Abstract: An automated heat transfer press and method for automated heat transfer pressing provides an electric linear actuator motor that induces an arced translation of a first plate onto a second plate for dye sublimation printing. The arced motion of the first plate enables the first plate to press against the second plate at an angle, rather than a vertical pressing action; whereby adaption to a variously sized and dimensioned substrates is possible. A second link bar adjusts alignment of the second plate with first plate. An electric linear actuator motor manipulates a rod through electrical power. Rod is extended to create linear motion. The rod operatively connects to a hinged arm, applying linear force that causes the hinged arm to displace the first plate at arced motion. A control portion regulates the linear actuator motor to press and release the plates against each other in predetermined temperatures and intervals.

Abstract: A vertical LED with current blocking structure and its associated fabrication method involve an anisotropic conductive material and a conductive substrate with concave-convex structure. The anisotropic conductive material forms a bonding layer with vertical conduction and horizontal insulation between the concave-convex substrate and the light-emitting epitaxial layer, thereby forming a vertical LED with current blocking function.

Abstract: A mobile device includes a memory and a processor. The memory is configured to store a plurality of commands; the processor is configured to receive the commands and execute the following steps: receiving a function call and datum of a mobile application; determining if the received function call is a call to an predetermined application programming interface; determining if the received datum is labeled datum; and processing the received function call with a predetermined monitoring procedure when the received function call is the call to the predetermined application programming interface and the received datum is the labeled datum.

Abstract: Disclosed herein is a quantum rod backlight module for a liquid crystal display. The quantum rod backlight module includes a quantum rod layer disposing at one side of a backlight source and comprising a plurality of quantum rods, wherein the major axes of the plurality of quantum rods are aligned along a direction parallel to a surface of the quantum rod layer; a first micro-prism layer including a plurality of first parallel strip-shape prisms, and a second micro-prism layer including a plurality of second parallel strip-shape prisms, wherein both of the alignment directions of the first parallel strip-shape prisms and the second parallel strip-shape prisms are perpendicular to the direction of the major axes of the plurality of quantum rods, and the retardations of the first micro-prism layer and the second micro-prism layer are zero.

Abstract: Disclosed herein is a quantum rod film for a backlight unit. The quantum rod film includes a quantum rod layer having a plurality of quantum rods wherein major axes of the quantum rods are aligned along a direction; a micro-prism layer having a first refractive index and a plurality of parallel strip-shape prisms disposed at a light incident side of the quantum rod layer; and a birefringent layer on the micro-prism layer. By the refractive index difference between the first refractive index of the micro-prism layer and the extraordinary refractive index or the ordinary refractive index of the birefringent layer, the incident light parallel to the direction of major-axes of the quantum rods will selectively pass through the quantum rod film, and the incident light perpendicular to the direction of major-axes of the quantum rods will reflect to backlight for recycling and increasing the backlight efficiency.

Abstract: An interleaved buck converter performs buck conversion by controlling operation of each of two switches thereof between an ON state and an OFF state. The switches have the same switching period and the same ON time interval, and a time delay from switching of one of the switches into the ON state to switching of the other one of the switches into the ON state equals the ON time interval of the switches minus a predetermined time interval.

Abstract: A method of semiconductor device fabrication including forming a mandrel on a semiconductor substrate is provided. The method continues to include oxidizing a region the mandrel to form an oxidized region, wherein the oxidized region abuts a sidewall of the mandrel. The mandrel is then removed from the semiconductor substrate. After removing the mandrel, the oxidized region is used to pattern an underlying layer formed on the semiconductor substrate.

Abstract: A surface-mounted light-emitting device is fabricated by epitaxial growth: forming the LED epitaxial structure over a growth substrate through epitaxial growth; chip fabrication: determining P and N electrode regions and an isolating region over the LED epitaxial structure surface and fabricating the P and N electrode pads and the insulator over the P and N electrode regions and the isolating region, wherein the P and N electrode pads have sufficient thicknesses to support the LED epitaxial structure, and the insulator is formed between the P and N electrode pads to prevent the P and N electrode pads from a short circuit; removing the growth substrate and unitizing the LED epitaxial structure to form the chip; and SMT packaging: providing the supporting substrate and directly mounting the P and N electrode pads of the chip over the supporting substrate through SMT packaging to thereby form the surface-mounted LED light-emitting device.

Abstract: The dumpling wrapping device contains a filling provision member, two wrapping members, and two shaping members. The filling provision member distributes dumpling fillings to feed two production lines of dumplings, each involving a wrapping member and a shaping member. Two pairs of rotors in the filling provision member drives dumpling fillings towards the wrapping members through two tubes. The wrapping members wrap the dumpling fillings from the tubes with dough. The dough wrapped fillings are pressed by the shaping members into dumplings of desired shape and size. Positioning members are configured under the shaping members so that the shaping members can be conveniently replaced and cleaned.

Abstract: One aspect of the present invention relates to a photovoltaic cell. In one embodiment, the photovoltaic cell includes a first conductive layer, an N-doped semiconductor layer formed on the first conductive layer, a first silicon layer formed on the N-doped semiconductor layer, a nanocrystalline silicon (nc-Si) layer formed on a first silicon layer, a second silicon layer formed on the nc-Si layer, a P-doped semiconductor layer on the second silicon layer, and a second conductive layer formed on the P-doped semiconductor layer, where one of the first silicon layer and the second silicon layer is formed of amorphous silicon, and the other of the first silicon layer and the second silicon layer formed of polycrystalline silicon.

