Patents by Inventor Wei-Cheng Ku

Wei-Cheng Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200400740
    Abstract: A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.
    Type: Application
    Filed: June 3, 2020
    Publication date: December 24, 2020
    Applicant: MPI Corporation
    Inventors: Kang-Yen Fu, Ya-Hung Lo, Shou-Jen Tsai, Wei-Cheng Ku
  • Patent number: 10295567
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: May 21, 2019
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 10101362
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: October 16, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Yu-Hao Chen, Chih-Hao Ho
  • Patent number: 10070512
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: September 4, 2018
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 10067163
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: September 4, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Patent number: 10054627
    Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: August 21, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Chia-Nan Chou, Chih-Hao Ho
  • Patent number: 10033989
    Abstract: A synchronization controller for a multi-sensor camera device includes a detection circuit and a control circuit. The detection circuit detects asynchronization between image outputs generated from the multi-sensor camera device, wherein the image outputs correspond to different viewing angles. The control circuit controls an operation of the multi-sensor camera device in response to the asynchronization detected by the detection circuit. In addition, a synchronization method applied to a multi-sensor camera device includes following steps: detecting asynchronization between image outputs generated from the multi-sensor camera device, wherein the image outputs correspond to different viewing angles; and controlling an operation of the multi-sensor camera device in response to the detected asynchronization.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: July 24, 2018
    Assignee: MEDIATEK INC.
    Inventors: Tung-Hai Wu, Wei-Cheng Ku, Chung-Hung Tsai, Yuan-Chung Lee
  • Patent number: 9927487
    Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: March 27, 2018
    Assignee: MPI CORPORATION
    Inventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
  • Patent number: 9880252
    Abstract: A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.
    Type: Grant
    Filed: January 9, 2017
    Date of Patent: January 30, 2018
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Shao-Wei Lu, Hao Wei, Yu-Tse Wang
  • Patent number: 9835651
    Abstract: A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: December 5, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Jun-Liang Lai, Chih-Hao Ho
  • Patent number: 9759743
    Abstract: A testing system includes a test machine, a plurality of probe sets, a data input device, a controller, a memory, and a data output device. The test machine has a platform for a DUT to be placed thereon, and a test arm which is movable relative to the platform. The probe sets are provided on the test machine with at least one probe set provided on the test arm to contact the DUT. The data input device is used to input information about the DUT. The controller is electrically connected to the test arm, the probe set on the test arm, and the data input device to move the test arm to a predetermined position according to the inputted information, and to make the probe set contact the DUT for electrical test. The memory saves electrical test result, which is outputted by the data output device.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: September 12, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Shao-Wei Lu, Hao Wei, Yu-Tse Wang
  • Patent number: 9759746
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: September 12, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Hao Wei, Shin-Lan Kao
  • Publication number: 20170150592
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Application
    Filed: February 3, 2017
    Publication date: May 25, 2017
    Applicant: MPI corporation
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, CHIH-HAO HO
  • Publication number: 20170146634
    Abstract: A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.
    Type: Application
    Filed: January 9, 2017
    Publication date: May 25, 2017
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHAO-WEI LU, HAO WEI, YU-TSE WANG
  • Patent number: 9658249
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: May 23, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Patent number: 9645197
    Abstract: A method of operating a testing system is provided, wherein the testing system has a test machine and a probe module, which has a first probe set and a second probe set. One of the first probe set and the second probe set can be connected to the test machine. The method includes the following steps: connect the test machine and the first probe set; calibrate the testing system; abut the first probe set against a DUT to do electrical tests; disconnect the first probe set and the DUT; disconnect the test machine and the first probe set; connect the test machine and the second probe set; calibrate the testing system again; abut the second probe set against the DUT to do electrical tests.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: May 9, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Shao-Wei Lu, Hao Wei, Yu-Tse Wang
  • Publication number: 20170115326
    Abstract: A probe module includes a base adapted to be fixed to a tester, an engaging seat engaged with the base, a signal connector, an electrical signal transmitting member, and two probes located below the engaging seat. The engaging seat has an engaging opening and a first end surface. The signal connector is provided in the engaging opening, and has a signal conductive portion and a conductive ground. A signal wire and a ground layer of the electrical signal transmitting member are electrically connected to the signal conductive portion and the conductive ground, respectively. The probes are electrically connected to the signal wire and the ground layer, respectively. The probes extend out of a first extending reference plane of the first end surface. Alternatively, a reflector is used to reflect an image of the probes upward. Whereby, a length of the electrical signal transmitting member can be further shortened.
    Type: Application
    Filed: October 25, 2016
    Publication date: April 27, 2017
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, CHIH-HAO HO, HAO WEI
  • Patent number: 9622348
    Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: April 11, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chun-Chung Huang, Jing-Zhi Hung, Yung Nan Wu, Chih-Hao Ho
  • Patent number: 9596769
    Abstract: A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: March 14, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai, Chih-Hao Ho
  • Publication number: 20170059613
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a band circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the band circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Application
    Filed: November 9, 2016
    Publication date: March 2, 2017
    Inventors: Wei-Cheng KU, Jun-Liang LAI