Patents by Inventor Wayne McMillan
Wayne McMillan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11733533Abstract: The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.Type: GrantFiled: May 16, 2022Date of Patent: August 22, 2023Assignee: Applied Materials, Inc.Inventors: Ludovic Godet, Wayne Mcmillan, Rutger Meyer Timmerman Thijssen
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Publication number: 20230203647Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.Type: ApplicationFiled: February 17, 2023Publication date: June 29, 2023Inventors: Karl J. ARMSTRONG, Ludovic GODET, Brian Alexander COHEN, Wayne MCMILLAN, James D. STRASSNER, Benjamin B. RIORDON
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Patent number: 11662516Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.Type: GrantFiled: April 27, 2022Date of Patent: May 30, 2023Assignee: Applied Materials, Inc.Inventors: Michael Yu-tak Young, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Robert Jan Visser
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Patent number: 11626321Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: GrantFiled: May 22, 2020Date of Patent: April 11, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Naamah Argaman, Tapashree Roy, Sage Toko Garrett Doshay
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Patent number: 11614685Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.Type: GrantFiled: December 8, 2021Date of Patent: March 28, 2023Assignee: Applied Materials, Inc.Inventors: Ludovic Godet, Chien-An Chen, Brian Alexander Cohen, Wayne McMillan, Ian Matthew McMackin
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Patent number: 11608558Abstract: Embodiments of the present disclosure relate to forming multi-depth films for the fabrication of optical devices. One embodiment includes disposing a base layer of a device material on a surface of a substrate. One or more mandrels of the device material are disposed on the base layer. The disposing the one or more mandrels includes positioning a mask over of the base layer. The device material is deposited with the mask positioned over the base layer to form an optical device having the base layer with a base layer depth and the one or more mandrels having a first mandrel depth and a second mandrel depth.Type: GrantFiled: April 8, 2020Date of Patent: March 21, 2023Assignee: Applied Materials, Inc.Inventors: Karl J. Armstrong, Ludovic Godet, Brian Alexander Cohen, Wayne McMillan, James D. Strassner, Benjamin Riordon
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Publication number: 20230056086Abstract: Embodiments of metasurfaces having nanostructures with desired geometric profiles and configurations are provided in the present disclosure. In one embodiment, a metasurface includes a nanostructure formed on a substrate, wherein the nanostructure is cuboidal or cylindrical in shape. In another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein each of the nanostructures has a gap greater than 35 nm spaced apart from each other. In yet another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein the nanostructures are fabricated from at least one of TiO2, silicon nitride, or amorphous silicon, or GaN or aluminum zinc oxide or any material with refractive index greater than 1.8, and absorption coefficient smaller than 0.001, the substrate is transparent with absorption coefficient smaller than 0.001.Type: ApplicationFiled: October 31, 2022Publication date: February 23, 2023Inventors: Tapashree ROY, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN
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Patent number: 11557987Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: GrantFiled: November 17, 2021Date of Patent: January 17, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Wayne McMillan, Visweswaren Sivaramakrishnan, Joseph C. Olson, Ludovic Godet, Rutger Meyer Timmerman Thijssen, Naamah Argaman
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Publication number: 20220392053Abstract: Embodiments of the present disclosure include a die system and a method of comparing alignment vectors. The die system includes a plurality of dies arranged in a desired pattern. An alignment vector, such as a die vector, can be determined from edge features of the die. The alignment vectors can be compared to other dies or die patterns in the same system. A method of comparing dies and die patterns includes comparing die vectors and/or pattern vectors. The comparison between alignment vectors allows for fixing the die patterns for the next round of processing. The methods provided allow accurate comparisons between as-deposited edge features, such that accurate stitching of dies can be achieved.Type: ApplicationFiled: September 14, 2020Publication date: December 8, 2022Inventors: Yongan XU, Chan Juan XING, Jinxin FU, Yifei WANG, Wayne MCMILLAN, Ludovic GODET
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Patent number: 11487139Abstract: Embodiments of metasurfaces having nanostructures with desired geometric profiles and configurations are provided in the present disclosure. In one embodiment, a metasurface includes a nanostructure formed on a substrate, wherein the nanostructure is cuboidal or cylindrical in shape. In another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein each of the nanostructures has a gap greater than 35 nm spaced apart from each other. In yet another embodiment, a metasurface includes a plurality of nanostructures on a substrate, wherein the nanostructures are fabricated from at least one of TiO2, silicon nitride, or amorphous silicon, or GaN or aluminum zinc oxide or any material with refractive index greater than 1.8, and absorption coefficient smaller than 0.001, the substrate is transparent with absorption coefficient smaller than 0.001.Type: GrantFiled: October 14, 2019Date of Patent: November 1, 2022Assignee: Applied Materials, Inc.Inventors: Tapashree Roy, Wayne McMillan, Rutger Meyer Timmerman Thijssen
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Publication number: 20220336270Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.Type: ApplicationFiled: July 1, 2022Publication date: October 20, 2022Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage Toko Garrett DOSHAY
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Publication number: 20220276498Abstract: The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.Type: ApplicationFiled: May 16, 2022Publication date: September 1, 2022Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN
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Publication number: 20220252780Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.Type: ApplicationFiled: April 27, 2022Publication date: August 11, 2022Inventors: Michael Yu-tak YOUNG, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Robert Jan VISSER
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Patent number: 11333896Abstract: The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.Type: GrantFiled: June 27, 2019Date of Patent: May 17, 2022Assignee: Applied Materials, Inc.Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen
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Patent number: 11327218Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.Type: GrantFiled: November 13, 2018Date of Patent: May 10, 2022Assignee: Applied Materials, Inc.Inventors: Michael Yu-tak Young, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Robert Jan Visser
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Publication number: 20220100084Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.Type: ApplicationFiled: December 8, 2021Publication date: March 31, 2022Inventors: Ludovic GODET, Chien-An CHEN, Brian Alexander COHEN, Wayne MCMILLAN, Ian Matthew MCMACKIN
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Publication number: 20220082738Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a film stack disposed on a substrate without planarization. The method includes forming a hardmask on a top surface of a film stack. Forming a mask material on a portion of the top surface and a portion of the hardmask. Etching the top surface. Trimming the mask. Etching the top surface again. Trimming the mask a second time. Etching the top surface yet again and then stripping the mask material.Type: ApplicationFiled: November 24, 2021Publication date: March 17, 2022Inventors: Michael Yu-tak YOUNG, Ludovic GODET, Robert Jan VISSER, Naamah ARGAMAN, Christopher Dennis BENCHER, Wayne MCMILLAN
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Publication number: 20220077794Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: ApplicationFiled: November 17, 2021Publication date: March 10, 2022Inventors: Wayne MCMILLAN, Visweswaren SIVARAMAKRISHNAN, Joseph C. OLSON, Ludovic GODET, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN
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Patent number: 11226556Abstract: Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.Type: GrantFiled: April 9, 2020Date of Patent: January 18, 2022Assignee: Applied Materials, Inc.Inventors: Ludovic Godet, Chien-An Chen, Brian Alexander Cohen, Wayne McMillan, Ian Matthew McMackin
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Patent number: 11205978Abstract: Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.Type: GrantFiled: December 13, 2019Date of Patent: December 21, 2021Assignee: Applied Materials, Inc.Inventors: Wayne McMillan, Visweswaren Sivaramakrishnan, Joseph C. Olson, Ludovic Godet, Rutger Meyer Timmerman Thijssen, Naamah Argaman