Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.

Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.

Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: Provided herein are systems and methods for behavior profiling of targets to determine malware presence. The method includes, in various embodiments, applying a domain specific language to a target; observing a set of temporal sequences and events of the target; determining the presence of markers within the set of temporal sequences and events indicative of malware; and identifying the target as being associated with malware based on the markers. In some embodiments, a malware detection system is provided for creating a behavioral sandbox environment where a target is inspected for malware. The behavioral sandbox environment can include forensic collectors. Each of the collectors may be configured to apply a domain specific language to a target; observe a set of temporal sequences and events of the target; determine the presence of markers within the set of temporal sequences and events indicative of malware; and detect malware presence based on the markers.

Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.

Abstract: Provided herein are systems and methods for behavior profiling of targets to determine malware presence. The method includes, in various embodiments, applying a domain specific language to a target, observing a set of temporal sequences and events of the target; determining presence of markers within the set of temporal sequences and events indicative of malware, and identifying the target as being associated with malware based on the markers. In some embodiments, a malware detection system is provided for creating a behavioral sandbox environment where a target is inspected for malware. The behavioral sandbox environment can include forensic collectors. Each of the collectors may be configured to apply a domain specific language to a target; observe a set of temporal sequences and events of the target; determine presence of markers within the set of temporal sequences and events indicative of malware; and detect malware presence based on the markers.

Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.

Abstract: Provided herein are systems and methods for behavior profiling of targets to determine malware presence. The method includes, in various embodiments, applying a domain specific language to a target, observing a set of temporal sequences and events of the target; determining presence of markers within the set of temporal sequences and events indicative of malware, and identifying the target as being associated with malware based on the markers. In some embodiments, a malware detection system is provided for creating a behavioral sandbox environment where a target is inspected for malware. The behavioral sandbox environment can include forensic collectors. Each of the collectors may be configured to apply a domain specific language to a target; observe a set of temporal sequences and events of the target; determine presence of markers within the set of temporal sequences and events indicative of malware; and detect malware presence based on the markers.

Abstract: The present technology is directed to manufacturing collars for under-bump metal (UBM) structures for die-to-die and/or package-to-package interconnects and associated systems. A semiconductor die includes a semiconductor material having solid-state components and an interconnect extending at least partially through the semiconductor material. An under-bump metal (UBM) structure is formed over the semiconductor material and is electrically coupled to corresponding interconnects. A collar surrounds at least a portion of the side surface of the UBM structure, and a solder material is disposed over the top surface of the UBM structure.

Abstract: Provided herein are systems and methods for behavior profiling of targets to determine malware presence. The method includes, in various embodiments, applying a domain specific language to a target, observing a set of temporal sequences and events of the target; determining presence of markers within the set of temporal sequences and events indicative of malware, and identifying the target as being associated with malware based on the markers. In some embodiments, a malware detection system is provided for creating a behavioral sandbox environment where a target is inspected for malware. The behavioral sandbox environment can include forensic collectors. Each of the collectors may be configured to apply a domain specific language to a target; observe a set of temporal sequences and events of the target; determine presence of markers within the set of temporal sequences and events indicative of malware; and detect malware presence based on the markers.

Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: A method of removing a material from a surface includes providing a substrate comprising a material having a surface, contacting the surface with a polishing medium, applying a voltage to the substrate to remove material from the surface, and changing the voltage during the removing material from the surface. An electro-chemical mechanical polishing method includes providing a substrate having a surface, applying a platen to the surface, applying a first voltage to the substrate, rotating the platen and surface relative to each other at a first rotational speed, increasing to a second voltage, and decreasing to a second rotational speed.

Abstract: Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of the particles from the surfaces and into the liquid. In some embodiments, temperature, pH and/or ionic strength within the liquid may be altered to assist in the removal of the particles from over the surfaces of the substrates.

Abstract: A method of forming a memory cell includes forming one of multivalent metal oxide material or oxygen-containing dielectric material over a first conductive structure. An outer surface of the multivalent metal oxide material or the oxygen-containing dielectric material is treated with an organic base. The other of the multivalent metal oxide material or oxygen-containing dielectric material is formed over the treated outer surface. A second conductive structure is formed over the other of the multivalent metal oxide material or oxygen-containing dielectric material.

Abstract: A method of forming a memory cell includes forming one of multivalent metal oxide material or oxygen-containing dielectric material over a first conductive structure. An outer surface of the multivalent metal oxide material or the oxygen-containing dielectric material is treated with an organic base. The other of the multivalent metal oxide material or oxygen-containing dielectric material is formed over the treated outer surface. A second conductive structure is formed over the other of the multivalent metal oxide material or oxygen-containing dielectric material.

Abstract: A method of forming a memory cell includes forming one of multivalent metal oxide material or oxygen-containing dielectric material over a first conductive structure. An outer surface of the multivalent metal oxide material or the oxygen-containing dielectric material is treated with an organic base. The other of the multivalent metal oxide material or oxygen-containing dielectric material is formed over the treated outer surface. A second conductive structure is formed over the other of the multivalent metal oxide material or oxygen-containing dielectric material.

Abstract: A method of processing a substrate having integrated circuitry includes forming through-substrate vias partially through the substrate from a first side of the substrate. At least one through-substrate structure is formed partially through the substrate from the first substrate side. The at least one through-substrate structure extends deeper into the substrate than do the through-substrate vias. Substrate material is removed from a second side of the substrate to expose the through-substrate vias and the at least one through-substrate structure on the second substrate side. Additional implementations are disclosed. Integrated circuit substrates are disclosed independent of method of manufacture.

Abstract: A method of smart path finding for a file operation is disclosed. A data structure is provided to store reference points, file paths and use counts. Each of the reference points is a URL or an email ID and is associated with at least one of the file paths. Each of the use counts is tied to one of the file paths. The data structure is searched when a reference point is hit for downloading, uploading, attaching or detaching a file. When the reference point is found to be or to be similar to one of the reference points, one or more file paths associated with the one of the reference points are ordered, by one or more use counts tied to the one or more file paths, to form a list including one or more suggested file paths for downloading, uploading, attaching or detaching the file.