Abstract: A lighting device, a light spreading plate for the lighting device and a method for manufacturing the same are provided. The lighting device comprises a light source plate and the light spreading plate. The light source plate comprises a plurality of light sources. The light spreading plate comprises a light travelling layer formed with a plurality of light spreading units. Each of the light spreading units is formed with a main body being defined with a top surface, a bottom surface and a peripheral. The main body has a thickness being tapered towards the peripheral. The main body comprises a top surface having a cone-shaped recess and a bottom surface having a bowl-shaped recess. The cone-shaped recess and the bowl-shaped recess of each of the spreading units are opposite to each other, and one of the cone-shaped recess and bowl-shaped recess is fitted for one of the light sources.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: Embodiments of the present invention include a light converting structure, a light accommodating structure, and a lighting device. The light converting structure includes a bottom conical recess to accommodate a light source, and a top conical recess to distribute the lights emitted from the light source. The light accommodating structure includes a through hole with a small opening and a large opening. A light source is accommodated in the through hole at the large opening, and the lights emitted from the light source output at the small opening. The lighting device utilizing the light converting structure and/or the light accommodating structure obtains a thinner configuration.

Abstract: A direct-lit light guiding structure, a direct-lit light guiding panel and a lighting device are disclosed. The light guiding structure includes a light transmissive body and microstructures; the light transmissive body includes an upper conical groove and a lower accommodating groove, and the upper conical groove has a curved surface with a continually varied slope; the microstructures are disposed on the light transmissive body. The lighting device includes a circuit board, a light source and the aforesaid light guiding structure; the light source and the light guiding structure are disposed on the circuit board, and the light source is accommodated within the lower accommodating groove. With these arrangements, the direct-lit light guiding structure can receive the light rays emitted from the light source, and then output the lights uniformly. Further, a plurality of direct-lit light guiding structures can be connected with one another to form the direct-lit light guiding panel.

Abstract: A light panel is disclosed. The light panel comprises a circuit assembly, a plurality of light sources, a light reflective structure, and a diffuser layer. The light reflective structure has a plurality of concaves, which are continuously connected to form a plurality of ridges. Each of the concaves has an opening formed on the bottom surface thereof, and each of the light sources is disposed corresponding to each of the openings of the concaves. The diffuser layer is supported by the ridges of the light reflective structure. In some aspects of the present invention, the diffuser layer may have a sloping inner surface or is coated with patterned diffuser coatings on the top surface. Each light source can be added with a lens.

Abstract: A set of colorants for printing a multi-colored image when viewed under non-visible radiation outside of the visible spectrum can include a first colorant and a second colorant. The first colorant can be capable of absorbing non-visible radiation and shifting the wavelength of the non-visible radiation to a visible wavelength, thus producing a visible color. Likewise, the second colorant can be capable of absorbing the non-visible radiation and shifting the wavelength to a second visible wavelength, thus producing a different visible color.

Abstract: A lighting device, a light spreading plate for the lighting device and a method for manufacturing the same are provided. The lighting device comprises a light source plate and the light spreading plate. The light source plate comprises a plurality of light sources. The light spreading plate comprises a light travelling layer formed with a plurality of light spreading units. Each of the light spreading units is formed with a main body being defined with a top surface, a bottom surface and a peripheral. The main body has a thickness being tapered towards the peripheral. The main body comprises a top surface having a cone-shaped recess and a bottom surface having a bowl-shaped recess. The cone-shaped recess and the bowl-shaped recess of each of the spreading units are opposite to each other, and one of the cone-shaped recess and bowl-shaped recess is fitted for one of the light sources.

Abstract: A printing system and method include analyzing a plurality of properties of a document, and for each of a plurality of ink sets, calculating a metric for each of the properties.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: A memory card assembly with a simplified structure. The memory card assembly has a memory card assembly a printed wiring board substrate and at least one integrated circuit unit mounted and electrically connected to the printed wiring board substrate. A rigid ring is fitted over a periphery of the printed wiring board substrate to encircle the integrated circuit die therein. Thereby, a dam with an open top is constructed over the printed wiring board substrate. A filler resin material is then filled within the open dam to cover the printed wiring board substrate and integrated circuit unit.

Abstract: A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.

Abstract: A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Abstract: A set of colorants for printing a multi-colored image when viewed under non-visible radiation outside of the visible spectrum can include a first colorant and a second colorant. The first colorant can be capable of absorbing non-visible radiation and shifting the wavelength of the non-visible radiation to a visible wavelength, thus producing a visible color. Likewise, the second colorant can be capable of absorbing the non-visible radiation and shifting the wavelength to a second visible wavelength, thus producing a different visible color.

Abstract: A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I/O bonding wires to the substrate to improve production yield.

Abstract: A portable image capture and camera device is provided including a device body, and an upper panel displaceably engaged to the body, and having an image capture module disposed thereon. A lower panel is also displaceably engaged to the body, for receiving and supporting a subject when the lower panel is deployed to an open position. The upper panel is translatable to deploy from a stowed position to a first deployed position to image a subject disposed on the lower panel (card reader mode), and to a second deployed position to image objects remote from the device (camera mode).

Abstract: A dual in-line memory module (DIMM) and a digital flash card are disclosed including an internal, built-in RFID tag in which identification and product information is contained. The RFID tag has an RF integrated circuit chip and antenna traces spreading outwardly therefrom to permit access to the information contained by the RF chip. In the case of a DIMM, the RF integrated circuit chip and its antenna traces are located on top of or between the layers of a multi-layer laminated printed wiring board substrate. In the case of a digital flash card, the RF integrated circuit chip and its antenna traces are preferably located on top of a multi-layer printed wiring board substrate and then encapsulated within a molded cover. In the alternative, the RF chip and its antenna traces are attached to the inside of a cover that extends over and is spaced above the printed wiring board substrate.

Abstract: A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.