Abstract: A semiconductor structure and a method of forming the same are provided. In an embodiment, an exemplary semiconductor structure includes a gate structure. The gate structure includes a gate dielectric layer, an n-type work function layer embedded in the gate dielectric layer, a dielectric capping layer embedded in the n-type work function layer, and a p-type work function layer embedded in the dielectric capping layer. A top surface of the gate structure exposes the n-type work function layer, the dielectric capping layer, and the p-type work function layer. The semiconductor structure also includes a first metal cap on the n-type work function layer and a second metal cap on the p-type work function layer. The first metal cap is spaced apart from the second metal cap. without formed on the dielectric capping layer.

Abstract: A driving system for moving several optical elements is provided, including a first module, a second module and a third module. The first, second and third modules respectively have a first, second and third terminal electrically connected an external circuit. The first terminal is on a first side of the first module, the second terminal is on a second side of the second module, and the third terminal is on a third side of the third module. Specifically, the first, second, and third terminals are located on the same side of the driving system.

Abstract: An optical member driving mechanism for driving an optical member having an optical axis is provided, including a fixed portion, a movable portion, a driving assembly, and a circuit board. The fixed portion includes a case and a frame, and a gap is formed therebetween. The movable portion is movably connected to the fixed portion, and configured to hold the optical member. The driving assembly can drive the movable portion to move relative to the fixed portion. The circuit board is disposed in the gap, and has a plate portion and a protruding portion. The protruding portion is disposed between the plate portion and the fixed portion, so as to tightly dispose the circuit board in the gap.

Abstract: A semiconductor device includes a plurality of active region structures that each protrude upwards in a vertical direction. The active region structures each extend in a first horizontal direction. The active region structures are separated from one another in a second horizontal direction different from the first horizontal direction. A gate structure is disposed over the active region structures. The gate structure extends in the second horizontal direction. The gate structure partially wraps around each of the active region structures. A conductive capping layer is disposed over the gate structure. A gate via is disposed over the conductive capping layer. A dimension of the conductive capping layer measured in the second horizontal direction is substantially greater than a maximum dimension of the gate via measured in the second horizontal direction.

Abstract: The present disclosure provides a semiconductor device and a method of forming the same. The semiconductor device includes a first channel members being vertically stacked, a second channel members being vertically stacked, an n-type work function layer wrapping around each of the first channel members, a first p-type work function layer over the n-type work function layer and wrapping around each of the first channel members, a second p-type work function layer wrapping around each of the second channel members, a third p-type work function layer over the second p-type work function layer and wrapping around each of the second channel members, and a gate cap layer over a top surface of the first p-type work function layer and a top surface of the third p-type work function layer such that the gate cap layer electrically couples the first p-type work function layer and the third p-type work function layer.

Abstract: A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, a circuit board, and conductive element. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board. The conductive element forms a longitudinal end portion not parallel to the outer surface of the circuit board, wherein the conductive element is electrically connected to the driving assembly and the conductive portion of the circuit board.

Abstract: Semiconductor devices having improved gate electrode structures and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a gate structure over a semiconductor substrate, the gate structure including a high-k dielectric layer; an n-type work function layer over the high-k dielectric layer; an anti-reaction layer over the n-type work function layer, the anti-reaction layer including a dielectric material; a p-type work function layer over the anti-reaction layer, the p-type work function layer covering top surfaces of the anti-reaction layer; and a conductive cap layer over the p-type work function layer.

Abstract: A power management system includes connection interfaces, a system power supply, and a power management circuit. Each connection interface is connected to one power consumption device. The system power supply includes power supply units (PSUs). The system power supply supplies electricity power to each power consumption device via one connection interface. The power management circuit is connected to each power consumption device via the connection interfaces. The power management circuit obtains a current total load of PSUs, determines a target load of each PSU, and determines whether each connection interface is connected to one power consumption device. The power management circuit turns off power supply to the connection interface that is not connected to the power consumption devices. According to the current total load and the target load, the power management circuit determines an enabled number of the PSUs, thereby turning on or turning off each PSU accordingly.

Abstract: A driving mechanism is provided, including a fixed part, a movable part for holding an optical element, a driving assembly, and a circuit board. The driving assembly is used for driving the movable part to move relative to the fixed part. The circuit board is disposed on the fixed part, having a conductive portion exposed to an outer surface of the circuit board and a trace embedded in the circuit board. The conductive portion and the trace partially overlap when viewed in a horizontal direction perpendicular to the optical axis of the optical element.

Abstract: An optical component driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a circuit assembly. The movable assembly is movable relative to the fixed assembly, the movable assembly is configured to hold an optical component, and the optical component defines an optical axis. The driving assembly is for driving the movable assembly to move relative to the fixed assembly. The circuit assembly is disposed on a first side and a second side of the optical component driving mechanism, and the first side is not parallel to the second side.

Abstract: A power management system includes connection interfaces, a system power supply, and a power management circuit. Each connection interface is connected to one power consumption device. The system power supply includes power supply units (PSUs). The system power supply supplies electricity power to each power consumption device via one connection interface. The power management circuit is connected to each power consumption device via the connection interfaces. The power management circuit obtains a current total load of PSUs, determines a target load of each PSU, and determines whether each connection interface is connected to one power consumption device. The power management circuit turns off power supply to the connection interface that is not connected to the power consumption devices. According to the current total load and the target load, the power management circuit determines an enabled number of the PSUs, thereby turning on or turning off each PSU accordingly.

Abstract: An integrated circuit with antenna in package (AiP IC) testing apparatus is provided, and includes: a carrier board, a test socket, and a receiving antenna circuit board. The test socket is disposed on the carrier board and configured to carry an AiP IC which emits a wireless signal. The receiving antenna circuit board is adjacent to the test socket and configured to receive the wireless signal. The receiving antenna circuit board and the reflector are integrated into the AiP IC testing apparatus, so that the AiP IC testing apparatus can be used not only for testing a feedback signal transmitted by a test pin of the IC, but also for testing the wireless signal from the IC.