Patents by Inventor Wei-Cheng Liu

Wei-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230309157
    Abstract: An Internet of Things (IoT) system includes an application server, an identification information server, a gateway, and a terminal electronic device. The identification information server is configured to generate a plurality of pieces of first identification information, and each piece of first identification information is time-sensitive. The gateway is connected to the application server and stores the pieces of first identification information. The gateway is configured to automatically determine a piece of valid identification information from the pieces of first identification information. The terminal electronic device stores the pieces of first identification information and is configured to automatically and successively select a piece of current identification information from the pieces of first identification information to establish a connection with the gateway.
    Type: Application
    Filed: February 17, 2023
    Publication date: September 28, 2023
    Inventors: Fu-Chiung Cheng, Wei-Cheng Liu, Dai-Xin Wang
  • Publication number: 20230238637
    Abstract: A neck-mounted power bank is suitable for being hung on a user's neck to supply power to an electronic device. The neck-mounted power bank includes a body, a battery, and a pair of adjustable assemblies. The battery is disposed in the body. The pair of adjustable assemblies are respectively connected to two ends of the body, and define a wearing space with the body. The pair of adjustable assemblies can be rotated relative to the body so as to adjust the size of the wearing space. Each of the pair of adjustable assemblies includes a rotate arm and an angle arm. The rotate arm is rotatably connected to a corresponding end of the body. The angle arm is connected to the rotate arm and has a contact surface. The contact surface is suitable for contacting the user's neck.
    Type: Application
    Filed: May 17, 2022
    Publication date: July 27, 2023
    Applicant: HTC Corporation
    Inventors: Jia Shan Wu, Wei-Cheng Liu, Chun-Lung Chu
  • Publication number: 20230231256
    Abstract: A neck-mounted power bank includes a neck-mounted portion, a first body and a second body. The first body is connected to an end of the neck-mounted portion. The second body is connected to another end of the neck-mounted portion. The neck-mounted portion, the first body and the second body define a wearing space. The first body includes a first tray and a first controller. The first tray is connected to the neck-mounted portion. The first controller is detachable and electrically connected to the first tray, and has a first controller battery. When the first controller is installed and electrically connected to the first tray, the first controller battery can supply power to an electronic device through the first tray. When the first controller is detached from the first tray, the first controller can control the electronic device wirelessly.
    Type: Application
    Filed: May 5, 2022
    Publication date: July 20, 2023
    Applicant: HTC Corporation
    Inventors: Peng Kuang Chen, Wei-Cheng Liu, Chun-Lung Chu
  • Publication number: 20230160953
    Abstract: An integrated circuit (IC) chip package and a method of fabricating the same are disclosed. The IC chip package includes a device layer on a first surface of a substrate, a first interconnect structure on the device layer, and a second interconnect structure on the second surface of the substrate. The first interconnect structure includes a fault detection line in a first metal line layer and configured to emit an electrical or an optical signal that is indicative of a presence or an absence of a defect in the device layer, a metal-free region on the fault detection line, and a metal line adjacent to the fault detection line in the first metal line layer. The fault detection line is electrically connected to the device layer.
    Type: Application
    Filed: June 3, 2022
    Publication date: May 25, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Han WANG, Yu-Ting LIN, Charlis LIN, Coach LIU, Wei-Cheng LIU
  • Publication number: 20230046911
    Abstract: The present disclosure describes a structure that includes a substrate with first and second sides, a device layer disposed on the first side of the substrate, having a fault detection area on a back-side surface of the device layer configured to emit a signal that is indicative of a presence or an absence of a defect in the device layer, a first interconnect structure disposed on a front-side of the device layer, and a second interconnect structure disposed on the second side of the substrate, having a metal-free region aligned with the fault detection area and a first metal layer having first and second conductive lines disposed substantially parallel to each other. First and second sidewalls of the first and second conductive lines, respectively, facing each other are substantially aligned with first and second sides of the fault detection area.
