Abstract: A method for growing flat, low defect density, and strain-free thick non-polar III-V nitride materials and devices on any suitable foreign substrates using a fabricated nano-pores and nano-network compliant layer with an HVPE, MOCVD, and integrated HVPE/MOCVD growth process in a manner that minimum growth will occur in the nano-pores is provided. The method produces nano-networks made of the non-polar III-V nitride material and the substrate used to grow it where the network is continuous along the surface of the template, and where the nano-pores can be of any shape.

Abstract: A method for growing flat, low defect density, and strain-free thick non-polar III-V nitride materials and devices on any suitable foreign substrates using a fabricated nanocolumns compliant layer with an HVPE growth process is provided. The method uses a combination of dry and wet etching to create nanocolumns consisting of layers of non-polar III nitride material and other insulating materials or materials used to grow the non-polar III-V nitride materials.

Abstract: Deposited layers are advantageously obtained by utilizing a specific hydride vapour phase epitaxy deposition procedure. In this procedure, a vertical growth cell structure with extended diffusion layer, a homogenising diaphragm, sidewall purging gases, anal independent gas and substrate heaters is used for the deposition of III-V and VI compound semiconductors. This gas flow is uniformly mixed through the extended diffusion layer and directed so that it contacts the full surface of the substrate to produce high quality and uniform films. Exemplary of such gas flow configurations are the positioning of a substrate at a distance from the gas outlets to allow the extended diffusion and a diaphragm placed in a short distance above the substrate to minimise the impact of the convection effect and to improve the uniformity. This symmetrical configuration allows easy scale up from a single wafer to multi-wafer system.

Abstract: The invention provides a method and device for light generation wherein the device comprises a lower electrode, a substrate formed on the lower electrode, a triangle mesa structure formed on the substrate for lateral confinement of light, a triangle optical cavity formed in the mesa structure, an upper electrode formed on the mesa structure, and a plurality of contact spots formed on the upper electrode corresponding to the maxima of optical field intensity for at least one optical mode on a lateral plane in the triangle optical cavity. Another embodiment of the device according to the invention further comprises a plurality of triangle mesa structures, along with a light output structure for directing and controlling light output from the device, which are formed on the substrate in various topologies such as a matrix or an array.

Abstract: A transparent conductive film is deposited between the electrode and semiconductor diode to spread the current evenly, reduce the series resistance and increase light transmittance at certain wavelength. ZnO film can be used as the transparent conductive film. The Ni/Au/ZnO film is found to have an increased light transmission compared with an annealed Ni/Au contact. The maximum optical transmission measured through the Ni/Au/ZnO film is 90%.

Abstract: The invention provides a method and device for light generation wherein an embodiment of the device comprises a lower electrode, a conducting substrate formed on the lower electrode, and a triangle mesa structure having an optical cavity formed on the substrate. The triangle mesa structure (which can also be truncated) further comprises an active layer, a lower conducting mirror and an upper conducting mirror for vertical confinement of light in the optical cavity, a contact layer formed on the upper mirror, a metallic contact formed on the contact layer. An electrical current is applied to the device according to the invention through the metallic contact linked to the contact layer, and subsequently to the lower electrode through the lower mirror and the conducting substrate. The applied current results in light generation in the active layer with vertical light output through the metallic contact. A corresponding light generation method is also disclosed herein.

Abstract: The invention provides a method and device for light generation wherein an embodiment of the device comprises a lower electrode, a conducting substrate formed on the lower electrode, and a triangle mesa structure having an optical cavity formed on the substrate. The triangle mesa structure (which can also be truncated) further comprises an active layer, a lower conducting mirror and an upper conducting mirror for vertical confinement of light in the optical cavity, a contact layer formed on the upper mirror, a metallic contact formed on the contact layer. An electrical current is applied to the device according to the invention through the metallic contact linked to the contact layer, and subsequently to the lower electrode through the lower mirror and the conducting substrate. The applied current results in light generation in the active layer with vertical light output through the metallic contact. A corresponding light generation method is also disclosed herein.

