Patents by Inventor Wataru NIHASHI

Wataru NIHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11640113
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin including a repeating unit (a) represented by Formula (1); (B) a compound that generates an acid by irradiation with actinic rays or radiation; and (C) an organic solvent. A concentration of solid contents of the actinic ray-sensitive or radiation-sensitive resin composition is 4 mass % or less. (in the formula, R11 and R12 each independently represent a hydrogen atom, a halogen atom, or a monovalent organic group. R13 represents a hydrogen atom, a halogen atom, or a monovalent organic group or is a single bond or an alkylene group, and is bonded to L or Ar in the formula to form a ring. L represents a single bond or a divalent linking group. Ar represents an aromatic ring group. n represents an integer of 2 or more.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: May 2, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Hajime Furutani, Akihiro Kaneko, Wataru Nihashi, Shuji Hirano
  • Patent number: 11573491
    Abstract: The present invention provides a negative tone photosensitive composition for EUV light, capable of forming a pattern, in which occurrence of missing defects is suppressed and pattern collapse is suppressed. The present invention also provides a pattern forming method and a method for manufacturing an electronic device. The negative tone photosensitive composition for EUV light of an embodiment of the present invention includes a resin A having a repeating unit having an acid-decomposable group with a polar group being protected with a protective group that is eliminated by the action of an acid, and a photoacid generator, in which a ClogP value of the resin after elimination of the protective group from the resin A is 1.4 or less, a value x calculated by Expression (1) is 1.2 or more, and the value x calculated by Expression (1) and a value y calculated by Expression (2) satisfy a relationship of Expression (3).
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 7, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Michihiro Shirakawa, Michihiro Ogawa
  • Patent number: 11460769
    Abstract: An actinic ray-sensitive or radiation-sensitive composition, and an actinic ray-sensitive or radiation-sensitive composition obtained by the method for producing an actinic ray-sensitive or radiation-sensitive composition each contain a cation having a metal atom, and a ligand, in which a value of ? represented by Equation (1) is 2.2 or less. A pattern forming method and the method for manufacturing an electronic device each use the actinic ray-sensitive or radiation-sensitive composition.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: October 4, 2022
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Hideaki Tsubaki
  • Patent number: 11156915
    Abstract: An actinic ray-sensitive or radiation-sensitive composition contains a cation including a metal atom and a ligand, in which the number of particles in liquid having particle diameters of 0.15 ?m or less included in 1 mL of the actinic ray-sensitive or radiation-sensitive composition is 10 or less.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: October 26, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Wataru Nihashi
  • Publication number: 20210200097
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern. The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having an SP value of 16.3 MPa1/2 or less and a second organic solvent having an SP value of 17.1 MPa1/2 or more.
    Type: Application
    Filed: February 17, 2021
    Publication date: July 1, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Hideaki TSUBAKI, Toru TSUCHIHASHI, Wataru NIHASHI, Kei YAMAMOTO
  • Publication number: 20210200098
    Abstract: A pattern forming method includes: preparing a laminate having a substrate, an inorganic base layer, and a resist layer; exposing the resist layer; and developing the laminate using a developer including an organic solvent to form a negative tone pattern, in which a surface energy ?A of the resist layer and a surface energy ?B of the inorganic base layer after irradiation of the laminate with ultraviolet rays having a wavelength of 13.5 nm from the resist layer side with an integrated light quantity of 40 mJ/cm2, followed by heating of the laminate at 110° C. for 60 seconds are 60 mJ/m2 or more and 55 mJ/m2 or more, respectively, and a difference ?AB in surface energies that is defined by Formula (A) is 5.0 mJ/m2 or less: ?AB=?A??B (Formula (A)).