    Type: Application
    Filed: June 29, 2022
    Publication date: February 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Han WANG, Yu-Ting LIN, Chia Hong LIN, Wei-Cheng LIU
  • Publication number: 20220368522
    Abstract: A Bluetooth central apparatus encrypts a piece of verification data according to a secret-key system to generate a first encrypted verification parameter, and transmits the first encrypted verification parameter to a Bluetooth peripheral apparatus. The Bluetooth peripheral apparatus decrypts the first encrypted verification parameter according to the secret-key system to obtain a piece of decrypted verification data. The Bluetooth peripheral apparatus also encrypts the piece of decrypted verification data according to the secret-key system to generate a second encrypted verification parameter, and transmits the second encrypted verification parameter to the Bluetooth central apparatus.
    Type: Application
    Filed: October 7, 2021
    Publication date: November 17, 2022
    Inventors: FU-CHIUNG CHENG, WEI-CHENG LIU, DAI-XIN WANG
  • Patent number: 11349188
    Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 31, 2022
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Wei-Cheng Liu
  • Publication number: 20220075198
    Abstract: A glasses type display device includes a front end assembly, a pair of legs and a light-shielding mask. Each of the pair of legs includes a front segment and a rear segment. The front segment is coupled to the front end assembly. The rear segment is pivotally connected to the corresponding front segment on an axis. The light-shielding mask includes a frame and a cover. The frame is connected to the front end assembly. The cover has flexibility and is connected to the frame to cover the eyes of the user. The movement range of the rear segment relative to the corresponding front segment partially overlaps with the cover in space.
    Type: Application
    Filed: June 4, 2021
    Publication date: March 10, 2022
    Applicant: HTC Corporation
    Inventors: Ching-Ho Li, Wei-Cheng Liu, Chun-Lung Chu
  • Publication number: 20220075192
    Abstract: A glasses type display device including a front end assembly and a pair of legs is provided. Each of the pair of legs includes a front segment, a rear segment, a torsion mechanism, and a rotation mechanism. The torsion mechanism is disposed between the front end assembly and the front segment. The rotation mechanism is disposed between the front segment and the rear segment.
    Type: Application
    Filed: June 18, 2021
    Publication date: March 10, 2022
    Applicant: HTC Corporation
    Inventors: Tung-Hsin Yeh, Ching-Ho Li, Wei-Cheng Liu, Chun-Lung Chu
  • Patent number: 11194164
    Abstract: A head-mounted display device includes a display portion, a main frame, two arms, and two adjusting pieces. The main frame carries the display portion. The arms are disposed on opposite sides of the main frame, and the end portions of the arms are pivotally connected to the main frame such that the arms are adapted to rotate away from the main frame during an unfolding process and adapted to rotate toward the main frame during a folding process. The adjusting pieces are respectively disposed on pivot paths of the arms, and the adjusting piece is adapted to from a structural interference with the corresponding arm and the main frame during the unfolding process to limit a degree of rotation of the arm.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: December 7, 2021
    Assignee: HTC Corporation
    Inventors: Hsiu-Fan Ho, Chin-Kai Sun, Wei-Cheng Liu
  • Publication number: 20210265718
    Abstract: An electronic device includes a casing, a fan base, a fan side wall and an impeller. The casing has a fan top wall. The fan top wall has an airflow inlet. The fan base is provided in the casing. The fan side wall extends from the casing or the fan base. The fan top wall, the fan base and the fan side wall define a fan space communicated with the airflow inlet and a first airflow outlet communicated with the fan space. The impeller is mounted at the fan base and is located in the fan space.
    Type: Application
    Filed: September 8, 2020
    Publication date: August 26, 2021
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chung-Chiao Tan, Wei-Cheng Liu
  • Publication number: 20200326550
    Abstract: A head-mounted display device includes a display portion, a main frame, two arms, and two adjusting pieces. The main frame carries the display portion. The arms are disposed on opposite sides of the main frame, and the end portions of the arms are pivotally connected to the main frame such that the arms are adapted to rotate away from the main frame during an unfolding process and adapted to rotate toward the main frame during a folding process. The adjusting pieces are respectively disposed on pivot paths of the arms, and the adjusting piece is adapted to from a structural interference with the corresponding arm and the main frame during the unfolding process to limit a degree of rotation of the arm.
