Abstract: A monitoring system has a vehicle and a monitoring device. The vehicle is movable along a predetermined route, and the monitoring device is mounted to the vehicle. The monitoring device has a sensor configured to monitor an environmental parameter and a controller communicatively coupled to the sensor. The controller is configured to record the monitored environmental parameter along the predetermined route as data points associated with time tags, record position information, and associate the position information with corresponding time tags. The number of time tags associated with the position information is less than the number of time tags associated with the monitored environmental parameter. A server is configured to receive and display a visualized presentation of the recorded monitored environmental parameter and the recorded position information.

Abstract: Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate, a gate over the substrate and a gate dielectric layer between the gate and the substrate. The gate dielectric layer includes an oxide-inhibiting layer having a dielectric constant greater than about 8 and being in an amorphous state.

Abstract: At least a first reticle is stored in a housing of a stocker. A first gas is delivered to the housing. At least one reticle pod having an additional reticle is delivered into a enclosure within the housing of the stocker. A second gas different from the first gas is delivered to the enclosure. The reticle pod is automatically retrieved from the enclosure. The delivery and retrieval of the reticle pod and delivery of the first gas and the second gas are automatically controlled.

Abstract: Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate, a gate over the substrate and a gate dielectric layer between the gate and the substrate. The gate dielectric layer includes an oxide-inhibiting layer having a dielectric constant greater than about 8 and being in an amorphous state.

Abstract: A method comprises transferring a wafer carrier to or from an overhead hoist transfer (OHT) system using a conveyor. The method also comprises transferring the wafer carrier between the conveyor and an overhead shuttle (OHS) system using a cross-system transport apparatus. The method further comprises generating control signals using a controller to control at least one of the cross-system transport apparatus, the conveyor, or the loading or unloading of the wafer carrier at the OHT or the OHS. The cross-system transport apparatus comprises a lifting device configured to raise or lower the wafer carrier. The transferring of the wafer carrier between the conveyor and the OHS system comprises one or more of lifting or lowering the wafer carrier.

Abstract: A method is provided. The method includes: assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment; and assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.

Abstract: A method for transporting a group of semiconductor wafers and a manufacturing system are provided. A semiconductor processing facility is provided. The semiconductor processing facility includes a first destination, a second destination, and a transport system configured to transport a group of semiconductor wafers from the first destination to the second destination. Real time information is collected, where the real time information includes information on a current process executing in the semiconductor processing facility and information on a transfer time. The information on the transfer time includes data that indicates an amount of time required to transport the group of semiconductor wafers from the first destination to the second destination. A request is issued to the transport system to effect the transportation of the group of semiconductor wafers from the first destination to the second destination. A timing of the request is based on the first and second data.

Abstract: A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality of storage spaces. The output-relay shelf has a plurality of first output-relay spaces. The output shelf has an output space. The controller is configured to drive the first crane to preferentially transfer a first wafer carrier stored in one of the storage spaces to an empty one of the first output-relay spaces according to a delivery command defining a high priority of the first wafer carrier, and configured to drive the second crane to preferentially transfer the first wafer carrier from the first output-relay space storing the first wafer carrier to the output space according to the delivery command if the output space is empty.

Abstract: A loss-phase lack-voltage detection circuit for three-phase input power includes a half-wave rectifier circuit, a bleeder circuit, an optical coupler circuit and a digital signal processor sequentially connected with each other. The half-wave rectifier circuit serves to rectify the input power. The bleeder circuit has multiple bleeder resistors for stepping down the voltage. The optical coupler circuit serves to generate judgment signal in form of pulse wave. The digital signal processor serves to calculate the duration for which the pulse wave stays at the peak value to judge the loss-phase state of the input power.

Abstract: A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality of storage spaces. The output-relay shelf has a plurality of first output-relay spaces. The output shelf has an output space. The controller is configured to drive the first crane to preferentially transfer a first wafer carrier stored in one of the storage spaces to an empty one of the first output-relay spaces according to a delivery command defining a high priority of the first wafer carrier, and configured to drive the second crane to preferentially transfer the first wafer carrier from the first output-relay space storing the first wafer carrier to the output space according to the delivery command if the output space is empty.

Abstract: A multifunctional load test device includes a drive, a motor to be tested, a load motor and an inverter. The drive is electrically connected to civil power. The motor to be tested is electrically connected to the drive and powered by the drive and controllably drivable by the drive. The load motor is drivable by the motor to be tested to produce counter electromotive force. The inverter is electrically connected to the load motor to rectify the counter electromotive force into power identical to civil power.

