Abstract: A computer-implemented method is disclosed for speeding up database access of electronic design automation (EDA) tool which utilizes a database manager for file access. The EDA tool accesses a plurality of design files, and each of the plurality of design files is associated with one of a plurality of design units for an integrated circuit (IC). The plurality of design files are encapsulated into an archive file which comprises a plurality of data units, wherein each of the data units corresponds to a design file. A request to access a design file will be redirected to access the archive file. The design file is then accessed by accessing the corresponding data unit in the archive file.

Abstract: A fan impeller structure includes a frame body, a cover body and a hub. The frame body has a receiving space. The cover body has a wind inlet in communication with the receiving space. The hub is rotatably disposed in the receiving space and has multiple blades annularly arranged on a circumference of the hub. Each blade has a top end and a bottom end. The top end has a projection extending from the top end toward the cover body. An axial space is defined between the blades and the hub. The projections formed at the top ends of the blades are able to effectively prevent the air flowing within the receiving space from escaping. Accordingly, the wind pressure and wind intensity are enhanced to achieve an excellent heat dissipation effect.

Abstract: A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.

Abstract: A dispenser for adjusting rationing liquid includes a base having a space defined therein. A saddle head is movably sleeved on the base. The saddle head has a pathway defined therein and passing therethrough. The saddle head has a piston movably received in the space. The piston has an outer periphery abutting against an inner periphery of the space. A spring is sleeved on the base. An upper valve set is mounted in the pathway and a lower valve set is mounted in the space in the base.

Abstract: A pump structure for dispenser includes a base having a space defined therein and passing therethrough. The base has a vertical groove axially defined in an outer periphery thereof and a plurality of horizontal grooves parallelly defined in the outer periphery thereof and communicated with the horizontal grooves. A base ring is sleeved on the base. The base ring has a protrusion extending from an inner periphery thereof for slidably moving in the vertical groove and the horizontal groove. A saddle head is movably sleeved on the base. An upper valve set is mounted in a pathway in the saddle head and a lower valve set is mounted in the space in the base.

Abstract: A refill pouch includes a head member and a pouch member connected with the head member. The head member has a threaded portion and a disc portion formed thereon. The threaded portion has one end connected with a top side of the disc portion. The threaded portion adapts to be threadedly connected with a pump head. The head member has a through hole defined therein and extending through the threaded portion and the disc portion. The pouch member is securely connected with a bottom side of the disc portion. The pouch member has an opening defined in a top thereof and located corresponding to the through hole for communicating with the through hole. The pouch member has a wall thickness gradually decreasing from the top to a bottom thereof.

Abstract: A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.

Abstract: A vapor deposition apparatus includes a susceptor, a gas supply unit, a heating unit and a rotation unit. The susceptor has a first substrate-holding portion and a second substrate-holding portion. The first substrate-holding portion has a first depth, and the second substrate-holding portion has a second depth that is larger than the first depth. The gas supply unit supplies precursors to the susceptor. The heating unit is used to heat the susceptor. The rotation unit can rotate the susceptor so that the heating unit can uniformly heat the susceptor. Because the second depth is larger than the first depth, the substrate held in the second substrate-holding portion can not directly contact the susceptor with a higher temperature and thus its temperature is lower than the second substrate-holding portion, so as to maintain the uniformity of the properties of the manufactured chips.

Abstract: A process for fabricating a circuit substrate is provided. A patterned conductive layer having an inner pad is provided on a base layer, a dielectric layer is disposed on the base layer and covers the patterned conductive layer, and a covering layer is disposed on the dielectric layer. A part of the covering layer is removed by dry etching to form a first opening. A part of the dielectric layer exposed by the first opening is removed to form a dielectric opening exposing a part of the inner pad. A patterned mask having a second opening to expose a part of the inner pad is formed on the covering layer. A conductive structure including a conductive block filling the dielectric opening, an outer pad filling the first opening and a surplus layer filling the second opening is formed. Finally, the patterned mask, surplus layer and covering layer are removed.

Abstract: A circuit board includes a substrate that has a top surface and a base surface opposite to each other, at least a top pad disposed on the top surface, a top solder resist layer disposed on the top surface and covering a portion of the top pad, and a pre-bump disposed on the top pad. The top solder resist layer has a first opening exposing a portion of the top pad. The pre-bump is located in the first opening and has a protrusion protruding from the top solder resist layer. A maximum width of the protrusion is less than or equal to a width of the top pad. A chip package structure having the circuit board is also provided.

