Patents by Inventor Wei Huang

Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240121659
    Abstract: A data transmission method includes receiving, by first UE, bearer configuration information sent by a serving node; and performing, by the first UE, bearer configuration. A data transmission method, includes: sending, by a first base station, a sidelink (SL) data forwarding request to a second base station; and receiving, by the first base station, an SL data forwarding response sent by the second base station.
    Type: Application
    Filed: May 31, 2022
    Publication date: April 11, 2024
    Inventors: Lin CHEN, Mengzhen WANG, Wei LUO, Ying HUANG
  • Publication number: 20240121804
    Abstract: Methods, systems, and apparatuses can comprise a first device in a wireless communication system receiving configuration of one or more first sidelink resource pools for at least sidelink data transmission and configuration of one or more second sidelink resource pools for sidelink reference signal transmission, receiving a Downlink Control Information (DCI) for sidelink, wherein the DCI comprises a resource pool index corresponding to one sidelink resource pool, determining the DCI for scheduling sidelink data transmission or sidelink reference signal transmission based on at least the resource pool index or the one sidelink resource pool, acquiring or determining fields or information in the DCI based on the determination that the DCI is for scheduling sidelink data transmission or sidelink reference signal transmission, determining a sidelink resource based on the acquired or determined fields, or the information in the DCI, and performing a sidelink transmission on the sidelink resource in the one sidelin
    Type: Application
    Filed: September 27, 2023
    Publication date: April 11, 2024
    Inventors: Ming-Che Li, Chun-Wei Huang, Li-Chih Tseng
  • Publication number: 20240120651
    Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 11, 2024
    Inventors: Zhen Zhou, Tae Young Yang, Timo Huusari, Renzhi Liu, Wei Qian, Mengyuan Huang, Jason Mix
  • Publication number: 20240116033
    Abstract: The present invention relates to the technical field of catalyst preparation, disclosing a preparation method and application of a coated vanadium-tungsten-titanium oxide monolithic SCR catalyst. The method includes the steps of mixing a vanadium oxide precursor, a tungsten oxide precursor, titanium dioxide, an inorganic adhesive, an organic adhesive and a macromolecular surfactant with deionized water and stirring them to obtain a thick liquid; adding a pH adjuster to the thick liquid to make its pH 1.5-4.5; impregnating a cordierite honeycomb carrier in the thick liquid to obtain a preliminarily-impregnated catalyst and dried and calcined the preliminarily-impregnated catalyst to obtain a finished catalyst. The method has advantages such as simple operation, easy repetition and short time-consuming, so it can be applied to exhaust gas post-treatment of a marine diesel engine, and provide a good choice for catalysts used to denitrify medium and high temperature exhausted gas from marine engines.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 11, 2024
    Inventors: Mingyu GUO, Yidan HUANG, Boqun LIU, Shaoping CUI, Shipei DONG, Siqi CHEN, Bin LIU, Yingjie ZHAO, Fang LIN, Zhonghua TIAN, Junjie ZHAO, Wei YE, Yanjie WEI, Zhipeng ZHANG
  • Publication number: 20240120402
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.
    Type: Application
    Filed: November 19, 2023
    Publication date: April 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jia-Ni YU, Kuo-Cheng CHIANG, Mao-Lin HUANG, Lung-Kun CHU, Chung-Wei HSU, Chun-Fu LU, Chih-Hao WANG, Kuan-Lun CHENG
  • Publication number: 20240118721
    Abstract: A regulator circuit module, a memory storage device, and a voltage control method are disclosed. The voltage control method includes: generating an output voltage according to an input voltage by a driving circuit; generating a feedback voltage according to the output voltage; and controlling the driving circuit by a first regulator circuit to adjust the output voltage in response to a current change caused by the feedback voltage.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 11, 2024
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Chien-Fu Huang, Bing-Wei Yi
  • Publication number: 20240120683
    Abstract: An electrical connector assembly includes an electrical connector and a rotatable sleeve. The electrical connector includes a casing and a coupling component. The coupling component is rotatably disposed on the casing, and the coupling component has at least one first ratchet tooth. The rotatable sleeve is rotatably disposed on the casing. The rotatable sleeve has at least one second ratchet tooth, the second ratchet tooth of the rotatable sleeve is meshed with the first ratchet tooth of the coupling component merely along a first direction for rotating the coupling component relative to the casing.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 11, 2024
    Applicant: EZCONN CORPORATION
    Inventors: Kai-Wei HUANG, Kai-Chih WEI
  • Publication number: 20240118155
    Abstract: A heavy-duty, high-power and large-torque chassis dynamometer for a multi-environmental system, comprising a power testing platform disposed on the ground and a rack located below the power testing platform. A fixed base and a sliding base are sequentially disposed on an inner side of the rack in a length direction of the power testing platform, a pair of first hub assemblies are mounted on the fixed base through a plurality of support frames, a sliding platform is disposed on the sliding base, and a pair of second hub assemblies are mounted on the sliding platform through a plurality of support frames. Tension sensor assemblies are connected to outer circumferences of the first hub assemblies and outer circumferences of the second hub assemblies, and are fixedly disposed on the support frames.
