Patents by Inventor Wei Chu

Wei Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200368910
    Abstract: A collaborative-robot control system is provided in the invention. The collaborative-robot control system includes a plurality of test machines, a plurality of collaborative robots, a first control system and a second control system. The plurality of test machines are configured in a plurality of paths. When the second control system assigns a first collaborative robot of the plurality of collaborative robots in a waiting area to a first test machine in a first path of the plurality of paths and the first collaborative robot is being blocked by a second collaborative robot of the plurality of collaborative robots in the first path, the second control system generates a push-forward command and transmits the push-forward command to the first control system. The first control system sends the push-forward command to the second collaborative robot to order the second collaborative robot to leave the first path first.
    Type: Application
    Filed: May 20, 2020
    Publication date: November 26, 2020
    Applicant: Winbond Electronics Corp.
    Inventors: Te-Wei CHU, Chen-Meng CHENG, Chun-Ming HUANG, Kuang-Tai CHEN, Yu-Jen CHANG, Tsung-Hsien WU
  • Patent number: 10835135
    Abstract: A non-contact heartbeat rate measurement system includes an image sensor, a target region selecting module, a heartbeat signal calculating module, a spectrum analyzing module, a vibration detecting module, a heartbeat peak selecting module. When a signal quality indicator is greater than a threshold value, and a first peak with global highest signal intensity in a heartbeat spectrum is similar to a face vibration frequency, the heartbeat peak selecting module selects a second peak with local highest signal intensity from a part frequency band of the heartbeat spectrum as an output heartbeat frequency. A non-contact heartbeat rate measurement method and an apparatus are disclosed herein.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: November 17, 2020
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Bing-Fei Wu, Meng-Liang Chung, Tsong-Yang Tsou, Yun-Wei Chu, Kuan-Hung Chen, Po-Wei Huang, Yin-Yin Yang
  • Patent number: 10835603
    Abstract: A method for normalizing blood vessels of lesions is disclosed, which includes administering an effective amount of oxygen-loaded microbubbles to a subject in need by intravenous injection, and projecting ultrasound from a ultrasonic emission device into the lesions for rupturing the oxygen-loaded microbubbles and releasing the oxygen to the lesions. Each of the oxygen-loaded microbubbles comprises oxygen and a water insoluble gas, and the particle size of microbubbles is 0.5˜20 ?m.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 17, 2020
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chih-Kuang Yeh, Yi-Ju Ho, Shu-Wei Chu
  • Publication number: 20200357691
    Abstract: A method for manufacturing a semiconductor structure includes following operations. A sacrificial layer is formed over the conductive layer, wherein the sacrificial layer includes a first sacrificial portion over the first conductive portion, and a second sacrificial portion over the second conductive portion, and a first thickness of the first sacrificial portion is larger than a second thickness of the second sacrificial portion. The first sacrificial portion and the second sacrificial portion of the sacrificial layer, and the second conductive portion of the conductive layer are removed.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Inventors: YU-HSIANG LIAO, YA-HUEI LI, LI-WEI CHU, CHUN-WEN NIEH, HUNG-YI HUANG, CHIH-WEI CHANG, CHING-HWANQ SU
  • Publication number: 20200348339
    Abstract: Disclosed are a supplementary bushing, a test probe, and a supplementary testing device. The supplementary bushing has a closed end, an open end, a receiving groove, and at least one first fixing portion. The closed end has a first contact, and the receiving groove is concavely formed from an open end towards the closed end. The first fixing portion is disposed on an inner surface of the receiving groove. The test probe is installed in the receiving hole of a base of the supplementary testing device and has a testing end and a connecting end. The testing end has a second contact, a second fixing portion and a stop portion.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 5, 2020
    Inventors: MING-DAO WU, SHIH-HUNG LO, HAO-WEN CHIEN, FU-CHENG CHUANG, WEI-CHU CHEN, KUO-WEI CHANG, BOR-CHEN TSAI, CHIH-FENG CHEN
  • Patent number: 10818308
    Abstract: Systems, devices, media, and methods are presented for converting sounds in an audio stream. The systems and methods receive an audio conversion request initiating conversion of one or more sound characteristics of an audio stream from a first state to a second state. The systems and methods access an audio conversion model associated with an audio signature for the second state. The audio stream is converted based on the audio conversion model and an audio construct is compiled from the converted audio stream and a base audio segment. The compiled audio construct is presented at a client device.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 27, 2020
    Assignee: Snap Inc.
    Inventor: Wei Chu
  • Patent number: 10788900
    Abstract: Symbol prediction can be implemented using a multi-task system trained for different tasks. The tasks may include a single symbol prediction, symbol category prediction, and symbol subcategory prediction. Categories of symbols can be generated by clustering sets of training data using a clustering scheme.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: September 29, 2020
    Assignee: Snap Inc.
