Abstract: A chip package structure includes a carrier and a chip group. The chip group includes a pair of first chips that are identical IC chips. The pair of first chips are disposed on the carrier in opposite directions and parallel to each other, and electrically connected with the carrier.

Abstract: A fastening module for fastening a data storage device is provided. The data storage device includes first and second positioning apertures. A frame of the fastening module includes a retaining hole, and first and second positioning holes. The data storage device is slidably received in the frame. A securing member of the fastening module includes a main body, a pivot member, and a pin. The main body includes a pivot hole pivotally connected by the pivot member. A securing piece of the pivot member passes through the retaining hole and rotates relative to the main body to fasten the securing member to the frame. When the securing piece passes through the retaining hole, the pin passes through either the first or second positioning hole and inserts into either the first or second positioning aperture to fasten the data storage device at different positions.

Abstract: A fastening module for fastening a data storage device is provided. A fastening trough is formed at a lower surface of the data storage device. The fastening module includes a frame bracket, a fastening member, and a buckling member. The frame bracket is used for carrying the data storage device. The frame bracket includes a lower frame and two side frames. The side frames are connected to two sides of the lower frame. The lower frame includes a clamping hole. The fastening member is disposed at the clamping hole and inserted into a fastening trough, so as to prevent the data storage device from moving. The buckling member is movably disposed at the side frames to buckle an upper surface of the data storage device.

Abstract: A power control device for an electronic device includes a power switching unit for switching to output a dc power source to a load of the electronic device according to a power switching signal, a switching detection unit for responding a power switching status to generate a switching detection signal, a status latch module for generating the power switching signal according to the switching detection signal, a first status signal and a second status signal, and a logic unit for generating the first status signal and the second status signal for the status latch module according to the power switching signal, such that the status latch module latches the first status signal and the second status signal.

Abstract: An embodiment of the invention discloses an display module for mobile communication device which comprises a display panel, a flexible printed circuit board, an electronic component. The flexible printed circuit board is coupled to the display panel and is divided into a first portion and a second portion. The electronic component is disposed on a first surface of the flexible printed circuit board, and the location of the electronic component corresponds to that of the second portion of the flexible printed circuit board. The extensibility of the second portion of the flexible printed circuit board is smaller than that of the first portion of the flexible printed circuit board.

Abstract: An integrated circuit (IC) package includes an IC chip, a package carrier, and a plurality of conductive bumps connecting the IC chip to the package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The active surface has a core area and a signal area surrounding the core area. The IC layered structure includes a first physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The first inner pads are arranged in multiple rows in the signal area.

Abstract: An integrated circuit (IC) package includes an IC chip and a package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The IC layered structure includes a first physical layer interface and a second physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The second physical layer interface includes a plurality of second bump pads and a plurality of second inner pads electrically connected to the second bump pads, respectively. The second bump pads are mirror images of the first bump pads with respect to a first geometric plane perpendicular to the active surface. The second inner pads are mirror images of the first inner pads with respect to the first geometric plane.

Abstract: An all-in-one desktop computer includes a display module, a holding body, a main assembly, and a back cover. The holding body is disposed on one side of the display module. The main assembly is disposed at the holding body. The back cover and the holding body are disposed on the same side of the display module, and the back cover covers the holding body and the main assembly. According to the all-in-one desktop computer, the main assembly is disposed at the holding body to position and fix the main assembly and to strengthen structure stability of the all-in-one desktop computer.

Abstract: The present invention provides a feedback-adjustable charging system applicable to a rechargeable electronic device and a method thereof. The feedback-adjustable charging system comprises a converter module, an adjustable voltage module and maybe a connective module. The converter module is coupled to an AC power supply and is used for converting AC power from the AC power supply into DC power. The adjustable voltage module is coupled to the converter module for receiving the DC power and producing a voltage used for charging. The connective module is coupled to the electronic device and the adjustable voltage module for receiving and transmitting the charging voltage to the electronic device and for producing a feedback parameter to the adjustable voltage module. In the charging system, the adjustable voltage module is used to adjust a value of the charging voltage according to the feedback parameter.

Abstract: An all-in-one desktop computer includes a casing, a display module, a motherboard, a storage device, and a heat dissipating device. The display module is contained in the casing. The display module has a display panel exposed to the casing. The storage device is located at a center-of-gravity position of the all-in-one desktop computer. The motherboard, the storage device, and the heat dissipating device are contained in the casing and are disposed at the back of the display module without overlap. Therefore, the all-in-one desktop computer has smaller volume and a better heat dissipation effect via special disposition of the motherboard, the storage device, and the heat dissipating device.

Abstract: An embodiment of the invention discloses an display module for mobile communication device which comprises a display panel, a flexible printed circuit board, an electronic component. The flexible printed circuit board is coupled to the display panel and is divided into a first portion and a second portion. The electronic component is disposed on a first surface of the flexible printed circuit board, and the location of the electronic component corresponds to that of the second portion of the flexible printed circuit board. The extensibility of the second portion of the flexible printed circuit board is smaller than that of the first portion of the flexible printed circuit board.