    Type: Application
    Filed: March 2, 2021
    Publication date: April 11, 2024
    Applicant: JiangSu XCMG Construction Machinery Research Institute LTD.
    Inventors: Bin Zhao, Hanguang LIU, Wei XU, Cheng HUANG, Lei TIAN
  • Publication number: 20240120313
    Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Publication number: 20240118135
    Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee
  • Publication number: 20240120282
    Abstract: The present application discloses a semiconductor structure and methods for manufacturing semiconductor structures. The semiconductor structure includes a plurality of bottom dies and a top die stacked on the bottom dies. The bottom dies receive power supplies through tiny through silicon vias (TSVs) formed in backside substrates of the bottom dies, while the top die receives power supplies through dielectric vias (TDVs) formed in a dielectric layer that covers the bottom dies. By enabling backside power delivery to the bottom die, more space can be provided for trace routing between stacked dies. Therefore, greater computation capability can be achieved within a smaller chip area with less power loss.
    Type: Application
    Filed: February 20, 2023
    Publication date: April 11, 2024
    Inventors: TZU-WEI CHIU, CHUN-WEI CHANG, SHANG-PIN CHEN, WEI-CHIH CHEN, CHE-YEN HUANG
  • Patent number: 11955298
    Abstract: A button module is provided. The button module comprises a base, a pressing part, and an elastic part. The pressing part includes a fixed end and a free end. The fixed end is pivotally connected to the base in a first axial direction. The elastic part is disposed on a side of the pressing part facing the base. The elastic part includes a first damping portion and a second damping portion selectively pressing against the base, where a hardness of the first damping portion is different from a hardness of the second damping portion.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: April 9, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Te-Wei Huang, Zih-Siang Huang, Jhih-Wei Rao, Hung-Chieh Wu, Liang-Jen Lin
  • Patent number: 11956082
    Abstract: Aspects presented herein may enhance a HARQ feedback operation to improve data retransmissions by using tri-state HARQ feedback, and may enable a UE to construct a codebook for tri-state HARQ feedback. In one aspect, a UE determines whether tri-state HARQ feedback or bi-state HARQ feedback is configured based on a DL carrier. The UE generates HARQ feedback for at least one of a received PDCCH or a received PDSCH on the DL carrier based on the determination whether the DL carrier is configured with the tri-state HARQ feedback. The UE transmits the generated HARQ feedback.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: April 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Wei Yang, Yi Huang, Wanshi Chen, Peter Gaal, Hwan Joon Kwon, Krishna Kiran Mukkavilli, Tingfang Ji
  • Patent number: 11955694
    Abstract: An antenna component is provided. An orthographic projection of auxiliary antennas on a clearance area is entirely located in, partly located in, or close to a radiation-sensitive area where a specific absorption ratio (SAR) value of a frequency band needs to be reduced, so that a signal emitted from the radiation-sensitive area where the SAR value of the frequency band needs to be reduced on a primary antenna may be absorbed by the auxiliary antennas, and the auxiliary antennas generate secondary radiation.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: April 9, 2024
    Assignee: HuiZhou TCL Mobile Communication Co., Ltd.
