Abstract: A pressure detector is disclosed having an organic transistor, a pressure-detecting layer and a first electrode. The organic transistor includes an emitter, an organic layer, a grid formed with holes, and a collector, the organic layer being sandwiched between the emitter and the collector. The pressure-detecting layer is formed on the organic transistor such that the collector is sandwiched between the organic layer and the pressure-detecting layer. The first electrode is formed on the pressure-detecting layer such that the pressure-detecting layer is sandwiched between the collector and the first electrode. The area of the active region of the pressure detector is determined by the overlapped area of the electrodes, thereby reducing the pitch of the electrodes and thus the size of the pressure detector.

Abstract: A load driving apparatus is provided. The load driving apparatus is configured to output an electrical signal to a load. The load driving apparatus includes a driver and an average voltage/current detector. The driver receives an input voltage and a control signal. The driver tunes the electrical signal according to the control signal. The average voltage/current detector receives the electrical signal outputted to the load and generates the control signal by comparing the electrical signal and a reference signal.

Abstract: A shift register includes a plurality of shift register units each including an input circuit, a pull-up circuit and a pull-down circuit. The shift register unit receives an input voltage at an input end and provides an output voltage at an output end. The input circuit controls the signal transmission path between a first clock signal and a first node according to the input voltage. The pull-up circuit controls the signal transmission path between a second clock signal and the output end according to the level of the first node. The pull-down circuit includes a pull-down unit and a control unit. The pull-down unit maintains the level of the first node or the output end according to the level of the second node. The control unit maintains the level of the second node according to the first clock signal, the second clock signal and the level of the first node.

Abstract: A method of making a light-guiding module includes the steps of applying a layer of light guide material containing methyl methacrylate oligomers on a reflector, and polymerizing the methyl methacrylate oligomers of the light guide material at a temperature ranging from 60 to 65° C. for 2.5 to 3 hours to form a light guide plate containing polymethylmethacrylate and integrally combining the reflector. Since there is no any gap between the light guide plate and the reflector, the light-guiding module reduces light loss, and improves the luminous efficiency of the backlight unit in which the light-guiding module is used.

Abstract: The invention provides a conductive powder composite including a bamboo charcoal powder pre-processed with a pulverizing procedure and a refining procedure of 900 to 1500° C. and a conductive carbon black powder, wherein the bamboo charcoal powder and the conductive carbon black powder are blended by a high speed mechanical granulating machine to form the conductive powder composite. The conductive powder composite can simultaneously and effectively improve the poor conductivity of the bamboo charcoal powder and the embrittlement characteristic of the conductive carbon black powder in the conventional technology. The invention also provides a conductive masterbatch and a fabrication method thereof, and a multifunctional antistatic non-woven fabric and a fabrication method thereof.

Abstract: The invention provides a conductive powder composite including a bamboo charcoal powder pre-processed with a pulverizing procedure and a refining procedure of 900 to 1500° C. and a conductive carbon black powder, wherein the bamboo charcoal powder and the conductive carbon black powder are blended by a high speed mechanical granulating machine to form the conductive powder composite. The conductive powder composite can simultaneously and effectively improve the poor conductivity of the bamboo charcoal powder and the embrittlement characteristic of the conductive carbon black powder in the conventional technology. The invention also provides a conductive masterbatch and a fabrication method thereof, and a multifunctional antistatic non-woven fabric and a fabrication method thereof.

Abstract: The invention discloses a flip type portable electronic device which includes a main body and a cover. The main body includes a hinged end. The cover includes an assembling end that hinged with the hinged end of the main body. The assembling end of the cover defines a notch allowing for deformation of the assembling end. The flip type potable electronic device has simple structure and is easy to be assembled and detached that enhances the assembling efficiency and lowers the maintenance cost.

Abstract: A spunbond non-woven containing bamboo charcoal is provided, which has functions of thermal insulation, deodorization and acoustical absorption and including a plurality of non-woven fibers. The non-woven fibers include a bamboo charcoal mixture including bamboo charcoal and a polymer, wherein the bamboo charcoal accounts for 0.05˜35 wt % based on the total amount of the bamboo charcoal mixture. The present invention additionally provides a method for fabricating the single-component or multi-component spunbond non-woven containing bamboo charcoal. A bamboo charcoal grain containing bamboo charcoal is prepared, wherein the bamboo charcoal has an amount of 0.05˜35 wt % based on the total weight of the bamboo charcoal grain. Next, the bamboo charcoal grain or the bamboo charcoal grain mixed with a polymer is spunbond with another polymer by using a spin apparatus to form a non-woven.

Abstract: A manufacturing method with respect to polymer chips containing metal or metal oxide nanoparticles component discloses the chips, treated by blend and extrude, composed of one metal or metal oxide nanparticles and at least one polymer material. The metal or metal oxide nanoparticles disperse into polymer chip and by spinning, textile process to be as antibiosis textiles, e.g. fiber, yarn, woven or non-woven or to be as plastic process materials. Meanwhile, uses metal or metal oxide nanoparticles to achieve functional application, e.g. disinfection, antibiosis, far IR, and so on.

Abstract: A manufacturing method with respect to polymer chips containing metal or metal oxide nanoparticles component discloses the chips, treated by blend and extrude, composed of one metal or metal oxide nanoparticles and at least one polymer material. The metal or metal oxide nanoparticles disperse into polymer chip and by spinning, textile process to be as antibiosis textiles, e.g. fiber, yarn, woven or non-woven or to be as plastic process materials. Meanwhile, uses metal or metal oxide nanoparticles to achieve functional application, e.g. disinfection, antibiosis, far IR, and so on.

Abstract: A leadframe for an IC package and a method of manufacturing the same are provided. The leadframe can be manufactured in such a manner as to provide suitable bondability, molding compound characteristic, and solderability. The leadframe includes a base structure made from a conductive material. A silver plating is formed over the base structure of the leadframe, and a palladium plating is formed over the silver plating. Depending on actual requirements, a copper layer and a nickel plating can be formed between the silver plating and the base structure of the leadframe, and a palladium/nickel plating can be formed between the silver and palladium platings. Further, a gold layer can be formed over the palladium plating. The palladium plating and the palladium/nickel plating can be formed all over the leadframe or selectively formed only in the external-lead area of the leadframe.

Abstract: A leadframe for an IC package and a method of manufacturing the same are provided. The leadframe can be manufactured in such a manner as to provide suitable bondability, molding compound characteristic, and solderability. The leadframe includes a base structure made from a conductive material. A silver plating is formed over the base structure of the leadframe, and a palladium plating is formed over the silver plating. Depending on actual requirements, a copper layer and a nickel plating can be formed between the silver plating and the base structure of the leadframe, and a palladium/nickel plating can be found between the silver and palladium platings. Further, a gold layer can be formed over the palladium plating. The palladium plating and the palladium/nickel plating can be formed all over the leadframe or selectively formed only in the external-lead area of the leadframe.

Abstract: A leadframe for an IC package and a method of manufacturing the same are provided. The leadframe can be manufactured in such a manner as to provide suitable bondability, molding compound characteristic, and solderability. The leadframe includes a base structure made from a conductive material. A silver plating is formed over the base structure of the leadframe, and a palladium plating is formed over the silver plating. Depending on actual requirements, a copper layer and a nickel plating can be formed between the silver plating and the base structure of the leadframe, and a palladium/nickel plating can be formed between the silver and palladium platings. Further, a gold layer can be formed over the palladium plating. The palladium plating and the palladium/nickel plating can be formed all over the leadframe or selectively formed only in the external-lead area of the leadframe.