Abstract: A light emitting diode structure including a substrate, a strain-reducing seed layer, an epitaxial layer, a first electrode and a second electrode is provided. The strain-reducing seed layer having a plurality of clusters is disposed on the substrate, and the material of the clusters is selected from a group consisting of aluminum nitride, magnesium nitride and indium nitride. The epitaxial layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. The first electrode is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The second electrode is disposed on the second type doped semiconductor layer and electrically connected thereto.

Abstract: A data processing system and method integrated with positioning technology are provided. A plurality of mobile devices perform data processing on positioning signals received from a positioning device. The mobile devices together form at least a communication group. One of the mobile devices receives coordinate information from the other one or more of the plurality of mobile devices of the at least a communication group via a wireless signal transceiver module. A data computation module performs computation on the coordinate information to obtain group information, and transmits the group information via the wireless signal transceiver module such that all of the plurality of mobile devices of the at least a communication group are allowed to obtain the group information. Known problems, that is, conventional mobile devices fail to receive coordinate information from one another and thereby fail to interact with one another, are solved by the system and method.

Abstract: A light emitting diode structure including a substrate, a strain-reducing seed layer, an epitaxial layer, a first electrode and a second electrode is provided. The strain-reducing seed layer having a plurality of clusters is disposed on the substrate, and the material of the clusters is selected from a group consisting of aluminum nitride, magnesium nitride and indium nitride. The epitaxial layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. The first electrode is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The second electrode is disposed on the second type doped semiconductor layer and electrically connected thereto.

Abstract: A photodetector is described. The photodetector is comprised of a substrate, a first n-type III-V compound semiconductor layer located on the substrate, an n++-type III-V compound semiconductor layer located on a first portion of the first n-type III-V compound semiconductor layer with a second portion of the first n-type III-V compound semiconductor layer exposed, a p-type III-V compound semiconductor layer located on the n++-type compound semiconductor layer, an undoped III-V compound semiconductor layer located on the p-type III-V compound semiconductor layer, a second n-type III-V compound semiconductor layer located on the undoped III-V compound semiconductor layer, a conductive transparent oxide layer located on the second n-type III-V compound semiconductor layer, a first electrode located on a portion of the conductive transparent oxide layer, and a second electrode located on a portion of the second portion of the first n-type III-V compound semiconductor layer.

Abstract: An organic light-emitting display is provided. The organic light-emitting display has a power line divided into multiple sets with a voltage terminal attached to the center of each power line set. Furthermore, all the voltage terminals are coupled to a power supply through a low resistance conductive material medium. With this setup, brightness imbalance between neighboring pixels is minimized.

Abstract: A method for manufacturing a high efficiency light-emitting diode (LED) is disclosed. In the method, a substrate is provided, in which an N-type buffer layer, an N-type cladding layer and an active layer are stacked on the substrate in sequence. A first P-type cladding layer is formed on the active layer. Next, a growth-interruption step is performed, and a catalyst is introduced to form a plurality of nuclei sites on a surface of the first P-type cladding layer. A second P-type cladding layer is formed on the first P-type cladding layer according to the nuclei sites, so that the second P-type cladding layer has a surface with a plurality of mesa hillocks. Then, a contact layer is formed on the second P-type cladding layer. Subsequently, a transparent electrode is formed on the contact layer.

Abstract: A photodetector is described. The photodetector is comprised of a substrate, a first n-type III-V compound semiconductor layer located on the substrate, an n++-type III-V compound semiconductor layer located on a first portion of the first n-type III-V compound semiconductor layer with a second portion of the first n-type III-V compound semiconductor layer exposed, a p-type III-V compound semiconductor layer located on the n++-type compound semiconductor layer, an undoped III-V compound semiconductor layer located on the p-type III-V compound semiconductor layer, a second n-type III-V compound semiconductor layer located on the undoped III-V compound semiconductor layer, a conductive transparent oxide layer located on the second n-type III-V compound semiconductor layer, a first electrode located on a portion of the conductive transparent oxide layer, and a second electrode located on a portion of the second portion of the first n-type III-V compound semiconductor layer.

Abstract: A method for manufacturing a high efficiency light-emitting diode (LED) is disclosed. In the method, a substrate is provided, in which an N-type buffer layer, an N-type cladding layer and an active layer are stacked on the substrate in sequence. A first P-type cladding layer is formed on the active layer. Next, a growth-interruption step is performed, and a catalyst is introduced to form a plurality of nuclei sites on a surface of the first P-type cladding layer. A second P-type cladding layer is formed on the first P-type cladding layer according to the nuclei sites, so that the second P-type cladding layer has a surface with a plurality of mesa hillocks. Then, a contact layer is formed on the second P-type cladding layer. Subsequently, a transparent electrode is formed on the contact layer.

Abstract: A scissors assembly includes a main body, a jaw plate, and an angle adjusting base. Thus, the scissors assembly has a simplified construction and can be positioned efficiently. In addition, the scissors assembly can adjust the cutting angle easily and conveniently. Further, the scissors assembly is operated easily and conveniently.