Abstract: A light emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions over the top layer; a light transmission layer, located between top ends of adjacent protrusion portions and forming holes with the recess portions. The light transmission layer has a horizontal dimension larger than a width of the top ends of two adjacent protrusion portions, and serves as current blocking layer; a current spreading layer covering the surface of the light transmission layer and the surface of an epitaxial layer of a non-mask light transmission layer. As the refractive index of the light transmission layer is between those of the epitaxial layer and the hole, indicating a difference of refractive index between the light transmission layer and the epitaxial layer, the probability of scattering generated when light from a luminescent layer emits upwards can be increased, thus avoiding light absorption by electrodes and improving light extraction efficiency.

Abstract: A light-emitting diode (LED) includes: an epitaxial structure having an upper and a lower surface, wherein the upper surface comprises a light-emitting surface; at least one insulating layer over the lower surface; and an electrode pad layer over the at least one insulating layer; wherein: the electrode pad layer comprises a P electrode region and an N electrode region; and the at least one insulating layer is configured to adjust a distribution of the P and N electrode regions over the electrode pad layer

Abstract: A light emitting diode package structure includes: a first reflecting material layer with through holes; a flip chip on the first reflecting material layer, with the electrodes inlaid in the through holes of the first reflecting material layer; a first transparent material layer surrounding the side surface of the flip chip except the electrodes; a second reflecting material layer surrounding the first transparent material layer, the interface between the first transparent material layer and the reflecting material layer is an inclined plane, an arc plane, or an irregular shape, to thereby facilitate upward light reflection of the flip chip; and a wavelength conversion material layer covered over the above structure.

Abstract: A surface-mounted light-emitting device includes: a LED epitaxial structure having two opposite surfaces, wherein the first surface is a light-emitting surface; P and N electrode pads over the second surface of the epitaxial structure, which have sufficient thickness to support the LED epitaxial structure, and the P and N electrode pads have two opposite surfaces respectively, in which, the first surface is approximate to the LED epitaxial structure; an insulator between the P and N pads to prevent the P and N electrode pads from short circuit; and the P and N electrode pads are directly applied in the SMT package. Some embodiments allow structural changes compared with conventional SMT package type by directly mounting the chip over the supporting substrate through an electrode pad. In addition, soldering is followed after the chip process without package step, which is mainly applicable to flip-chip LED device.

Abstract: A light-emitting diode (LED) package, including: a substrate with front and back surfaces, including: at least two metal blocks; an insulation portion, wherein the metal blocks are disposed in the insulation portion and have at least portions of upper and lower surfaces exposed; and an electrical insulation region between the at least two metal blocks; an LED chip disposed over, and forming one or more electrical connections with, the at least two metal blocks; and a package encapsulant disposed over the LED chip surface and covering at least a portion of the substrate; wherein the at least two metal blocks have protrusion connection portions that extend to an edge of the substrate.

Abstract: A quantum rod film for a backlight unit of a liquid crystal display is disclosed herein. The quantum rod includes a first barrier layer, a sub-wavelength microstructure on the first barrier layer, and a plurality of quantum rods, wherein the sub-wavelength microstructure includes gratings aligned n a parallel direction an alignment microstructure disposed in grooves between the gratings in a direction perpendicular to the gratings, and a reflective layer on upper surfaces of the gratings. A plurality of quantum rods are arranged in the alignment microstructure of the sub-wavelength microstructure, and major axes of the quantum rods are aligned in a direction perpendicular to the gratings.

Abstract: A pixel interpolation method for interpolating a pixel value of a target pixel in a target picture is disclosed. The pixel interpolation method includes performing up-sampling upon the target picture for generating an up-sampled picture corresponding to the target picture, and interpolating the target pixel according to the up-sampled picture. The step of performing up-sampling upon the target picture includes interpolating and generating a third pixel in between a first pixel and a second pixel that are a pair of two adjacent pixels of each pixel line of the target picture, whereof a pixel value of the third pixel is an average of pixel values of the first pixel and the second pixel.

Abstract: An integrated LED light-emitting device includes: at least two mutually-isolated LED light-emitting epitaxial units having an upper and a lower surface, in which, the upper surface is a light-emitting surface; an electrode pad layer over the lower surface of the LED light-emitting epitaxial unit, with sufficient thickness for supporting the LED epitaxial unit and connecting to each LED light-emitting epitaxial unit to form a connection circuit plane with no height difference; and the electrode pad layer is divided into a P electrode region and an N electrode region. The LED light-emitting epitaxial units constitute a series, parallel or series-parallel circuit. Embodiments disclosed herein can effectively improve the problems of package welding, electrode shading and poor wiring stability.

Abstract: A digital transaction method is applied in a user device. The user device instructs a digital transaction management server system to bind a device identification code of the user device and an order after the user device purchases with the digital transaction management server system and accordingly obtains the order. The user device generates a digital certification and a safety code, wherein the safety code varies according to a predetermined varying sequence during a predetermined time interval. After the safety code passes through an electronic verification of a service provider, the user device requests the service provider to settle an electronic transaction.

Abstract: A method for anodizing and dyeing a metallic article including a first dipped end, a second dipped end opposite to the first dipped end, and a decorated surface located between the first dipped end and the second dipped end, includes steps as follows: anodizing the metallic article to form an anodization layer on the decorated surface by an anodizing treatment, in which the anodization layer is porous with a number of holes, an immersion time of the decorated surface immersed in the electrolyte solution changes gradually from the first dipped end toward the second dipped end, and a depth of the plurality of holes of the anodization layer after the anodizing step thereby changes gradually from the first dipped end toward the second dipped end; and coloring the metallic article sealed in a dyeing treatment.