Abstract: A system for displaying image includes a driving circuit of a liquid crystal displaying device. The driving circuit of the liquid crystal displaying device includes a shift register, a voltage booster and a sample switch. The shift register receives an input pulse signal and shifts the input pulse signal to output an output pulse signal. The voltage booster is electrically connected with the shift register to receive the output pulse signal, and generates a boost voltage to output a boost signal within the enable time of the output pulse signal. The sample switch is electrically connected with the voltage booster to receive the boost signal. The boost signal controls the sample switch to sample a data signal.

Abstract: A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.

Abstract: A fabrication method of a circuit board is provided. A substrate, a top pad, a base pad electrically connecting the top pad, and a top and a base solder resist layers are provided. The top and the base pads are disposed on two opposite surfaces of the substrate, respectively. The top solder resist layer having a first opening partially exposing the top pad and the base solder resist layer having a second opening partially exposing the base pad are disposed on the two surfaces, respectively. A conductive layer covering the base solder resist layer and the base pad is formed. A plating resist layer having a third opening is formed on the conductive layer. A current is applied to the conductive layer through the third opening for electroplating a pre-bump on the top pad. The plating resist layer and the conductive layer are then removed.

Abstract: A circuit board assembly includes: a circuit board having opposite first and second surfaces and formed with a first through-hole defined by a hole-defining wall that extends between and that terminates at the first and second surfaces and that cooperates with the first and second surfaces to define first and second turns, respectively, the circuit board further having an abutting wall that extends between and that terminates at the first and second surfaces and that cooperates with the second surface to define a third turn; and an electric wire having a fixed end that is soldered to the circuit board, extending through the first through-hole, and passing over the first, second and third turns of the circuit board so as to form an inflection region between the first and second turns.

Abstract: A resealable box includes a plurality of peripheral panels connected to one another to form a frame body having a top opening and a bottom opening. A plurality of first cover flaps and second cover flaps extend from top and bottom sides of the peripheral panels and are alternatively arranged around the top opening and the bottom opening for covering the top opening and the bottom opening. A plurality of fasteners each have a first fastening member disposed at one of the first cover flaps and a second fastening member disposed at one of the second cover flaps and detachably coupled to the first fastening member for enabling the first cover flaps and the second cover flaps to close the top and bottom openings of the frame body.

Abstract: A system for displaying image includes a driving circuit of a liquid crystal displaying device. The driving circuit of the liquid crystal displaying device includes a shift register, a voltage booster and a sample switch. The shift register receives an input pulse signal and shifts the input pulse signal to output an output pulse signal. The voltage booster is electrically connected with the shift register to receive the output pulse signal, and generates a boost voltage to output a boost signal within the enable time of the output pulse signal. The sample switch is electrically connected with the voltage booster to receive the boost signal. The boost signal controls the sample switch to sample a data signal.

Abstract: A charge pump is disclosed, comprising a plurality of sub-charge pumps connected in series, each comprising a charging switch module turned on or off according to a charging clock signal and a capacitor connected between the charging switch module and a reference clock signal. The charge pump further comprises at least one additional switch module connecting to a reference-clock-providing sub-charge pump and a reference-clock-accepting sub-charge pump among the sub-charge pumps to provide the reference clock signal of the reference-clock-accepting sub-charge pump according to an additional clock signal.

Abstract: A magnetic suspension bearing located between the spindle and stator of a rotational device includes stator magnetic units mounted on the top side and bottom side of the stator and spindle magnetic units, which are mounted on two ends of the spindle. One end of the spindle has a loading section to support the spindle. The stator magnetic units and the spindle magnetic units generate a repulsive magnetic force to separate the spindle and stator from one another at a selected distance to avoid vibration and noise caused by obliquity and to increase the service life of products.

Abstract: A magnetic suspension bearing with damping system includes a stator having a stator magnetic unit mounted on the internal portion of the stator, and a rotor rotatably located at the stator. A rotor magnetic unit installed on the rotor corresponding to the stator magnetic. The rotor further has a yoke having a magnetic driving unit corresponding to the external portion of the stator. A magnetic damping device located has a magnetic unit and an elastic unit, wherein the magnetic unit corresponding to the magnetic driving unit generates magnetic force between them, and the elastic unit coupled below the magnetic unit uses to reduce the vibration of the magnetic unit for maintaining the rotation of the rotor smooth and steady.

Abstract: A magnetic suspension bearing with damping system includes a stator having a stator magnetic unit mounted on the internal portion of the stator, and a rotor rotatably located at the stator. A rotor magnetic unit installed on the rotor corresponding to the stator magnetic. The rotor further has a yoke having a magnetic driving unit corresponding to the external portion of the stator. A magnetic damping device located has a magnetic unit and an elastic unit, wherein the magnetic unit corresponding to the magnetic driving unit generates magnetic force between them, and the elastic unit coupled below the magnetic unit uses to reduce the vibration of the magnetic unit for maintaining the rotation of the rotor smooth and steady.