Abstract: Some embodiments relate to an IC device, including a first chip; and a second chip bonded to the first chip at a bonding interface; where the first and second chips respectively comprise a first dielectric layer and a second dielectric layer directly contacting; the first chip further comprises a plurality of conductive pads recessed into the first dielectric layer and in a plurality of rows and columns; where the plurality of conductive pads are arranged with a zig-zag layout along the plurality of columns and along the plurality of rows and comprise a first conductive pad and a second conductive pad; the first chip further comprises a first shield line in the first dielectric layer and laterally between the first and second conductive pads, and the second chip further comprises a contact recessed into the second dielectric layer and directly contacting the first conductive pad at the bonding interface.

Abstract: Some embodiments relate to an IC device, including a first chip comprising a plurality of pixel blocks respectively including one of a first plurality of conductive pads, the plurality of pixel blocks arranged in rows extending in a first direction and columns extending in a second direction perpendicular to the first direction; a second chip bonded to the first chip at a bonding interface, where the second chip comprises a second plurality of conductive pad recessed and contacting the first plurality of conductive pads along the bonding interface; and a first corrugated shield line having outermost edges set-back along the second direction from outermost edges of a first row of the plurality of pixel blocks, the first corrugated shield line being arranged within a first dielectric layer and laterally separating neighboring ones of the first plurality of conductive pads within the first row of the plurality of pixel blocks.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a first IC chip bonded to a second IC chip. The first chip IC includes a first bond structure. The first bond structure includes a first plurality of conductive bond pads and a first plurality of shield structures disposed between adjacent conductive bond pads among the first plurality of conductive bond pads. The second IC chip includes a second bond structure. A bonding interface is disposed between the first bond structure and the second bond structure. The second bond structure includes a second plurality of conductive bond pads and a second plurality of shield structures. The first plurality of conductive bond pads contacts the second plurality of conductive bond pads and the first plurality of shield structures contacts the second plurality of shield structures at the bonding interface.

Abstract: A rectangular parallelepiped (RP) cell region includes: a 3D L-shape region, a dummy region and a resident region each of which includes transistor components, transistors of the resident region being free from comprising a function of the L-shape region; the dummy region and the resident region being in first notch formed by an arm and a stem of the L-shape region; first type transistors of the arm being stacked correspondingly over second type transistors of the first part of the stem; dummy transistor(s) of the dummy region being stacked over second type transistors of the second part of the stem; and first type transistors of the resident region being stacked over second type transistors of the third part of the stem.

Abstract: A semiconductor device includes a semiconductor layer. A gate structure is disposed over the semiconductor layer. A spacer is disposed on a sidewall of the gate structure. A height of the spacer is greater than a height of the gate structure. A liner is disposed on the gate structure and on the spacer. The spacer and the liner have different material compositions.

Abstract: Provided is an optical sensor for monitoring pulse waveform and blood pressure of a subject. The optical sensor may be manufactured with compact structure, low profile, low cost, and exhibits benefits of disposability, easy to apply, immunity to electro-magnetic interference, high sensitivity, having minimal affect towards sense of touch, maintains patient safety, and supportive of accurate real-time measurements for the clinician. Therefore, pulse waveform and blood pressures of a subject may be faithfully monitored continuously throughout day and night, so as to provide abundant prognostic information while avoiding interference in normal daily activity of the subject. Also provided is a system utilizing the optical sensors for monitoring pulse waveform and blood pressure of a subject.

Abstract: The present disclosure describes a semiconductor device with a rare earth metal oxide layer and a method for forming the same. The method includes forming fin structures on a substrate and forming superlattice structures on the fin structures, where each of the superlattice structures includes a first-type nanostructured layer and a second-type nanostructured layer. The method further includes forming an isolation layer between the superlattice structures, implanting a rare earth metal into a top portion of the isolation layer to form a rare earth metal oxide layer, and forming a polysilicon structure over the superlattice structures. The method further includes etching portions of the superlattice structures adjacent to the polysilicon structure to form a source/drain (S/D) opening and forming an S/D region in the S/D opening.

Abstract: A Multi-Access Edge Computing (MEC) system is provided. The MEC system includes a user equipment (UE), an MEC device, and a core network. The MEC device includes a relay User Plane Function (UPF) module, a first UPF module, and a second UPF module. The core network performs a UPF path management corresponding to the UE based on a notification of the MEC device. When the UE attaches to a network, the MEC device establishes an idle session between the UE and the relay UPF module. When the MEC device determines that a service for the UE needs to be switched from the first UPF module to the second UPF module and the second UPF module has not been activated, the MEC device notifies the core network to switch the service for the UE from the first UPF module to the relay UPF module first.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A light-emitting device includes a substrate, a light-emitting diode, a first layer, a color filter layer, and a second layer. The light-emitting diode is disposed on the substrate. The first layer is disposed on the substrate and has an opening. At least a portion of the light-emitting diode is disposed in the opening of the first layer. The color filter layer is disposed on the light-emitting diode. The second layer is disposed on the first layer and has an opening overlapped with the opening of the first layer. The second layer is configured to shield light emitted from the light-emitting diode. In the cross-sectional view of the light-emitting device, the minimum width of the opening of the first layer is less than the minimum width of the opening of the second layer.

Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

Abstract: An optical driving mechanism is provided, for driving an optical element, including: a fixed portion, a movable portion, a driving assembly and a position sensing assembly. The movable portion is movably connected to the fixed portion and includes a holder for sustaining the optical element. The driving assembly is configured to drive the movable portion to move relative to the fixed portion. The position sensing assembly is configured to sense a distance of the movable portion relative to the fixed portion, the position sensing assembly includes a sensing magnetic element and a sensor, wherein the sensing magnetic element is disposed on the movable portion and has a rectangular structure. A direction of a long axis of the rectangular structure extends in a direction that is perpendicular to the optical axis of the optical element, and the direction of the long axis is different from the optical axis direction.

Abstract: A method according to the present disclosure includes providing a substrate that includes a dummy gate stack wrapping over an active region, and a spacer layer extending along sidewalls of the dummy gate stack, selectively removing the dummy gate stack to form a gate trench exposing the active region, depositing a gate dielectric over the active region, depositing at least one work function layer over the gate dielectric layer, depositing a tungsten layer over the at least one work function layer, and depositing a tungsten nitride layer over the tungsten layer.

Abstract: A Multi-Access Edge Computing (MEC) system is provided. The MEC system includes a user equipment (UE), an MEC device, and a core network. The MEC device includes a relay User Plane Function (UPF) module, a first UPF module, and a second UPF module. The core network performs a UPF path management corresponding to the UE based on a notification of the MEC device. When the UE attaches to a network, the MEC device establishes an idle session between the UE and the relay UPF module. When the MEC device determines that a service for the UE needs to be switched from the first UPF module to the second UPF module and the second UPF module has not been activated, the MEC device notifies the core network to switch the service for the UE from the first UPF module to the relay UPF module first.

Abstract: A method and a system for switching multi-function modes applied in an electronic device having a plurality of hardware module functions, and includes receiving input information from a user of the electronic device; obtaining status information of the electronic device; and switching the electronic device to one of the multi-function modes according to the input information and the status information, each of the multi-function modes corresponds to at least one of the plurality of hardware module functions.