    Inventors: William Brendel, Francesco Barbieri, Xin Chen, Wei Chu, Venkata Satya Pradeep Karuturi, Luis Carlos Dos Santos Marujo, Leonardo Ribas Machado das Neves
  • Patent number: 10783643
    Abstract: A computer-implemented method includes: obtaining a sample picture and corresponding mark data, in which the mark data includes a first damage mark outline, and in which the first damage mark outline frames a damaged object in the sample picture; determining a segmentation type for a plurality of pixels in the sample picture based on the first damage mark outline, to generate segmentation mark data; inputting the sample picture to a weak segmentation damage detection model, in which the weak segmentation damage detection model includes an outline prediction branch and a segmentation prediction branch, in which the outline prediction branch outputs outline prediction data including a damage prediction outline, the damage prediction outline framing a predicted damaged object in the sample picture, and in which the segmentation prediction branch includes segmentation prediction data including a predicted segmentation type of each pixel of the plurality of pixels.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: September 22, 2020
    Assignee: Alibaba Group Holding Limited
    Inventors: Wei Zhang, Wei Chu
  • Publication number: 20200294864
    Abstract: A semiconductor device and a method of making the same are provided. A method according to the present disclosure includes forming a first type epitaxial layer over a second type source/drain feature of a second type transistor, forming a second type epitaxial layer over a first type source/drain feature of a first type transistor, selectively depositing a first metal over the first type epitaxial layer to form a first metal layer while the first metal is substantially not deposited over the second type epitaxial layer over the first type source/drain feature, and depositing a second metal over the first metal layer and the second type epitaxial layer to form a second metal layer.
    Type: Application
    Filed: March 15, 2019
    Publication date: September 17, 2020
    Inventors: Peng-Wei Chu, Sung-Li Wang, Yasutoshi Okuno
  • Patent number: 10773294
    Abstract: A clamping mechanism is provided to clamp a die set on a carrier of a machine. The clamping mechanism utilizes a first pushing block to push a locating shaft of the die set to allow a top surface of the locating shaft to contact a mounting surface of the carrier and utilizes a second pushing block to push the locating shaft to allow a first contacting surface of the locating shaft to contact a reference surface of a cage base such that the die set will not clamp on the carrier of the machine with shift or skew errors.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: September 15, 2020
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Hsin-Wei Chu, Pin-Jyun Chen, Ching-Hua Hsieh, Hui-Chi Chang, Po-Fu Hsu, Chien-Fa Huang
  • Patent number: 10777546
    Abstract: An electrostatic discharge (ESD) protection device having a source region coupled to a first electrical node, a first drain region coupled to a second electrical node different from the first electrical node, and an extended drain region between the source region and the first drain region. The extended drain region includes a number N of electrically floating doped regions and a number M of gate regions coupled to the second electrical node, where N and M are integers greater than 1 and N is equal to M. Each electrically floating doped region of the N number of floating doped regions alternates with each gate region of the M number of gate regions.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: September 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Lin Peng, Han-Jen Yang, Jam-Wem Lee, Li-Wei Chu
  • Publication number: 20200279814
    Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an intermediate layer and at least one through via. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The through via extends through the upper conductive structure, the intermediate layer and the lower conductive structure.
    Type: Application
    Filed: February 28, 2019
    Publication date: September 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen Hung HUANG, Meng-Kai SHIH, Wei-Hong LAI, Wei Chu SUN
  • Publication number: 20200261507
    Abstract: The present invention relates to a method for avoidance of blue light damage by using a stem cell composition. The stem cell composition comprises 10% (v/v) to 50% (v/v) of the conditioned medium of Wharton's Jelly mesenchymal stem cells. The conditioned medium of Wharton's Jelly mesenchymal stem cells is prepared by culturing Wharton's Jelly mesenchymal stem cells in a medium containing human basic fibroblast growth factors for 2 to 5 days, and collecting the medium for centrifugation and filtration.
