Patents by Inventor Wei-Ding Wu

Wei-Ding Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor isolation structure with air gaps in deep trenches
    Patent number: 9269609
    Abstract: A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: February 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hong-Seng Shue, Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu
  • Semiconductor Isolation Structure with Air Gaps in Deep Trenches
    Publication number: 20130320459
    Abstract: A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hong-Seng Shue, Tai-I Yang, Wei-Ding Wu, Ming-Tai Chung, Shao-Chi Yu