Patents by Inventor Wan Zhang

Wan Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin plating method
    Publication number: 20040118696
    Abstract: Methods of electrodepositing layers of tin or tin-alloys on a substrate are provided. The methods involve electrolytically treating a substrate with a solution comprising a phosphoric acid and a carboxylic acid, and electrodepositing a layer of tin or tin-alloy on a surface of the treated substrate. The methods can provide tin or tin-alloy layers having a reduced tendency to form whiskers.
    Type: Application
    Filed: September 13, 2003
    Publication date: June 24, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Wan Zhang, Andre Egli, Jochen Heber, Felix Schwager
  • Metal alloy compositions and plating methods related thereto
    Publication number: 20040086697
    Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;, &pgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Application
    Filed: July 16, 2003
    Publication date: May 6, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
  • Metal alloy compositions and plating methods related thereto
    Patent number: 6706418
    Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: March 16, 2004
    Assignee: Shipley Company L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang
  • Metal alloy compositions and plating methods related thereto
    Publication number: 20020153260
    Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.
    Type: Application
    Filed: June 29, 2001
    Publication date: October 24, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Andre Egli, Anja Vinckier, Jochen Heber, Wan Zhang