    Type: Application
    Filed: March 15, 2021
    Publication date: July 1, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Wataru NIHASHI, Michihiro SHIRAKAWA
  • Patent number: 11042094
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern. The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having a relative dielectric constant of 4.0 or less and a second organic solvent having a relative dielectric constant of 6.0 or more.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: June 22, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Shuji Hirano, Hideaki Tsubaki, Toru Tsuchihashi, Wataru Nihashi, Kei Yamamoto
  • Patent number: 10962884
    Abstract: An object of the present invention is to provide a treatment liquid for patterning a resist film and a pattern forming method, each of which can simultaneously suppress the occurrence of pattern collapse in a resist L/S pattern and the occurrence of omission failure in a resist C/H pattern. The treatment liquid of the present invention is a treatment liquid for patterning a resist film, which is used for subjecting a resist film obtained from an actinic ray-sensitive or radiation-sensitive resin composition to at least one of development or washing, and contains an organic solvent, in which the treatment liquid contains a first organic solvent having an SP value of 16.3 MPa1/2 or less and a second organic solvent having an SP value of 17.1 MPa1/2 or more.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 30, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Toru Tsuchihashi, Wataru Nihashi, Kei Yamamoto
  • Publication number: 20210011380
    Abstract: The present invention provides a negative tone photosensitive composition for EUV light, capable of forming a pattern, in which occurrence of missing defects is suppressed and pattern collapse is suppressed. The present invention also provides a pattern forming method and a method for manufacturing an electronic device. The negative tone photosensitive composition for EUV light of an embodiment of the present invention includes a resin A having a repeating unit having an acid-decomposable group with a polar group being protected with a protective group that is eliminated by the action of an acid, and a photoacid generator, in which a ClogP value of the resin after elimination of the protective group from the resin A is 1.4 or less, a value x calculated by Expression (1) is 1.2 or more, and the value x calculated by Expression (1) and a value y calculated by Expression (2) satisfy a relationship of Expression (3).
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: FUJIFILM Corporation
    Inventors: Wataru NIHASHI, Michihiro SHIRAKAWA, Michihiro OGAWA
  • Patent number: 10890847
    Abstract: A pattern forming method includes, in this order, forming a film on a substrate, using an active-light-sensitive or radiation-sensitive resin composition containing a resin (A) which has a repeating unit having a phenolic hydroxyl group, and a repeating unit having a group that decomposes by the action of an acid to generate a carboxyl group, and a compound (B) that generates an acid upon irradiation with active light or radiation; exposing the film; and developing the exposed film using a developer including an organic solvent, in which the developer including an organic solvent contains an organic solvent having 8 or more carbon atoms and 2 or less heteroatoms in the amount of 50% by mass or more.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: January 12, 2021
    Assignee: FUJIFILM Corporation
    Inventors: Toru Tsuchihashi, Wataru Nihashi, Hideaki Tsubaki
  • Patent number: 10788754
    Abstract: Provided are a positive tone pattern forming method in which development is carried out using a developer containing an organic solvent with use of a composition containing (A) a resin which has a repeating unit containing a moiety capable of forming a polar interaction and whose polarity is decreased due to release of the polar interaction by the action of an acid or a base, or a composition containing (A?) a resin having a repeating unit containing a polar group and (B) a compound capable of forming a polar interaction with the polar group of the resin (A?); and an electronic device manufacturing method including such a pattern forming method.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: September 29, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Toru Tsuchihashi, Hideaki Tsubaki
  • Patent number: 10761426
    Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film using a composition for forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer containing an organic solvent, in which the composition for forming an upper layer film includes a resin and at least one of a compound capable of generating an acid with actinic rays or radiation, a compound capable of generating an acid with heat, and an acid, in which the resin includes a repeating unit represented by General Formula (II). The method for manufacturing an electronic device includes the pattern forming method. A laminate includes the film and the upper layer film.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: September 1, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Wataru Nihashi, Toru Tsuchihashi, Kei Yamamoto
  • Patent number: 10663864
    Abstract: The pattern forming method includes forming an actinic ray-sensitive or radiation-sensitive film using an actinic ray-sensitive or radiation-sensitive composition, forming an upper layer film on the actinic ray-sensitive or radiation-sensitive film using a composition for forming an upper layer film, exposing the actinic ray-sensitive or radiation-sensitive film having the upper layer film formed thereon, and developing the exposed actinic ray-sensitive or radiation-sensitive film using a developer, in which the composition for forming an upper layer film includes a solvent and a crosslinking agent; and in which the content of a solvent having a hydroxyl group is 80% by mass or less with respect to all the solvents included in the composition for forming an upper layer film. The method for manufacturing an electronic device includes the pattern forming method. The laminate has an actinic ray-sensitive or radiation-sensitive film, and an upper layer film including a crosslinking agent.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 26, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Hideaki Tsubaki, Toru Tsuchihashi, Kei Yamamoto
  • Patent number: 10599038
    Abstract: Provided are a rinsing liquid which is used for rinsing a resist film obtained from an actinic ray-sensitive or radiation-sensitive composition and includes a hydrocarbon-based solvent having a branched alkyl group. The hydrocarbon-based solvent having a branched alkyl group contains at least one of isodecane or isododecane.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: March 24, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Toru Tsuchihashi, Wataru Nihashi
  • Patent number: 10562991
    Abstract: Provided is a pattern forming method including the successive steps of: a resist film forming step of forming a resist film using an actinic ray-sensitive or radiation-sensitive composition; an exposure step of exposing the resist film; a step of developing the exposed resist film using a developer, and a step of rinsing the developed resist film using a rinsing liquid containing an organic solvent. The developer includes a ketone-based or ether-based solvent having a branched alkyl group. The organic solvent contained in the rinsing liquid includes an ether-based solvent having a branched alkyl group.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: February 18, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Toru Tsuchihashi, Wataru Nihashi
  • Patent number: 10444627
    Abstract: There are provided a pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific repeating units, and a crosslinking agent (C).
