Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.

Abstract: A hinge structure includes two hinge arms, two shaft gears, at least one first elastic piece, and at least one second elastic piece. Each hinge arm includes a central shaft. Each of the two shaft gears is connected to the central shaft, each shaft gear includes an extending portion, the groove is defined on the extending portion. Each first elastic piece includes two elastic arms, a first connecting portion, and two protrusions. The elastic arms are disposed on opposite sides of the first connecting portion, the elastic arms and the first connecting portion cooperatively form a first opening, the extending portion passes through the first opening, each protrusion is disposed on each elastic arm. Each second elastic piece is sleeved on the extending portion. The protrusions are configured to be accommodated in the groove. A terminal device is provided according to the present disclosure.

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Abstract: A hinge structure is configured to be disposed between a first body and a second body. The hinge structure includes a first shaft assembly, at least two guiding members, a second shaft assembly, and two supporting plates. Each guiding member includes a first end and a second end, the first end is bent to form a sliding groove. The second shaft assembly is disposed in the sliding groove. The two supporting plates are connected to the first body and the second body, respectively, one end of each supporting plate is sleeved on the first shaft assembly, and another end of each supporting plate is fixed to the second end of, when the first body and the second body are closed to or opened with each other, the second shaft assembly is displaced relative to the guiding member. An electronic device is provided according to the present disclosure.

Abstract: Disclosed are a display module and a television, the display module including: a back plate including a back plate body and a side wall which are integrally formed, the back plate body and the side wall together defining a mounting space, a free end of the side wall being folded so as to form a connecting flange which extends towards the back plate body, a free end of the connecting flange being folded so as to form a joining flange which extends in parallel with the back plate body; a display screen, an edge of an inside surface of the display screen being fixed to an outer surface of the joining flange; an optical film set mounted in the mounting space.

Abstract: A semiconductor device includes a semiconductor substrate having a first lattice constant, a dopant blocking layer disposed over the semiconductor substrate, the dopant blocking layer having a second lattice constant different from the first lattice constant, and a buffer layer disposed over the dopant blocking layer, the buffer layer having a third lattice constant different from the second lattice constant. The semiconductor device also includes a plurality of channel members suspended over the buffer layer, an epitaxial feature abutting the channel members, and a gate structure wrapping each of the channel members.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: An organic semiconducting compound and an organic photoelectric component containing the same are provided. The organic semiconducting compound has a novel chemical structure to make the organic semiconducting compound have good response to the infrared light. The organic semiconducting compound can be applied to the organic photoelectric components such as organic photodetector (OPD), organic photovoltaic (OPV) cell, and organic field-effect transistor (OFET). Thus, the organic photoelectric components have better light absorption range and photoelectric response while in use.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.

Abstract: An appressed antenna includes an antenna housing and a metal shell. The antenna housing comprising a housing and a planar antenna, where the planar antenna is bent with one part folded onto the inner surface of the housing and other part pressed onto the outer surface of the housing. The antenna housing is sleeve fitted to the metal shell with a gap between for the planar antenna to radiate. In this all-metal environment, the position of the antenna is close to the gap opening will increase radiation efficiency. By having at least a branch at the tail end of the appressed antenna, the appressed antenna can have a good return loss and antenna gain.

Abstract: A force-balancing magnetic bearing with an adjustable bias magnetic field for a stator permanent magnet motor is provided. The force-balancing magnetic bearing includes four permanent magnetic poles and four electromagnetic poles, wherein a magnetic field energy of the four permanent magnetic poles is sourced from a stator permanent magnet of the stator permanent magnet motor, each permanent magnetic pole is formed by a left permanent-magnet magnetic bridge, a right permanent-magnet magnetic bridge, a magnetic adjusting section, an electromagnetic pole stator, an electromagnetic pole and permanent magnetic pole isolation plate, a permanent-magnet two-side magnetic pole connection section, a left permanent-magnet magnetic pole and a right permanent-magnet magnetic pole, a magnetic flux of each permanent magnetic pole is adjusted by the magnetic adjusting section, and the four electromagnetic poles are adjusted by currents introduced into electromagnetic pole winding coils.

