Abstract: A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.

Abstract: A waterproof motor stator structure includes a circuit board; a stator mounted on one face of the circuit board; a lower shell forming an open-topped annular recess for receiving the circuit board therein and having an central opening communicable with the annular recess; an upper shell fitted around an outer side of the stator; and a protective layer formed in the annular recess of the lower shell to encapsulate the circuit board and an open lower end of the upper shell, so that the lower shell and the upper shell are joined into an integral unit. With these arrangements, the stator located in between the lower and upper shells can be effectively protected against external moisture and salt spray with reduced time, labor and material costs while enabling extended service life a fan using same.

Abstract: A motor protection structure includes a stator assembly, a casing and a filling material. The stator assembly is coated with a coating and fitted on one side of the casing. The casing has a receiving space for receiving a circuit board. The filling material is filled in the receiving space to enclose the circuit board. The filling material is connected to the coating to fully seal the stator assembly and the casing so as to lower manufacturing cost and shorten working time.

Abstract: A method of cleaning and drying a semiconductor wafer including inserting a semiconductor wafer into a chamber of a cleaning tool, spinning the semiconductor wafer in a range of about 300 revolutions per minute to about 1600 revolutions per minute, and simultaneously spraying the semiconductor wafer with de-ionized water and a mixture of isopropyl alcohol and nitrogen.

Abstract: A recirculated-suspension pre-calciner system is disclosed, comprising: a vortex cyclone dust collecting equipment including a plurality of devices, wherein a top device of the vortex cyclone dust collecting equipment is used as a feed system; a vertical combustion kiln; a blower; and a powder purge system, wherein powders in the feed system fall into the vortex cyclone dust collecting equipment and pass through a plurality of the devices to mix and exchange heat with flue gas comprising CO2, generating calcination reaction and releasing CO2 into the flue gas. and the steam is separated and transported to the feed system by the blower and acts as a carrier gas of powders.

Abstract: A computer-implemented method is disclosed for speeding up database access of electronic design automation (EDA) tool which utilizes a database manager for file access. The EDA tool accesses a plurality of design files, and each of the plurality of design files is associated with one of a plurality of design units for an integrated circuit (IC). The plurality of design files are encapsulated into an archive file which comprises a plurality of data units, wherein each of the data units corresponds to a design file. A request to access a design file will be redirected to access the archive file. The design file is then accessed by accessing the corresponding data unit in the archive file.

Abstract: A fan impeller structure includes a frame body, a cover body and a hub. The frame body has a receiving space. The cover body has a wind inlet in communication with the receiving space. The hub is rotatably disposed in the receiving space and has multiple blades annularly arranged on a circumference of the hub. Each blade has a top end and a bottom end. The top end has a projection extending from the top end toward the cover body. An axial space is defined between the blades and the hub. The projections formed at the top ends of the blades are able to effectively prevent the air flowing within the receiving space from escaping. Accordingly, the wind pressure and wind intensity are enhanced to achieve an excellent heat dissipation effect.

Abstract: A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.

Abstract: A dispenser for adjusting rationing liquid includes a base having a space defined therein. A saddle head is movably sleeved on the base. The saddle head has a pathway defined therein and passing therethrough. The saddle head has a piston movably received in the space. The piston has an outer periphery abutting against an inner periphery of the space. A spring is sleeved on the base. An upper valve set is mounted in the pathway and a lower valve set is mounted in the space in the base.

Abstract: A pump structure for dispenser includes a base having a space defined therein and passing therethrough. The base has a vertical groove axially defined in an outer periphery thereof and a plurality of horizontal grooves parallelly defined in the outer periphery thereof and communicated with the horizontal grooves. A base ring is sleeved on the base. The base ring has a protrusion extending from an inner periphery thereof for slidably moving in the vertical groove and the horizontal groove. A saddle head is movably sleeved on the base. An upper valve set is mounted in a pathway in the saddle head and a lower valve set is mounted in the space in the base.

Abstract: A refill pouch includes a head member and a pouch member connected with the head member. The head member has a threaded portion and a disc portion formed thereon. The threaded portion has one end connected with a top side of the disc portion. The threaded portion adapts to be threadedly connected with a pump head. The head member has a through hole defined therein and extending through the threaded portion and the disc portion. The pouch member is securely connected with a bottom side of the disc portion. The pouch member has an opening defined in a top thereof and located corresponding to the through hole for communicating with the through hole. The pouch member has a wall thickness gradually decreasing from the top to a bottom thereof.

Abstract: A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.

Abstract: A vapor deposition apparatus includes a susceptor, a gas supply unit, a heating unit and a rotation unit. The susceptor has a first substrate-holding portion and a second substrate-holding portion. The first substrate-holding portion has a first depth, and the second substrate-holding portion has a second depth that is larger than the first depth. The gas supply unit supplies precursors to the susceptor. The heating unit is used to heat the susceptor. The rotation unit can rotate the susceptor so that the heating unit can uniformly heat the susceptor. Because the second depth is larger than the first depth, the substrate held in the second substrate-holding portion can not directly contact the susceptor with a higher temperature and thus its temperature is lower than the second substrate-holding portion, so as to maintain the uniformity of the properties of the manufactured chips.

Abstract: A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.

Abstract: A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.

Abstract: A system for displaying image includes a driving circuit of a liquid crystal displaying device. The driving circuit of the liquid crystal displaying device includes a shift register, a voltage booster and a sample switch. The shift register receives an input pulse signal and shifts the input pulse signal to output an output pulse signal. The voltage booster is electrically connected with the shift register to receive the output pulse signal, and generates a boost voltage to output a boost signal within the enable time of the output pulse signal. The sample switch is electrically connected with the voltage booster to receive the boost signal. The boost signal controls the sample switch to sample a data signal.

Abstract: A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.

Abstract: A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.

Abstract: A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.

Abstract: A resealable box includes a plurality of peripheral panels connected to one another to form a frame body having a top opening and a bottom opening. A plurality of first cover flaps and second cover flaps extend from top and bottom sides of the peripheral panels and are alternatively arranged around the top opening and the bottom opening for covering the top opening and the bottom opening. A plurality of fasteners each have a first fastening member disposed at one of the first cover flaps and a second fastening member disposed at one of the second cover flaps and detachably coupled to the first fastening member for enabling the first cover flaps and the second cover flaps to close the top and bottom openings of the frame body.