Abstract: A rotation mechanism includes a first rotary member defining an axis, a second rotary member, a track disc, a first rod and a second rod. The first rotary member, the second rotary member and the track disc are assembled coaxially, and the first rotary member and the second rotary member rotate relative to the track disc. The track disc has a first groove, a second groove, a third groove and a center passed by the axis. The first and the second grooves are sited at the same circumference, and an extension direction of the third groove passes through the center. The first rod has a first end slidably disposed in the first groove, and a second end. The second rod has a third end pivoted to the second end and slidably disposed in the third groove, and a fourth end slidably disposed in the second groove.

Abstract: A portable electronic device assembly includes a portable electronic device and a peripheral device. The portable electronic device includes a first electronic connection element and a first magnetic element. The peripheral device includes a second electronic connection element and a second magnetic element. When the portable electronic device is placed on the peripheral device, the magnetic force between the second magnetic element and the first magnetic element moves the second electronic connection element such that the first electronic connection element and the second electronic connection element are electrically connected.

Abstract: A rotation mechanism includes a first rotary member defining an axis, a second rotary member, a track disc, a first rod and a second rod. The first rotary member, the second rotary member and the track disc are assembled coaxially, and the first rotary member and the second rotary member rotate relative to the track disc. The track disc has a first groove, a second groove, a third groove and a center passed by the axis. The first and the second grooves are sited at the same circumference, and an extension direction of the third groove passes through the center. The first rod has a first end slidably disposed in the first groove, and a second end. The second rod has a third end pivoted to the second end and slidably disposed in the third groove, and a fourth end slidably disposed in the second groove.

Abstract: A portable electronic device assembly includes a portable electronic device and a peripheral device. The portable electronic device includes a first electronic connection element and a first magnetic element. The peripheral device includes a second electronic connection element and a second magnetic element. When the portable electronic device is placed on the peripheral device, the magnetic force between the second magnetic element and the first magnetic element moves the second electronic connection element such that the first electronic connection element and the second electronic connection element are electrically connected.

Abstract: A method for transporting a group of semiconductor wafers and a manufacturing system are provided. A semiconductor processing facility is provided. The semiconductor processing facility includes a first destination, a second destination, and a transport system configured to transport a group of semiconductor wafers from the first destination to the second destination. Real time information is collected, where the real time information includes information on a current process executing in the semiconductor processing facility and information on a transfer time. The information on the transfer time includes data that indicates an amount of time required to transport the group of semiconductor wafers from the first destination to the second destination. A request is issued to the transport system to effect the transportation of the group of semiconductor wafers from the first destination to the second destination. A timing of the request is based on the first and second data.

Abstract: A method is provided. The method includes: assigning a buffer to a first wafer lot comprising a plurality of wafers according to a first trigger event associated with an equipment; and assigning a transporter to a second wafer lot comprising a plurality of wafers according to a second trigger event associated with the equipment.

Abstract: A method comprises transferring a wafer carrier to or from an overhead hoist transfer (OHT) system using a conveyor. The method also comprises transferring the wafer carrier between the conveyor and an overhead shuttle (OHS) system using a cross-system transport apparatus. The method further comprises generating control signals using a controller to control at least one of the cross-system transport apparatus, the conveyor, or the loading or unloading of the wafer carrier at the OHT or the OHS. The cross-system transport apparatus comprises a lifting device configured to raise or lower the wafer carrier. The transferring of the wafer carrier between the conveyor and the OHS system comprises one or more of lifting or lowering the wafer carrier.

Abstract: A portable electronic device assembly includes a portable electronic device and a peripheral device. The portable electronic device includes a first electronic connection element and a first magnetic element. The peripheral device includes a second electronic connection element and a second magnetic element. When the portable electronic device is placed on the peripheral device, the magnetic force between the second magnetic element and the first magnetic element moves the second electronic connection element such that the first electronic connection element and the second electronic connection element are electrically connected.

Abstract: A battery module comprises a case, an extension/retraction positioning module, a press element, a battery body and a cap. The extension/retraction positioning module is disposed in the case to enable an extension/retraction operation along a first axis; the press element is connected with the extension/retraction positioning module to drive the extension/retraction positioning module to enable the extension/retraction operation when the press element is pushed; the battery body is disposed in the case to move relative to the case to an initial position or a power supply position by the extension/retraction operation, the battery body comprises a power connecting portion; the cap combines with the case and the portable electronic device in a rotational manner. The battery body moves to the initial position or the power supply position by the extension/retraction operation to determine whether the power connecting portion is electrically connected with the portable electronic device.