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: October 15, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Hiroo Takizawa, Toru Fujimori, Wataru Nihashi, Shuji Hirano, Natsumi Yokokawa
  • Publication number: 20190276575
    Abstract: By a method for producing a resin, a resin containing a repeating unit represented by General Formula (1) and a repeating unit containing a group that decomposes by the action of an acid to generate a polar group is produced, and the method includes a first step of obtaining a resin precursor containing a repeating unit represented by General Formula (2) and the repeating unit containing a group that decomposes by the action of an acid to generate a polar group, and a second step of obtaining the repeating unit represented by General Formula (1) by deprotecting a group represented by —OY in the repeating unit represented by General Formula (2) in the resin precursor with an acid or a base.
    Type: Application
    Filed: March 25, 2019
    Publication date: September 12, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Akihiro KANEKO, Shuji Hirano, Wataru Nihashi
  • Patent number: 10394127
    Abstract: Provide are a pattern forming method including a step (1) of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition including a resin having an acid-decomposable repeating unit capable of decomposing by the action of an acid to generate an acid having a pKa of 3.0 or less, a step (2) of exposing the film using actinic rays or radiation, and a step (3) of carrying out development using a developer including an organic solvent after the exposure to form a negative tone pattern; and a method for manufacturing an electronic device, including the pattern forming method.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: August 27, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Wataru Nihashi, Hideaki Tsubaki, Toru Tsuchihashi, Tomotaka Tsuchimura
  • Publication number: 20190219921
    Abstract: Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin including a repeating unit (a) represented by Formula (1); (B) a compound that generates an acid by irradiation with actinic rays or radiation; and (C) an organic solvent. A concentration of solid contents of the actinic ray-sensitive or radiation-sensitive resin composition is 4 mass % or less. (in the formula, R11 and R12 each independently represent a hydrogen atom, a halogen atom, or a monovalent organic group. R13 represents a hydrogen atom, a halogen atom, or a monovalent organic group or is a single bond or an alkylene group, and is bonded to L or Ar in the formula to form a ring. L represents a single bond or a divalent linking group. Ar represents an aromatic ring group. n represents an integer of 2 or more.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 18, 2019
    Applicant: FUJIFILM Corporation
    Inventors: Hideaki TSUBAKI, Hajime FURUTANI, Akihiro KANEKO, Wataru NIHASHI, Shuji HIRANO
  • Publication number: 20190219922
    Abstract: There is provided a resist composition containing a resin. The resin includes a repeating unit (a) having one or more *—OY0 groups substituted for an aromatic ring; and a phenolic hydroxyl group (b) or a partial structure (c) represented by Formula (X). Here, the *—OY0 group is a group that is decomposed due to an action of an acid to generate a phenolic hydroxyl group, and Y0 is a specific protective group. In a case where the repeating unit (a) includes none of the phenolic hydroxyl group (b) and the partial structure (c), the repeating unit (a) is a repeating unit in which the *—OY0 group is decomposed due to an action of an acid to generate two or more phenolic hydroxyl groups.
    Type: Application
    Filed: March 25, 2019
    Publication date: July 18, 2019
    Applicant: FujiFilm Corporation
    Inventors: Akihiro KANEKO, Shuji Hirano, Takashi Kawashima, Michihiro Ogawa, Hajime Furutani, Wataru Nihashi, Hideaki Tsubaki, Kyohei Sakita