Abstract: The present disclosure provides a method for increased target utilization within a sputtering system. A plurality of targets are provided wherein each target is operatively connected to a central axis. An ion beam is generated within the sputtering system. The generated ion beam is directed at a first location of a first target for a first time period. Each target is moved by rotating the central axis. The generated ion beam is directed at a second location of the first target for a second time period.

Abstract: A system and a method for detecting a moving target based on multi-frame point clouds. The system comprises a voxel feature extraction module; a transformer module used for matching and fusing the feature tensor sequence, fusing a first feature tensor with a second feature tensor, fusing the fused result with a third feature tensor, fusing the fused result with a fourth feature tensor, and repeating the fusing steps with a next feature tensor to obtain a final fused feature tensor; and an identification module used for extracting features from the final fused feature tensor and outputting detection information of a target. The method comprises the following steps: S1, constructing each system module; S2, training the model by the data in a training set; S3, predicting by the trained model.

Abstract: A power generation device and method based on the time-varying magductance principle relate to the field of energy conversion, and in particular relate to an electromagnetic induction power generation device. The power generation device includes an electric energy generation unit, a power conversion unit and an electric energy storage unit. The electric energy generation unit includes a time-varying magductance component configured to form a closed conductor loop in a magnetic circuit with constant magnetic flux. By changing a magductance parameter of the time-varying magductance component, the time-varying magductance component generates induced current. The power conversion unit consists of a switching device and a circuit. The electric energy generated by the time-varying magductance component can be stored into the electric energy storage unit through controlling the switching device.

Abstract: An illumination system including multiple light sources, a first light combining module, a second light combining module, and a converging lens is provided. The light sources respectively provide multiple beams with the same wavelength range. The first light combining module is disposed on a transmission path of a portion of the beams. The second light combining module is disposed on a transmission path of another portion of the beams to combine the beams into an exciting beam. The converging lens is disposed on a transmission path of the exciting beam.

Abstract: A voltage output circuit and an electronic cigarette are provided. The voltage output circuit includes a control chip and a step-down switch chip. When a first switch element turns on, the modulation signal output terminal of the control chip outputs a pulse modulation signal to a first control terminal of the step-down switch chip, and access between a first access terminal and a second access terminal of the step-down switch chip is established, based on the effective pulse modulation signal. The output voltage of the second access terminal is less than a system power voltage. The voltage output circuit and the electronic cigarette outputs the pulse modulation signal to the step-down switch chip by the control chip, and the step-down switch chip outputs a suitable driving voltage to the load, such as a thermal wire, the voltage output circuit with simplified structure is adjustable and improved.

Abstract: A manufacturing method of a wavelength-converting component includes providing a substrate, providing a wavelength-converting layer and providing a reflective layer. The reflective layer is disposed on the substrate. The wavelength-converting layer is disposed on a surface of the reflective layer away from the substrate. The wavelength-converting layer includes a wavelength-converting material and a second organic adhesive. The wavelength-converting material is mixed in the second organic adhesive. The second organic adhesive includes an aromatic polyimide. The wavelength-converting component manufactured by the method of the invention can improve mechanical properties such as shear strength, tensile strength and fatigue strength, temperature resistance and reflectivity, and can reduce rates of moisture absorption. The projection apparatus including the wavelength-converting component can reduce degradation in image brightness.

Abstract: The present invention relates to the field of smart grids, and provides a non-intrusive load monitoring method and device based on temporal attention mechanism. The method comprises the following steps: obtaining a total load data, an equipment load data, and corresponding sampling time of a building during a certain period of time; integrating the total load data and the equipment load data with the corresponding sampling time to obtain an enhanced total load data and an enhanced equipment load data; using a sliding window method to segment the enhanced total load data and the enhanced equipment load data, and constructing a deep learning training dataset; constructing a neural network model based on a deep learning training framework and training the model using the training dataset. The present invention can effectively extract the working time mode of the load and its inherent dependencies, thereby improving the accuracy of load monitoring.