Patents by Inventor Wei-Cheng Ku

Wei-Cheng Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150233969
    Abstract: A testing system includes a test machine, a plurality of probe sets, a data input device, a controller, a memory, and a data output device. The test machine has a platform for a DUT to be placed thereon, and a test arm which is movable relative to the platform. The probe sets are provided on the test machine with at least one probe set provided on the test arm to contact the DUT. The data input device is used to input information about the DUT. The controller is electrically connected to the test arm, the probe set on the test arm, and the data input device to move the test arm to a predetermined position according to the inputted information, and to make the probe set contact the DUT for electrical test. The memory saves electrical test result, which is outputted by the data output device.
    Type: Application
    Filed: November 25, 2014
    Publication date: August 20, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHAO-WEI LU, HAO WEI, YU-TSE WANG
  • Publication number: 20150212186
    Abstract: A method of calibrating and operating a testing system is provided, wherein the testing system has a test machine, a conducting wire set, a calibration module, and a probe module. The method includes the following steps: electrically connect the test machine and the conducting wire set; electrically connect the conducting wire set and the calibration module; send out electrical signals from the test machine to the calibration module for doing at least one test among a short-circuit test, an open-circuit test, and an impedance test, and then calibrate the testing system by correspondingly performing compensation based on results of these tests; electrically disconnect the conducting wire set and the calibration module, and electrically connect the conducting wire set and the probe module; abut the probe module against a DUT; send out electrical signals from the test machine to the probe module to do electrical tests on the DUT.
    Type: Application
    Filed: December 2, 2014
    Publication date: July 30, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHAO-WEI LU, SHOU-JEN TSAI, YU-TSE WANG
  • Publication number: 20150204906
    Abstract: A testing jig includes a substrate and a plurality of conductive elastic pieces, wherein the substrate has a recess and a plurality of circuits; the recess is located on a top surface of the substrate, while the circuits are provided on the top surface of the substrate. The conductive elastic pieces are provided on the substrate, and are respectively electrically connected to the circuits. Each of the conductive elastic pieces has a contact portion located within an orthographic projection range of the recess, wherein each of the contact portions contacts a pad of a DUT. Whereby, attenuation happens while transmitting test signals with high frequency can be effectively reduces by using the conductive elastic pieces to transmit test signals.
    Type: Application
    Filed: December 2, 2014
    Publication date: July 23, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, CHIA-NAN CHOU, CHIH-HAO HO
  • Publication number: 20150204929
    Abstract: A testing system includes a test machine, a communication device, a server, and a user-end device. The test machine does electrical test on an electronic product, wherein the test machine generates a first signal when the test is completed, and generates a second signal when the measured yield is lower than a predetermined threshold. The communication device is electrically connected to the test machine to receive the first signal or the second signal. The communication device correspondingly converts the received signals into first information or second information, and then outputs the first and the second information to a first network. The server communicates with the first network to receive the first and the second information outputted by the communication device, and then outputs the received information to a second network. The user-end device communicates with the second network to receive the first and the second information outputted by the server.
    Type: Application
    Filed: December 1, 2014
    Publication date: July 23, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHOA-WEI LU, YU-TSE WANG
  • Publication number: 20150204908
    Abstract: An electrical testing machine includes a base having two parallel first rails, a platform provided on the base, a probe holder provided on the base and having a plurality of placement locations, a support provided between the first rails and having a second rail thereon, a test arm provided on the second rail and above the platform, a receiving seat provided on the test arm, and a plurality of probe sets, wherein one of the probe sets is engaged on the receiving seat, while the others are respectively provided on the placement locations. The support is movable relative to the base and the platform. The test arm is movable along with the support, and is also movable relative to the support. The receiving seat is movable or rotatable relative to the test arm. The probe set engaged on the receiving seat is movable along with the receiving seat.
    Type: Application
    Filed: December 1, 2014
    Publication date: July 23, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHAO-WEI LU, HUNG-CHIH SUNG, CHUN-NAN CHEN
  • Publication number: 20150204905
    Abstract: A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.
    Type: Application
    Filed: December 2, 2014
    Publication date: July 23, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, CHIA-NAN CHOU, CHIH-HAO HO
  • Publication number: 20150204962
    Abstract: A method of operating a testing system is provided, wherein the testing system has a test machine and a probe module, which has a first probe set and a second probe set. One of the first probe set and the second probe set can be connected to the test machine. The method includes the following steps: connect the test machine and the first probe set; calibrate the testing system; abut the first probe set against a DUT to do electrical tests; disconnect the first probe set and the DUT; disconnect the test machine and the first probe set; connect the test machine and the second probe set; calibrate the testing system again; abut the second probe set against the DUT to do electrical tests.
    Type: Application
    Filed: December 1, 2014
    Publication date: July 23, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHAO-WEI LU, HAO WEI, YU-TSE WANG
  • Publication number: 20150204907
    Abstract: An electrical testing device includes a base having two parallel first rails, a platform provided on the base, a support provided between the first rails, a test arm, a rotary table provided on the test arm, a plurality of holders provided on the rotary table, and a plurality of probe sets respectively provided on the holders. The support has a second rail provided thereon, and is moveable relative to the base and the platform. The test arm is provided on the second rail and above the platform, wherein the test arm is moveable along with the support, and is also movable relative to the support. The rotary table is moveable or rotatable relative to the test arm. The holders are moveable along with the rotary table, and are also moveable or rotatable relative to the rotary table. The probe sets are moveable along with the holders.