    Type: Application
    Filed: February 20, 2019
    Publication date: August 20, 2020
    Inventors: PEI-CHUAN CHUANG, YU-WEI CHU, I-FU CHEN
  • Publication number: 20200258878
    Abstract: The present disclosure describes exemplary configurations and arrangements for various intelligent diodes. The intelligent diodes of the present disclosure can be implemented as part of electrostatic discharge protection circuitry to protect other electronic circuitry from the flow of electricity caused by electrostatic discharge events. The electrostatic discharge protection circuitry dissipates one or more unwanted transient signals which result from the electrostatic discharge event. In some situations, some carrier electrons and/or carrier holes can flow from intelligent diodes of the present disclosure into a semiconductor substrate. The exemplary configurations and arrangements described herein include various regions designed collect these carrier electrons and/or carrier holes to reduce the likelihood these carrier electrons and/or carrier holes cause latch-up of the other electronic circuitry.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Feng CHANG, Jam-Wem LEE, Li-Wei CHU, Po-Lin PENG
  • Publication number: 20200246943
    Abstract: A socket structure with only a single positioning member includes: a sleeve body, a fitting member, a drive shaft, a first spring, a second spring and the positioning member. since the annular shoulder of the fitting member is abutted against by the annular protrusion of the drive shaft, the drive shaft can be prevented from detaching from the fitting member when pushed by the second spring. Besides, the single positioning member is provided for abutting against the positioning annular flange of the fitting member to prevent the fitting member from detaching from the sleeve body when pushed by the first spring. Therefore, the assembly of the socket structure can be completed by arrange one component (namely the positioning member) between the sleeve body, the fitting member, the drive shaft, the first spring, and the second spring, which reduces assembly and parts costs.
    Type: Application
    Filed: April 10, 2020
    Publication date: August 6, 2020
    Inventor: Ting-Wei CHU
  • Patent number: 10727117
    Abstract: A method for manufacturing a semiconductor structure includes following operations. A sacrificial layer is formed over the conductive layer, wherein the sacrificial layer includes a first sacrificial portion over the first conductive portion, and a second sacrificial portion over the second conductive portion, and a first thickness of the first sacrificial portion is larger than a second thickness of the second sacrificial portion. The first sacrificial portion and the second sacrificial portion of the sacrificial layer, and the second conductive portion of the conductive layer are removed, with at least a portion of the first conductive portion remaining over the bottom of the trench.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: July 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Hsiang Liao, Ya-Huei Li, Li-Wei Chu, Chun-Wen Nieh, Hung-Yi Huang, Chih-Wei Chang, Ching-Hwanq Su
  • Publication number: 20200212350
    Abstract: A display device includes a substrate, an auxiliary electrode, a buffer layer, a plurality of active elements, and a plurality of light-emitting elements. The auxiliary electrode is disposed on the substrate and overlapped with an active region. The buffer layer is disposed on the auxiliary electrode. The plurality of active elements are disposed on the buffer layer and disposed in the active region. The plurality of light-emitting elements are electrically connected with the active elements, respectively. Each of the light-emitting elements includes a first electrode, a second electrode, and a light-emitting layer disposed between the first electrode and the second electrode. Each of the second electrodes is electrically connected with the auxiliary electrode.
    Type: Application
    Filed: November 14, 2019
    Publication date: July 2, 2020
    Applicant: Au Optronics Corporation
    Inventors: Wei-Chu Hsu, Ko-Ruey Jen
  • Publication number: 20200188984
    Abstract: A clamping mechanism is provided to clamp a die set on a carrier of a machine. The clamping mechanism utilizes a first pushing block to push a locating shaft of the die set to allow a top surface of the locating shaft to contact a mounting surface of the carrier and utilizes a second pushing block to push the locating shaft to allow a first contacting surface of the locating shaft to contact a reference surface of a cage base such that the die set will not clamp on the carrier of the machine with shift or skew errors.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 18, 2020
    Inventors: Hsin-Wei Chu, Pin-Jyun Chen, Ching-Hua Hsieh, Hui-Chi Chang, Po-Fu Hsu, Chien-Fa Huang
  • Publication number: 20200160580
    Abstract: The present invention relates to a joint automatic audio visual driven facial animation system that in some example embodiments includes a full scale state of the art Large Vocabulary Continuous Speech Recognition (LVCSR) with a strong language model for speech recognition and obtained phoneme alignment from the word lattice.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 21, 2020
    Inventors: Chen Cao, Xin Chen, Wei Chu, Zehao Xue
  • Patent number: 10657853
    Abstract: A method of manufacturing an identifiable element, includes: providing or receiving a display layer, which includes an bistable layer, an electrode layer, an conductive transparent layer, and a light-trigger electric change layer, in which the electrode layer and the conductive transparent layer are disposed at opposite sides of the electrophoretic layer, and the light-trigger electric change layer is disposed between the electrophoretic layer and the conductive transparent layer; applying a voltage bias across the electrode layer and the conductive transparent layer; and providing a light illuminating a portion of the light-trigger electric change layer through the conductive transparent layer to change a display status of a region of the bistable layer corresponding to the illuminated portion, whereby forming a display pattern in the display layer. An identifiable element is provided herein as well.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: May 19, 2020
    Assignee: E Ink Holdings Inc.
    Inventors: Ian French, Chun-Wei Chu