Abstract: A wireless power system includes a control system configured to output radio waves to an environment and a wearable device having an energy harvesting device configured to receive the radio waves and to harvest energy from the received radio waves. The wearable device also includes a processor and a sensor configured to detect a state of the wearable device and output a state signal to the processor. The processor is configured to output a device control signal based on the detected state signal. The wearable device further includes a communicator configured to receive the device control signal from the processor and to provide an output to the control system based on the state of the wearable device. At least the processor, the sensor, or the communicator receive power via the energy harvested by the energy harvesting device.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a first doped region and a second doped region disposed within a substrate. A data storage structure is arranged over the substrate and laterally between the first doped region and the second doped region. An isolation structure is arranged within the substrate along a first side of the data storage structure. The first doped region is laterally between the isolation structure and the data storage structure. A remnant is arranged over and along a sidewall of the isolation structure. The remnant includes a first material having a vertically extending segment and a horizontally extending segment protruding outward from a sidewall of the vertically extending segment.

Abstract: A method is provided in which a monitor cell is made that is substantially identical to the flash memory cells of an embedded memory array. The monitor cell is formed simultaneously with the cells of the memory array, and so in certain critical aspects, is exactly comparable. An aperture is formed that extends through the control gate and intervening dielectric to the floating gate of the monitor cell. To prevent silicide contamination during a subsequent CMP process, a silicide protection layer (SPL), such as a resist protective oxide, is formed over exposed portions of the control gate prior to formation of a silicide contact formed on the floating gate. The SPL is formed simultaneously with existing manufacturing processes to avoid additional process steps.

Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A propellant applied to a thruster, especially a pulsed plasma thruster, has a composition including a polymer and a metal powder material mixed with the polymer. A method of manufacturing the propellant includes dissolving polymer particles in a solvent for generating a solution, adding a powdered metal material to the solution for obtaining a mixture, and drying the mixture for removing the solvent from the mixture. Accordingly, a dried mixture is acquired and defined as a metal composite polymer which serves as the composition of the propellant. Accordingly, the use of the propellant allows a decrease in the voltage involved in a punching process and an efficient reduction in the energy consumption and assists the thruster in increasing the propulsive efficiency.

Abstract: A device includes: alternating first rows and second rows correspondingly including first cell regions and second cell regions, each of the first cell regions and second cell regions correspondingly including active regions; in a first metallization layer over the active regions, each of the first cell regions and the second cell regions include first and second power grid (PG) segments, and one or more routing (RTE) segments; and in a first buried metallization layer under the active regions, each of the first cell regions includes first and second buried PG (BPG) segments, and each of the second cell regions includes one or more buried local interconnect (BLI) structures; and each of the first cell regions is free from including a BLI structure.

Abstract: The present invention provides a thermoplastic elastomer composition for foaming. The thermoplastic elastomer composition comprises: (A) an ethylene-based copolymer; (B) an olefin block copolymer; (C) an unsaturated aliphatic rubber; and (D) a crosslinking agent. The olefin block copolymer is different from the ethylene-based copolymer. The weight ratio of the unsaturated aliphatic rubber (C) to the olefin block copolymer (B) is 1:1.5 to 1:5.

Abstract: An image sensor device is provided. The image sensor device includes a substrate having a front surface, a back surface, and a light-sensing region. The image sensor device includes a first isolation structure extending from the front surface into the substrate. The first isolation structure surrounds a first portion of the light-sensing region, the first isolation structure has an etch stop layer, the etch stop layer has an end portion, and the end portion has an H-like shape. The image sensor device includes a second isolation structure extending into the substrate from the back surface to the end portion. The second isolation structure surrounds a second portion of the light-sensing region.

Abstract: Some embodiments relate to an integrated device, including a substrate having a first side and a second side opposite the first side, the substrate being a first material; a first wire level on the first side of the substrate and having a first wire; a second wire level on the second side of the substrate and having a second wire; a through-substrate via (TSV) extending from the first wire to the second wire through the substrate; a shallow trench isolation (STI) region surrounding the TSV at the second side of the substrate; and a semiconductor region between the STI region and the TSV, the semiconductor region comprising the first material.

Abstract: A semiconductor device including a first active area layer that extends in a first direction, a first metal over diffusion layer that extends in a second direction that is different than the first direction, the first metal over diffusion layer situated over the first active area layer, a first gate that extends in the second direction and over the first active area layer, a first gate end of the first gate that abuts a first dielectric region, and first low-k dielectric material situated in the first dielectric region.