    Type: Application
    Filed: December 1, 2014
    Publication date: July 23, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, SHAO-WEI LU, YA-HUNG LO, SHOU-JEN TSAI
  • Publication number: 20150185253
    Abstract: A probe module including a housing, a PCB, three probes, a resonating member, and a signal connector. The housing has a room therein, a first opening, and a second opening at opposite ends thereof. The PCB is received in the room of the housing, and has a substrate, on which a circuit and two groundings are provided. The probes are electrical connected to the circuit and the groundings of the PCB respectively, and then extend out of the housing via the first opening. The resonating member has a chamber, and is attached to the PCB. The signal connector is connected to the PCB, and extends out of the housing via the second opening. The signal connector has a signal transmission portion electrically connected to the circuit of the PCB, and a grounding portion electrically connected to the at least one grounding of the PCB.
    Type: Application
    Filed: December 2, 2014
    Publication date: July 2, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, CHEN-KANG CHIU
  • Publication number: 20150168447
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 18, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, SHIN-LAN KAO
  • Publication number: 20150168531
    Abstract: A substrate has a first side and a second side opposite to the first side. The substrate further has a first calibrating region and a second calibrating region on the first side, on each of which two pads are provided, and the pads on the first calibrating region are or are not electrically connected to each other. A resistance device is provided on the second side of the substrate, wherein the resistance device has a predetermined resistance, and has opposite ends electrically connected to the pads on the second calibrating region.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 18, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, CHEN-KANG CHIU, SHIN-LAN KAO
  • Publication number: 20150168454
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a PCB, a plurality of probes, a positioning member, and a signal connector. The PCB has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the PCB. The positioning member is made of an insulating material, and provided on the probes. The positioning member is above the substrate, and the probes are between the substrate and the positioning member. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the PCB, and the grounding portion is electrically connected to the at least one grounding of the PCB.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 18, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, YOU-HAO CHEN, CHIH-HAO HO
  • Publication number: 20150168453
    Abstract: A probe module, which is provided between a tester and a DUT for transmitting electrical signals therebetween, includes a signal transmitting member, a plurality of probes, a positioning member, and a signal connector. The signal transmitting member has a circuit and two grounding. The probes are electrical connected to the circuit and the groundings of the signal transmitting member. The positioning member is made of an insulating material, and provided on the probes. The signal connector is adapted to be electrically connected to the tester, wherein the signal connector has a signal transmission portion and a grounding portion; the signal transmission portion is electrically connected to the circuit of the signal transmitting member, and the grounding portion is electrically connected to the at least one grounding of the signal transmitting member.
    Type: Application
    Filed: November 25, 2014
    Publication date: June 18, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, HAO WEI, YANG-HUNG CHENG, CHIH-HAO HO
  • Publication number: 20150022227
    Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
    Type: Application
    Filed: October 3, 2014
    Publication date: January 22, 2015
    Inventors: Chun-Chi WANG, Chia-Tai CHANG, Ya-Yun CHENG, Wei-Cheng KU, Chao-Ping HSIEH
  • Publication number: 20150015291
    Abstract: A cantilever probe card, which is provided between a device under test (DUT) and a tester, includes a carrier board, a probe base, two probes, and a transmission device. The carrier board is provided with through holes. The probe base is provided on the carrier board, and the probes are mounted to the probe base. Each probe has a tip to contact a test pad of the DUT. The transmission device is flexible, and has signal circuits. The transmission device passes through the through hole on the carrier board, and the signal circuits connect the probes to the tester respectively.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 15, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, Jun-Liang Lai, Chun-Chung HUANG, Jing-Zhi Hung, Yung Nan Wu, CHIH-HAO HO
  • Publication number: 20150015290
    Abstract: A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 15, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, JUN-LIANG LAI, WEI CHEN, HSIN HSIANG LIU, KUANG CHUNG CHOU, CHAN HUNG HUANG
  • Publication number: 20150014046
    Abstract: A multilayer circuit board includes a plurality of stacked substrates, a plurality of first conductive lands, and a plurality of second conductive lands. A surface at a side of each of the substrates has an exposed portion which is not covered by the neighboring substrate, wherein each of the first conductive lands is respectively provided on each of the exposed portions. Each of the second conductive lands is provided on the exposed portion of the outermost substrate, wherein each of the substrates has a conductor pattern to be electrically connected to one of the first conductive lands and to one of the second conductive lands.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 15, 2015
    Applicant: MPI CORPORATION
    Inventors: Wei-Cheng KU, Jun-Liang LAI, Chun-Chung HUANG, Jing-Zhi HUNG, Yung Nan WU, Chih-Hao HO
  • Publication number: 20150015295
    Abstract: A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second first electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second first electrical lines respectively.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 15, 2015
    Applicant: MPI CORPORATION
    Inventors: WEI-CHENG KU, Jun-Liang Lai, Chun-Chung HUANG, Wei Chen, Hsin-Hsiang Liu, Kuang-Chung Chou
  • Publication number: 20150009288
    Abstract: A synchronization controller for a multi-sensor camera device includes a detection circuit and a control circuit. The detection circuit detects asynchronization between image outputs generated from the multi-sensor camera device, wherein the image outputs correspond to different viewing angles. The control circuit controls an operation of the multi-sensor camera device in response to the asynchronization detected by the detection circuit. In addition, a synchronization method applied to a multi-sensor camera device includes following steps: detecting asynchronization between image outputs generated from the multi-sensor camera device, wherein the image outputs correspond to different viewing angles; and controlling an operation of the multi-sensor camera device in response to the detected asynchronization.
    Type: Application
    Filed: July 3, 2014
    Publication date: January 8, 2015
    Inventors: Tung-Hai Wu, Wei-Cheng Ku, Chung-Hung Tsai, Yuan-Chung Lee
  • Patent number: 8884640
    Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: November 11, 2014
    Assignee: MPI Corporation
    Inventors: Chun-Chi Wang, Chia-Tai Chang, Ya-Yun Cheng, Wei-Cheng Ku, Chao-Ping Hsieh