Abstract: A computer-implemented method is disclosed for speeding up database access of electronic design automation (EDA) tool which utilizes a database manager for file access. The EDA tool accesses a plurality of design files, and each of the plurality of design files is associated with one of a plurality of design units for an integrated circuit (IC). The plurality of design files are encapsulated into an archive file which comprises a plurality of data units, wherein each of the data units corresponds to a design file. A request to access a design file will be redirected to access the archive file. The design file is then accessed by accessing the corresponding data unit in the archive file.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.

Abstract: The present invention discloses an electronic device charger, mainly comprising: a voltage converting module, a microprocessor, a low voltage detecting unit, and an over voltage sensing unit. When a rated output voltage of a vehicle battery of an electric vehicle is detected to be lower than a first threshold voltage by the low voltage detecting unit or found to be higher than a second threshold voltage by the over voltage sensing unit, the microprocessor immediately stops the vehicle battery providing electrical power to at least one portable electronic device owned by the driver of the electric vehicle. Therefore, the electronic device charger can not only save the energy of the vehicle battery while the vehicle battery is at a low voltage state, but also protect the portable electronic devices from being damaged by the electrical power as the rated output voltage of the vehicle battery exceed a normal voltage level.

Abstract: A rapid screening device has a sensing unit, a processing unit and a carrier, the processing unit is connected to the sensing unit, the sensing unit and the processing unit are disposed on the carrier, the sensing unit captures an image of an eyeball and outputs an image signal of the eyeball, the image of the eyeball is resolved from the image signal of the eyeball, the processing unit retrieves a plurality of images from the sensing unit within a predetermined time interval and executes an algorithm to generate a calculated result by the images of the image signals of the eyeball, and the calculated result is used to diagnose or predict a disease.

Abstract: An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

Abstract: An electronic display structure includes a scanning driver circuit for transmitting scan signals to a number of pixel display areas of a display panel, a data driver circuit for transmitting positive and negative display grayscale voltages to the pixel display areas and receiving feedback grayscale voltages corresponding to the display grayscale voltages, a switching circuit for electrically coupling the data driver circuit to or electrically uncoupling the data driver circuit from the pixel display areas, and a common voltage circuit configured to transmit a common voltage to each of the pixel display areas and adjust the common voltage in response to the feedback grayscale voltages. The positive and negative display grayscale voltages and the common voltage cooperatively induce an electric field for driving liquid crystals of a liquid crystal layer to rotate to display images.

Abstract: A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.

Abstract: An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.

Abstract: A chip package process includes the following steps. A supporting structure and a carrier plate are provided. The supporting structure has a plurality of openings. The supporting structure is disposed on the carrier plate. A plurality of chips is disposed on the carrier plate. The chips are respectively located in the openings of the supporting structure. An encapsulated material is formed to cover the supporting structure and the chips. The supporting structure and the chips are located between the encapsulated material and the carrier plate. The encapsulated material is filled between the openings and the chips. The carrier plate is removed. A redistribution structure is disposed on the supporting structure, wherein the redistribution structure is connected to the chips.

Abstract: An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

Abstract: An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.

Abstract: A loop tower CO2 capture system includes a feeding unit, a carbonator, an accumulator, a calciner, a combustion chamber and a gas blower. The feeding unit has a first gas pipe. The carbonator includes multiple first cyclone dust collecting units. The first gas pipe has one end connected to the uppermost first cyclone dust collecting unit. The accumulator is connected to the lowermost first cyclone dust collecting unit, and is located between the carbonator and the calciner. The calciner includes multiple second cyclone dust collecting units. The accumulator is connected to the uppermost second cyclone dust collecting unit. The first gas pipe has the other end connected to the lowermost second cyclone dust collecting unit. The combustion chamber is connected to the lowermost second cyclone dust collecting unit. The gas blower is connected to the first gas pipe of the feeding unit.

Abstract: A recirculated-suspension pre-calciner system is disclosed, comprising: a vortex cyclone dust collecting equipment including a plurality of devices, wherein a top device of the vortex cyclone dust collecting equipment is used as a feed system; a vertical combustion kiln; a blower; and a powder purge system, wherein powders in the feed system fall into the vortex cyclone dust collecting equipment and pass through a plurality of the devices to mix and exchange heat with flue gas comprising CO2, generating calcination reaction and releasing CO2 into the flue gas. and the steam is separated and transported to the feed system by the blower and acts as a carrier gas of powders.

Abstract: The invention discloses an herbal extract of treating lung tumor. The herbal extract comprises Antrodia cinnamomea and Cordyceps militaris, and the herbal extract is manufactured as following: mingling Antrodia cinnamomea and Cordyceps militaris with a weight ratio being between 1:5 and 5:1 to obtain a mixture; blending the mixture with a solvent with a weight-volume percentage being 50%, followed by extracting at 40-90° C. to obtain a herbal solution; and concentrating the herbal solution to obtain the herbal extract.

Abstract: A method for managing design files shared by multiple users is provided. A plurality of design files are stored in a design library. A lock table is moved to a memory of a first computer when information of the lock table indicates that the design files were locked by a first process corresponding to a first user, wherein the memory is only accessible to performance of the first process. The lock table is moved from the memory to a common memory of the first computer when one design file is locked by a second process corresponding to a second user. The first and second processes are being performed in the first computer. The lock table is moved from the memory to the design library when the one design file is locked by the second process corresponding to the second user, wherein the second process is performed in a second computer.

Abstract: The present invention provides a rapid screening device for brain disease to diagnose a patient's disease of cranial nerves by the states of the patient's eyeball. The rapid screening device for brain disease comprises a sensing unit, a processing unit and a carrier. The sensing unit can capture an image of the patient's eyeball. The sensing unit outputs an image signal of the eyeball, wherein the image of at least one eyeball can be resolved from the image signal of the eyeball. The processing unit is connected to the sensing unit. The processing unit retrieves a plurality of images from the sensing unit within a predetermined time interval, and the processing unit executes an algorithm to generate a calculated result by the images of the image signals of the eyeball. The carrier is provided with the sensing unit and the processing unit, wherein the calculated result is used to diagnose or predict that the disease happens to the patient.

Abstract: A method of culturing Antrodia cinnamomea and obtaining Antrodia cinnamomea with improved contents of antcin C and zhankuic acid C is disclosed in the invention. The method comprises: providing a wood segment of Cinnamomum kanehirai; inoculating a strain of Antrodia cinnamomea to the wood segment, to obtain the wood segment inoculated with the strain of Antrodia cinnamomea with 0.162 g dry weight of hyphae and mycelia of the strain of Antrodia cinnamomea per kg wood segment; and irradiating the wood segment inoculated with the strain of Antrodia cinnamomea by a light of wavelength of 600-700 nm to obtain a fruit body; wherein an irradiation time of the wood segment inoculated with the strain of Antrodia cinnamomea is 8-12 hours per day for 30-40 days.

Abstract: A touch display device includes a first substrate, a second substrate, a number of first sensing electrodes formed on the first substrate, a number of second sensing electrodes formed on the second substrate, a touch integrated circuit set on the first substrate, and a number of connecting wires formed on the first substrate. The touch integrated circuit includes a number of first pins correspondingly connected to the first sensing electrodes and a number of second pins correspondingly connected to the second sensing electrodes. The connecting wires correspondingly connect two opposite terminals of the first sensing electrodes with two opposite ends of the first pins. A part of connecting wires are arranged between the first pins and the second pins. The first substrate includes a shielding sheet formed in the first substrate and located above the part of the connecting wires arranged between the first pins and the second pins.