Abstract: Methods and systems for generating training data for training a contrastive language-audio machine-learning model. A plurality of audio segments are retrieved from a speech emotion recognition (SER) database along with metadata associated with the audio segments. The metadata of each audio segment includes an emotion class. Words or terms associated with emotions are retrieved from a lexicon. A large language model (LLM) is executed on (i) the classes of emotion associated with the audio segments and (ii) the words or terms from the lexicon. This generates a plurality of text captions associated with emotion, which are stored in a caption pool. For each audio segment retrieved from the SER database, that audio segment is paired with one or more of the text captions from the caption pool that were generated based on the emotion class associated with that audio segment. This yields audio-text pairs for training a contrastive learning model.

Abstract: An integrated circuit includes frontside power rails in a frontside metal layer above the substrate, backside signal lines in a first backside metal layer below the substrate, backside power rails in a second backside metal layer below the first backside metal layer, and backside via-connectors passing through the substrate. A first frontside power rail and a first backside via-connector are conductively connected to the source terminal of a first-type transistor. A second frontside power rail and a second backside via-connector are conductively connected to the source terminal of a second-type transistor. A first extended via-connector is directly connected between the first backside via-connector and a first backside power rail. A second extended via-connector is directly connected between the second backside via-connector and a second backside power rail.

Abstract: An optical fiber connection base is provided, including a socket, a light emitting module, and an optical fiber bundle. The socket has an extension portion and a base having an accommodating space. The base is provided with an insertion hole and an alignment hole that are spatially communicated with each other. A first direction extends along the insertion hole. A side surface of the light emitting element of the light emitting module corresponds to the insertion hole, defining a light emitting surface. One end of the optical fiber bundle is inserted into the insertion hole in the first direction, such that a light receiving end is defined. The light receiving end is adjacent to the light emitting surface, and a center of a cross section of the light receiving end corresponds to a center of the light emitting surface.

Abstract: A corrosion resistant structure is provided. The corrosion resistant structure includes a steel layer, a metal layer, and an organic layer. The metal layer contains zinc, aluminum, or a combination thereof. The metal layer is disposed on the steel layer. The metal layer is in contact with the steel layer. The metal layer and the steel layer have different compositions. The organic layer is disposed on the metal layer. The organic layer is in contact with the metal layer. The organic layer includes an organic resin, a diol compound containing two aliphatic rings, and an alkali earth metal salt.

Abstract: A method for acquiring skills through imitation learning by employing a meta imitation learning framework with structured skill discovery (MILD) is presented. The method includes learning behaviors or tasks, by an agent, from demonstrations: by learning to decompose the demonstrations into segments, via a segmentation component, the segments corresponding to skills that are transferrable across different tasks, learning relationships between the skills that are transferrable across the different tasks, employing, via a graph generator, a graph neural network for learning implicit structures of the skills from the demonstrations to define structured skills, and generating policies from the structured skills to allow the agent to acquire the structured skills for application to one or more target tasks.

Abstract: A stylus control circuit used to control a stylus includes a positioning signal generator. The positioning signal generator is used to generate a first positioning signal having a first frequency and transmit the first positioning signal to the stylus through a first positioning transmission electrode. Wherein, the first frequency corresponds to a position of the first positioning transmission electrode, and the first positioning signal is a frequency signal without carrying any digital data.

Abstract: A package component includes a first substrate and a first conductive layer. The first substrate has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed over the first surface of the first substrate. The first conductive layer includes a first conductive feature and a second conductive feature over the first conductive feature. The second conductive features covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the second conductive feature. The first substrate includes a single-sided or a double-sided copper-clad laminate.

Abstract: A method for acquiring skills through imitation learning by employing a meta imitation learning framework with structured skill discovery (MILD) is presented. The method includes learning behaviors or tasks, by an agent, from demonstrations: by learning to decompose the demonstrations into segments, via a segmentation component, the segments corresponding to skills that are transferrable across different tasks, learning relationships between the skills that are transferrable across the different tasks, employing, via a graph generator, a graph neural network for learning implicit structures of the skills from the demonstrations to define structured skills, and generating policies from the structured skills to allow the agent to acquire the structured skills for application to one or more target tasks.

Abstract: The present disclosure relates to medical implant components comprising a biocompatible-bioactive composite material layer (BACL), methods of making the medical implant components and applications of the medical implant components.