light exit region, a photosensitive member and an optical filter layer. The light exit region and photosensitive member are both located on a side of light-emitting module close to first structure, the first structure exposes light exit region and photosensitive member. The optical filter layer wraps exposed portion of photosensitive member. The mask layer is arranged on first structure and surface of light-emitting module facing first structure, and the mask layer exposes light exit region and photosensitive member, avoiding influence of external light on optical sensor device through mask layer.

Abstract: A driver chip, a packaging method for optical filter structure, an optical sensor device and a packaging method for optical sensor device are disclosed. The packaging method for optical filter structure includes providing first carrier substrate, one side of first carrier substrate provided with first adhesive layer; placing at least one first optical filter and at least one second optical filter on first adhesive layer in such a manner that first and second optical filters are spaced apart from each other; filling plastic encapsulation material between first and second optical filters and curing plastic encapsulation material to form a first plastic encapsulation layer. Opposing sides of the first optical filter and opposing sides of the second optical filter are exposed from the first plastic encapsulation layer; and removing the first carrier substrate. In this way, optical sensor device is allowed to have a reduced size, which results in space savings.

Abstract: An image sensor packaging method, an image sensor packaging structure and a lens module are disclosed by the present invention provides. With the image sensor packaging method, a plurality of image sensor chips are embedded in a molding layer, thus allowing a greatly reduced thickness and improved slimness of the resulting packaging structure. Moreover, in this packaging method, instead of bonding wires, solder pads are externally connected by thin film metal layer formed on non-photosensitive surface area located on the same side as light-sensing surfaces. This allows a reduced impact on the light-sensing surfaces as well as a shorter distance from each solder pad to a corresponding one of the light-sensing surfaces along the direction parallel to the light-sensing surfaces, when compared to the use of bonding wires.

Abstract: Disclosed herein are a chip packaging method and a device with packaged chips. The method includes: providing a support plate attached thereon with a first bonding layer; placing a plurality of chips onto the first bonding layer at intervals; performing a plastic packaging process to form a plastic packaging layer filling the gaps between the chips over the support plate, so that the plastic packaged chips are formed; removing the support plate and the first bonding layer to form the plastic packaged chips; forming an insulating layer over the plastic packaged chips, forming openings in the insulating layer and depositing metal in the openings to form a metal conducting layer and an interconnect circuitry; dicing the plastic packaged chips into a plurality of modules. The method reduces the distances between the chips, reduces the size of terminal products, and facilitates the miniaturization of the terminal products.

Abstract: Cyanide-free acidic silver electroplating compositions include one or more acids or salts of tellurium and may be used to electroplate matte silver deposits on metals, such as nickel, copper or copper alloys. Matte silver metal may be electroplated at conventional plating rates or at high plating rates, such as in reel-to-reel and jet plating. The cyanide-free acidic silver electroplating compositions may be used to electroplate matte silver in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, optical devices and decorative applications.

Abstract: An image sensor packaging method, an image sensor packaging structure and a lens module are disclosed by the present invention provides. With the image sensor packaging method, a plurality of image sensor chips are embedded in a molding layer, thus allowing a greatly reduced thickness and improved slimness of the resulting packaging structure. Moreover, in this packaging method, instead of bonding wires, solder pads are externally connected by thin film metal layer formed on non-photosensitive surface area located on the same side as light-sensing surfaces. This allows a reduced impact on the light-sensing surfaces as well as a shorter distance from each solder pad to a corresponding one of the light-sensing surfaces along the direction parallel to the light-sensing surfaces, when compared to the use of bonding wires.

Abstract: A display device and a method for packaging the display device are disclosed. The display device includes an optical module including multiple light-emitting units disposed apart from one another and a first plastic layer. Each light-emitting unit includes at least three LEDs, and the first plastic layer fills the gaps between the light-emitting units. The display device further includes a driver IC including a second plastic layer, driving chips, through-holes, a first structure and a second structure. The second plastic layer fills the gaps between the driving chips, and the second plastic layer has a third layer. The through-holes penetrate through the second plastic layer along a thickness direction of the through-holes and are filled with a conductive material. The first structure is electrically connected to the driving chips and to the conductive material in the through-holes. The second structure is electrically connected to the conductive material in the through-holes.

Abstract: An image sensor packaging method, an image sensor package and a lens module are disclosed. In the image sensor packaging method, plural image sensor dies are formed within a molded layer, resulting in a package with a significantly reduced thickness which is favorable to the slimming of the package. The packaging method does not involve any wire bonding process. Instead, metal pads are led out through a thin metal film formed in non-photosensitive areas on the same side of micro lens surfaces of the image sensor dies. This approach has a less adverse impact on micro lens surfaces and, compared to the wire bonding process, allows a smaller spacing from metal pads to the micro lens surfaces with respect to a direction parallel to the micro lens surfaces, which enables more compact image sensor dies usable in a lens module for an optimized spatial design and ease of miniaturization.