    Type: Application
    Filed: October 25, 2019
    Publication date: October 15, 2020
    Applicant: HTC Corporation
    Inventors: Hsiu-Fan Ho, Chin-Kai Sun, Wei-Cheng Liu
  • Patent number: 10805147
    Abstract: A fail recovery method and an Internet of Things (IoT) system and a charging system using the same are provided. The fail recovery method includes following steps: providing a plurality of gateway devices, in which at least one of the gateway devices preset to provide a wireless network service to at least one IoT device and at least another one of the gateway devices preset to provide the wireless network service to at least one user device; mutual confirming an operation state of other one of gateway devices by the gateway devices; and when the one of the gateway devices is determined as failed, using the another one of the gateway devices to replace the failed gateway device, so as to simultaneously provide the wireless network service to the IoT device and the user device by the another one of the gateway devices.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: October 13, 2020
    Assignees: Tatung Company, TATUNG UNIVERSITY
    Inventors: Fu-Chiung Cheng, Wei-Cheng Liu, Tai-Jee Pan
  • Patent number: 10785893
    Abstract: A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 22, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Publication number: 20200170143
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Application
    Filed: May 22, 2019
    Publication date: May 28, 2020
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Patent number: 10667428
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 26, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Publication number: 20200116436
    Abstract: A heat transferring module includes a first conductor plate, a second conductor plate, a working fluid and a reinforcing layer. The second conductor plate is connected to the first conductor plate to form a cavity. The working fluid is located in the cavity. The reinforcing layer is formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure. The capillary structure is located on an inner surface of at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate. In addition, a manufacturing method of a heat transferring module is also provided.
    Type: Application
    Filed: May 30, 2019
    Publication date: April 16, 2020
    Applicant: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu, Tien-Tso Liu, Shuo-Hsiu Chang
  • Patent number: 10282915
    Abstract: A superimposition device of virtual guiding indication and reality image includes at least an image capturing device, a processor, a graphic processing unit (GPU), and a display device. The image capturing device captures reality image including instant scene. The processor receives the reality image and obtains height variation information. The GPU performs image correction processing on the reality image to obtain corrected image, generates updated transformation matrix according to the height variation information, and performs inverse perspective projection transformation by using the updated transformation matrix to generate bird's-eye view image of the corrected image and superimposes virtual guiding indication on the bird's-eye view image and performs perspective projection transformation on the bird's-eye view image to transform the bird's-eye view image into three-dimensional (3D) navigation image which includes the guiding indication.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 7, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jing-Jhih Lin, Wei-Cheng Liu, Yu-Chen Lin, Cheng-Hsien Wang, Peng-Cheng Chen
  • Patent number: 10212840
    Abstract: A chassis structure includes a chassis body and at least one holder module. The at least one holder module includes a frame, a handle, and a guiding assembly. The frame is detachably disposed in the chassis body and has a first linking portion. The handle has a holding portion, a second linking portion, and a third linking portion pivoted to the frame. The guiding assembly is disposed on the chassis body and has a first guiding channel, a second guiding slot, and a third guiding slot. The first guiding channel has a first segment, and the second guiding slot has a second segment and a third segment curvedly connected to each other. The first linking portion, the second linking portion, and the third linking portion are adapted to respectively move along the first segment, the third segment, and the third guiding slot simultaneously such that the frame moves upwards and rotates from a first position to a second position simultaneously.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: February 19, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chang-Ming Kuan, Wei-Cheng Liu
  • Publication number: 20180114336
    Abstract: A positioning method includes the steps of: capturing a positioning image by an image capturing device, determining a pixel coordinate of an object in the positioning image, and determining a global positioning system coordinate of the object according to the pixel coordinates and a transformation matrix. An image capturing device includes a camera configured to capture a positioning image, a storage medium storing with a transformation matrix, and a processor electrically connected to the camera and the storage medium respectively. The processor is configured to determine a pixel coordinate of an object in the positioning image and determine a global positioning system coordinate associated with the object according to the pixel coordinate and the transformation matrix.
    Type: Application
    Filed: December 22, 2016
    Publication date: April 26, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Feng CHANG, Wei-Cheng LIU, Pai-Wei CHENG