    Inventors: Yi Huang, Lei Chen, Wei Chen, Yibing Chen
  • Patent number: 11954152
    Abstract: The present specification discloses video matching. In a computer-implemented method, a plurality of feature vectors of a target video is obtained. A candidate video similar to the target video is retrieved from a video database based on the plurality of feature vectors of the target video. A time domain similarity matrix feature map is constructed between the target video and the candidate video based on the target video and the candidate video. Using the time domain similarity matrix feature map as an input into a deep learning detection model, a video segment matching the target video in the candidate video and a corresponding similarity is output.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: April 9, 2024
    Assignee: Alipay (Hangzhou) Information Technology Co., Ltd.
    Inventors: Chen Jiang, Wei Zhang, Qing Wang, Yuan Cheng, Furong Xu, Kaiming Huang, Xiaobo Zhang, Feng Qian, Xudong Yang, Tan Pan
  • Patent number: 11956738
    Abstract: A UE performs a cell activation process in a wireless network. The UE calculates a first automatic gain control (AGC) setting based on downlink signals from a base station. The downlink signals include a coarse beam reference signal, a fine beam reference signal, and a conversion indication that indicates a power conversion between the coarse beam reference signal and the fine beam reference signal. The UE further calculates a second AGC setting based on the first AGC setting and the conversion indication. The UE performs a cell search using one of the first AGC setting and the second AGC setting, and performs fine time-frequency tracking using the other of the first AGC setting and the second AGC setting.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: April 9, 2024
    Assignee: MEDIATEK INC.
    Inventors: Din-Hwa Huang, Tsang-Wei Yu
  • Patent number: 11957018
    Abstract: A display device includes: a substrate having display and non-display areas; a first conductive layer including first and second sub-conductive lines; a second conductive layer including third and fourth sub-conductive lines, wherein, in the display area, the first sub-conductive line and the third sub-conductive lines cross from a top view; and a third conductive layer including third conductive lines and corresponding to the non-display area; wherein, corresponding to the non-display area, a portion of a projection of the one of the third conductive lines is overlapped with a portion of a projection of the second sub-conductive line on the substrate, and another portion of the projection of the one of the third conductive lines is overlapped with a portion of a projection of the fourth sub-conductive line on the substrate.
    Type: Grant
    Filed: May 9, 2023
    Date of Patent: April 9, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Hui-Min Huang, Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh
  • Patent number: 11955547
    Abstract: An integrated circuit device includes a gate stack disposed over a substrate. A first L-shaped spacer is disposed along a first sidewall of the gate stack and a second L-shaped spacer is disposed along a second sidewall of the gate stack. The first L-shaped spacer and the second L-shaped spacer include silicon and carbon. A first source/drain epitaxy region and a second source/drain epitaxy region are disposed over the substrate. The gate stack is disposed between the first source/drain epitaxy region and the second source/drain epitaxy region. An interlevel dielectric (ILD) layer disposed over the substrate. The ILD layer is disposed between the first source/drain epitaxy region and a portion of the first L-shaped spacer disposed along the first sidewall of the gate stack and between the second source/drain epitaxy region and a portion of the second L-shaped spacer disposed along the second sidewall of the gate stack.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Te-Jen Pan, Yu-Hsien Lin, Hsiang-Ku Shen, Wei-Han Fan, Yun Jing Lin, Yimin Huang, Tzu-Chung Wang
  • Patent number: 11956938
    Abstract: A device incudes a substrate. A first fin and a second fin are over the substrate. An isolation structure is laterally between the first fin and the second fin. A gate structure crosses the first fin and the second fin. A first source/drain epitaxy structure is over the first fin. A second source/drain epitaxy structure is over the second fin. A spacer layer extends from a first sidewall of the first fin to a first sidewall of the second fin along a top surface of the isolation structure.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tetsu Ohtou, Ching-Wei Tsai, Kuan-Lun Cheng, Yasutoshi Okuno, Jiun-Jia Huang
  • Patent number: D1021389
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: April 9, 2024
    Assignee: Shenzhen Deyuanxiang Technology Development Co., Ltd.
    Inventor: Wei Huang