Abstract: This disclosure relates to medical diagnostic high-frequency X-ray machines and power supply devices thereof. One power supply device can convert an alternating current into a direct current, which is further raised by a boost circuit and stored by a capacitor module, so that the power supply device can provide high voltage and sufficient power to an inverter. Another power supply device can use a lithium iron phosphate battery to power the X-ray machine. Accordingly, the X-ray machine can be lighter, smaller, resistant to high temperature, fast in electrical charging and discharging, and safer, and the usage life of the X-ray machine can be prolonged due to the long cycle life of the lithium iron phosphate battery.

Abstract: A display device and a method for packaging the display device are disclosed. The display device includes an optical module including multiple light-emitting units disposed apart from one another and a first plastic layer. Each light-emitting unit includes at least three LEDs, and the first plastic layer fills the gaps between the light-emitting units. The display device further includes a driver IC including a second plastic layer, driving chips, through-holes, a first structure and a second structure. The second plastic layer fills the gaps between the driving chips, and the second plastic layer has a third layer. The through-holes penetrate through the second plastic layer along a thickness direction of the through-holes and are filled with a conductive material. The first structure is electrically connected to the driving chips and to the conductive material in the through-holes. The second structure is electrically connected to the conductive material in the through-holes.

Abstract: The present invention provides a pharmaceutical composition or a cosmetic product which can accelerate production of ceramide in cells. The ceramide production-accelerating agent contains a plant selected from the group consisting of Radix Heraclei Scabridi, Rhizoma Dioscoreae, Radix Rehmanniae, Rhizoma Atractylodis Macrocephalae, Radix Glycyrrhizae, Radix Et Rhizoma Rhei, Pseudobulbus Bletillae, Radix Polygoni Multiflori, Radix Platycodi, and Herba Leonuri, or an extract thereof as an active ingredient. Further, the present invention provides a moisturizing agent containing a plant selected from the group consisting of Herba Leonuri and Rhizoma Dioscoreae, or an extract thereof as an active ingredient.

Abstract: Disclosed herein are a chip packaging method and a device with packaged chips. The method includes: providing a support plate attached thereon with a first bonding layer; placing a plurality of chips onto the first bonding layer at intervals; performing a plastic packaging process to form a plastic packaging layer filling the gaps between the chips over the support plate, so that the plastic packaged chips are formed; removing the support plate and the first bonding layer to form the plastic packaged chips; forming an insulating layer over the plastic packaged chips, forming openings in the insulating layer and depositing metal in the openings to form a metal conducting layer and an interconnect circuitry; dicing the plastic packaged chips into a plurality of modules. The method reduces the distances between the chips, reduces the size of terminal products, and facilitates the miniaturization of the terminal products.

Abstract: An image sensor packaging method, an image sensor package and a lens module are disclosed. In the image sensor packaging method, plural image sensor dies are formed within a molded layer, resulting in a package with a significantly reduced thickness which is favorable to the slimming of the package. The packaging method does not involve any wire bonding process. Instead, metal pads are led out through a thin metal film formed in non-photosensitive areas on the same side of micro lens surfaces of the image sensor dies. This approach has a less adverse impact on micro lens surfaces and, compared to the wire bonding process, allows a smaller spacing from metal pads to the micro lens surfaces with respect to a direction parallel to the micro lens surfaces, which enables more compact image sensor dies usable in a lens module for an optimized spatial design and ease of miniaturization.

Abstract: This disclosure relates to medical diagnostic high-frequency X-ray machines and power supply devices thereof. One power supply device can convert an alternating current into a direct current, which is further raised by a boost circuit and stored by a capacitor module, so that the power supply device can provide high voltage and sufficient power to an inverter. Another power supply device can use a lithium iron phosphate battery to power the X-ray machine. Accordingly, the X-ray machine can be lighter, smaller, resistant to high temperature, fast in electrical charging and discharging, and safer, and the usage life of the X-ray machine can be prolonged due to the long cycle life of the lithium iron phosphate battery.

Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Abstract: The plastisol coated plating tools are used to secure polymer containing substrates in electroless plating baths during electroless plating of the polymers. To prevent metallization of the plastisol coated plating tools during electroless metallization, compositions of sulfur compounds are applied to the plastisol. After metallization the plastisol coated plating tools may be re-used without the need to strip the unwanted metal from the tools.

Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

Abstract: The plastisol coated plating tools are used to secure polymer containing substrates in electroless plating baths during electroless plating of the polymers. To prevent metallization of the plastisol coated plating tools during electroless metallization, compositions of sulfur compounds are applied to the plastisol. After metallization the plastisol coated plating tools may be re-used without the need to strip the unwanted metal from the tools.

Abstract: A chrome-free acidic aqueous solution of sulfuric acid and one or more organic acids and manganese (II) and (III) ions is applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.