Abstract: A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.

Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.

Abstract: Cyanide-free acidic silver electroplating compositions include one or more acids or salts of tellurium and may be used to electroplate matte silver deposits on metals, such as nickel, copper or copper alloys. Matte silver metal may be electroplated at conventional plating rates or at high plating rates, such as in reel-to-reel and jet plating. The cyanide-free acidic silver electroplating compositions may be used to electroplate matte silver in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, optical devices and decorative applications.

Abstract: A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Abstract: The present invention provides a pharmaceutical composition or a cosmetic product which can accelerate production of ceramide in cells. The ceramide production-accelerating agent contains a plant selected from the group consisting of Radix Heraclei Scabridi, Rhizoma Dioscoreae, Radix Rehmanniae, Rhizoma Atractylodis Macrocephalae, Radix Glycyrrhizae, Radix Et Rhizoma Rhei, Pseudobulbus Bletillae, Radix Polygoni Multiflori, Radix Platycodi, and Herba Leonuli, or an extract thereof as an active ingredient. Further, the present invention provides a moisturizing agent containing a plant selected from the group consisting of Herba Leonuri and Rhizoma Dioscoreae, or an extract thereof as an active ingredient.

Abstract: Silver and tin alloy electroplating baths include complexing agents which enable the electroplating of either silver rich or tin rich alloys. The silver and tin alloy electroplating baths are substantially free of lead. They may be used to electroplate silver and tin alloys in the manufacture of electronic components such as electrical connectors, finishing layers for metallic substrates, decorative applications and solder bumps.

Abstract: The present invention regards compositions and methods for treating chronic lymphocytic leukemia in the in vivo tissue environment using selenium-containing compositions. In particular aspects, a selenium-comprising compound is administered to an individual wherein the CLL cells are in a stromal cell environment, wherein stromal factors modulate the selenium comprising compound to enhance its activity.

Abstract: A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.

Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Abstract: A chrome-free composition of an acidic suspension of manganese compounds and manganese ions are applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.

Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.

Abstract: A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.

Abstract: A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.

Abstract: A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly.

Abstract: The present invention provides a pharmaceutical composition or a cosmetic product which can accelerate production of ceramide in cells. The ceramide production-accelerating agent contains a plant selected from the group consisting of Radix Heraclei Scabridi, Rhizoma Dioscoreae, Radix Rehmanniae, Rhizoma Atractylodis Macrocephalae, Radix Glycyrrhizae, Radix Et Rhizoma Rhei, Pseudobulbus Bletillae, Radix Polygoni Multiflori, Radix Platycodi, and Herba Leonuli, or an extract thereof as an active ingredient. Further, the present invention provides a moisturizing agent containing a plant selected from the group consisting of Herba Leonuri and Rhizoma Dioscoreae, or an extract thereof as an active ingredient.

Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.

Abstract: A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.

Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.