Abstract: A mobile communication device comprises a housing enclosing a circuit board that has components disposed thereon. The housing has opposite first and second surfaces. An antenna element is formed on the first surface of the housing for receiving and/or transmitting electromagnetic signals. An inner conductive layer is disposed on the second surface of the housing. The inner conductive layer is electrically connected to the antenna element and in signal communication with the circuit board.

Abstract: The invention provides a light emitting diode (LED) or other light emitting means such as a laser diode (LD) comprising a light emitting component and scattering optical media such as dielectric phosphor powder (DPP) which absorb a part of light emitted by the light emitting component and emits light of a wavelength that is different from that of the absorbed light. In a preferred embodiment according to the invention, the LED includes a crystalline semiconductor chip serving as the light emitting component. The scattering optical media such as dielectric phosphor powder (DPP) is made of a mixture of phosphor particles and microscopic, nearly spherical dielectric particles with a band gap larger than 3 eV (which do not absorb blue light in the spectrum). The scattering optical media such as DPP can also include phosphor particles, and bubbles (or voids) instead of the dielectric particles. The bubbles of the DPP have a band gap larger than 3 eV which do not absorb blue light in the spectrum.

Abstract: An LED based on a two well system with charge asymmetric resonance tunnelling comprises first and second coupled wells, one being a wide well and the other an active quantum well. The wells are coupled via a resonance tunnelling barrier which is transparent for electrons and blocking for holes.

Abstract: The invention provides a method and device for light generation wherein the device comprises a lower electrode, a substrate formed on the lower electrode, a triangle mesa structure formed on the substrate for lateral confinement of light, a triangle optical cavity formed in the mesa structure, an upper electrode formed on the mesa structure, and a plurality of contact spots formed on the upper electrode corresponding to the maxima of optical field intensity for at least one optical mode on a lateral plane in the triangle optical cavity. Another embodiment of the device according to the invention further comprises a plurality of triangle mesa structures, along with a light output structure for directing and controlling light output from the device, which are formed on the substrate in various topologies such as a matrix or an array.

Abstract: A semiconductor laser with lateral optical cavity based on III-V or II-VI semiconductor compounds and their alloys is suggested. The essence of the disclosure is in the use of polygonal surface optical grating resonator (PGR) for lateral confinement of the light and selective excitation of the chosen optical mode. PGR allows fabricating of single mode semiconductor lasers needed for various applications such as CD and DVD pick up heads, high quality laser printers and others. Also, PGR allows controlled multiple wavelength operation of semiconductor lasers needed for telecommunication purposes. The technological advantage of PGR over traditional mesa-structure or ridge optical cavity resonators is in simplicity of integration of surface optical grating fabrication process into planar semiconductor technology.

Abstract: An electron emitter, such as for a display, has a substrate and regions of n-type material and p-type material on the substrate arranged such that there is an interface junction between the regions exposed directly to vacuum for the liberation of electrons. The p-type region may be a thin layer on top of the n-type region or the two regions may be layers on adjacent parts of the substrate with adjacent edges forming the interface junction. Alternatively, there many be multiple interface junctions formed by p-type particles or by both p-type and n-type particles. The particles may be deposited on the substrate by an ink-jet printing technique. The p-type material is preferably diamond, which may be activated to exhibit negative electron affinity.

Abstract: The fabrication of unipolar light emitting devices (ULEDs) based on III-nitride semiconductors is disclosed using an effective “p-n junction” between two n-type III-nitride semiconductor superlattices. Such a device works like a usual light emitting diode at forward bias but the radiation arises not due to recombination of electrons and holes but due to electron transitions from a shallow sub-band superlattice into a deep sub-band superlattice.

Abstract: The present invention relates to light omitting diodes having an AlGaInP active layer disposed between two cladding layers of AlGaInP, with a strain layer grown on the second cladding layer and comprising a superlattice structure in the form of a plurality of thin alternated AlGaInP layers with preselected composition. In one embodiment, the composition of the alternated AlGaInP layers is an ohmic n-electrode on a rear surface of a GaAs substrate: a distributed AlGaAs Bragg reflecting layer in the form of a multi-layer lamination; a first, lower AlGaInP cladding layer grown on the reflecting layer; an AlGaInP active layer grown on the lower cladding layer; a second, upper AlGaInP cladding layer grown on the active layer; a strain layer grown on the second cladding layer, the strain layer comprising a superlattice structure in the form of a plurality of thin alternated AlGaInP layers with the composition: (AlxGa1-x)1-yInyP/(AlnGa1-n)1-hInhP, where 0.5≦x≦1; 0.4≦y≦0.6/0≦a≦0.4; 0≦b≦0.4.

Abstract: The invention provides a light emitting diode (LED) comprising a light emitting component and dielectric phosphor powder (DPP) which absorb a part of light emitted by the light emitting component and emits light of a wavelength that is different from that of the absorbed light. In a preferred embodiment according to the invention, the LED includes a crystalline semiconductor chip serving as the light emitting component. The dielectric phosphor powder is made of a mixture of phosphor particles and microscopic, nearly spherical dielectric particles with a band gap larger than 3 eV (which do not absorb blue light in the spectrum). The DPP can also include phosphor particles, and bubbles (or voids) instead of the dielectric particles. The bubbles of the DPP have a band gap larger than 3 eV which do not absorb blue light in the spectrum. The bubbles can be air bubbles, N2 bubbles, noble gas bubbles. Furthermore, the DPP can also be a mixture of the bubbles, dielectric particles, and the phosphor particles.

Abstract: The invention provides a light emitting diode (LED) or other light emitting means such as a laser diode (LD) comprising a light emitting component and scattering optical media such as dielectric phosphor powder (DPP) which absorb a part of light emitted by the light emitting component and emits light of a wavelength that is different from that of the absorbed light. In a preferred embodiment according to the invention, the LED includes a crystalline semiconductor chip serving as the light emitting component. The scattering optical media such as dielectric phosphor powder (DPP) is made of a mixture of phosphor particles and microscopic, nearly spherical dielectric particles with a band gap larger than 3 eV (which do not absorb blue light in the spectrum). The scattering optical media such as DPP can also include phosphor particles, and bubbles (or voids) instead of the dielectric particles. The bubbles of the DPP have a band gap larger than 3 eV which do not absorb blue light in the spectrum.

Abstract: Parallel cathode electrodes extend across the base plate of a display. Each electrode has teeth projecting from both sides, the teeth of adjacent electrodes being closely spaced from one another by a gap that is bridged by a dot of an electron emitter material. A glass screen spaced by a vacuum gap above the base plate carries transparent anode stripes extending transversely of the cathode electrodes and a fluorescent layer of colored phosphors on the anode stripes. A voltage applied between adjacent cathode electrodes and gates conduction via each electron emitter dot. A voltage applied to an anode stripe causes a part of the current from the emitter directly below the stripe to be directed towards the anode, thereby illuminating the phosphor pixel above the emitter.

Abstract: A mobile communication device comprises a housing enclosing a circuit board that has communication components disposed thereon. The housing has opposite first and second surfaces. An antenna element is formed on the first surface of the housing for receiving and/or transmitting electromagnetic signals. An inner conductive layer is disposed on the second surface of the housing. The inner conductive layer is electrically connected to the antenna element and in signal communication with the circuit board.

Abstract: A semiconductor device has a window layer (8), a current spreading layer (7) below the window layer and a cladding layer (6) below the current spreading layer. The band gap energy of the spreading layer is higher than that of the window layer and lower than that of the cladding layer and the carrier concentration of the spreading layer is lower than that of the window layer and higher than that of the cladding layer.