Patents by Inventor Wei Lin

Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962527
    Abstract: A communications apparatus includes a processor configured to generate a radio frame. The radio frame comprises a data block. The data block comprises a plurality of N pilot blocks, a plurality of M sub-data blocks, and one guard interval (GI). Every two N pilot blocks of the plurality of N pilot blocks are not adjacent. The GI is located at a tail end of the data block, 4?N?8, N is an integer, M?N?1, and M is an integer. The communications apparatus also includes transceiver configured to send the radio frame to a receiver.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Min Yan, Guangjian Wang, Wei Lin, Mengyao Ma, Yanchun Li
  • Patent number: 11961584
    Abstract: The present invention provides a readout integrated circuit and an operation method thereof. The readout integrated circuit includes a readout circuit, a line buffer and a communication interface circuit. The readout circuit reads out a plurality of row sensing results of a plurality of sensor rows of a sensor. The line buffer is coupled to the readout circuit for temporarily storing a current row sensing result of a current sensor row of the sensor. The communication interface circuit is coupled to the line buffer. After the current row sensing result of the current sensor row is temporarily stored into the line buffer, the communication interface circuit outputs the current row sensing result in real time to a host circuit.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventor: Wu Wei Lin
  • Patent number: 11961325
    Abstract: An image processing method and apparatus, a computer-readable medium, and an electronic device are provided. The image processing method includes: respectively projecting, according to a plurality of view angle parameters corresponding to a plurality of view angles, a face model of a target object onto a plurality of face images of the target object acquired from the plurality of view angles, to determine correspondences between regions on the face model and regions on the face image; respectively extracting, based on the correspondences and a target region in the face model that need to generate a texture image, images corresponding to the target region from the plurality of face images; and fusing the images that correspond to the target region and that are respectively extracted from the plurality of face images, to generate the texture image.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: April 16, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Xiangkai Lin, Linchao Bao, Yonggen Ling, Yibing Song, Wei Liu
  • Patent number: 11961796
    Abstract: A package comprises at least one first device die, and a redistribution line (RDL) structure having the at least one first device die bonded thereto. The RDL structure comprises a plurality of dielectric layers, and a plurality of RDLs formed through the plurality of dielectric layers. A trench is defined proximate to axial edges of the RDL structure through each of the plurality of dielectric layers. The trench prevents damage to portions of the RDL structure located axially inwards of the trench.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yueh-Ting Lin, Hua-Wei Tseng, Ming Shih Yeh, Der-Chyang Yeh
  • Patent number: 11962060
    Abstract: A power dividing and combining device comprising a resonance body, a plurality of circuit boards, an upper cover and a lower cover is provided. The resonance body comprises a solid conductive body, a plurality of first dividing elements, a plurality of second dividing elements, a signal-receiving end and a signal-transmitting end. The solid conductive body has a first surface, a second surface opposite to the first surface, and a plurality of side surfaces connecting the first surface and the second surface. The first dividing elements are disposed on the first surface and separate a plurality of first resonance channels on the first surface. The first resonance channels intersect at a first common region on the first surface. The second dividing elements are disposed on the second surface and separate a plurality of second resonance channels on the second surface. The second resonance channels intersect at a second common region on the second surface.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 16, 2024
    Assignee: AMPAK TECHNOLOGY INC.
    Inventors: Fure-Tzahn Tsai, Ruey Bing Hwang, Tso Hua Lin, Chih Wei Wang, Tzong-Yow Ho
  • Patent number: 11961791
    Abstract: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A conductive region is disposed in the polymer region and electrically coupled to the redistribution line. The conductive region includes a second flat top surface not higher than the first flat top surface.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo
  • Patent number: 11963295
    Abstract: Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: April 16, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Hung-Hsien Ko, Yi-Cheng Lu, Heng-Yin Chen, Hao-Wei Yu, Te-Hsun Lin
  • Patent number: 11958929
    Abstract: An organometallic complex, a catalyst composition employing the same, and a method for preparing polyolefin are provided. The organometallic compound has a structure represented by Formula (I) wherein M is Ti, Zr, or Hf; X is —O—, or —NR6—; R1 and R2 are independently hydrogen, C1-6 alkyl group, C6-12 aryl group, or R1 and R2 are combined with the carbon atoms, to which they are attached, to form an C6-12 aryl moiety; R3, R4 and R5 are independently fluoride, chloride, bromide, C1-6 alkyl group, C6-12 aryl group, C3-6 hetero aryl group, C7-13 aryl alkyl group or C7-12 alkyl aryl group; and R6 is hydrogen, C6-12 aryl group or C7-12 alkyl aryl group.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 16, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chien-Wei Hsu, Jyun-Wei Hong, Pao Tsern Lin, Shu-Hua Chan
  • Patent number: 11957722
    Abstract: The present invention discloses an anti-aging composition, which includes: (a) isolated lactic acid bacterial strains or a fermented product thereof; and (b) an excipient, a diluent, or a carrier; wherein the isolated lactic acid bacterial strains include: Bifidobacterium bifidum VDD088 strains, Bifidobacterium breve Bv-889 strains, and Bifidobacterium longum BLI-02 strains. The present invention further provides a method for preventing aging by administering the foregoing anti-aging composition to a subject in need thereof.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: April 16, 2024
    Assignee: GLAC BIOTECH CO., LTD
    Inventors: Hsieh-Hsun Ho, Yi-Wei Kuo, Wen-Yang Lin, Jia-Hung Lin, Yen-Yu Huang, Chi-Huei Lin, Shin-Yu Tsai
  • Patent number: 11961939
    Abstract: A method of manufacturing a light-emitting device, including: providing a substrate structure including a top surface; forming a precursor layer on the top surface; removing a portion of the precursor layer and a portion of the substrate from the top surface to form a base portion and a plurality of protrusions regularly arranged on the base portion; forming a buffer layer on the base portion and the plurality protrusions; and forming a III-V compound cap layer on the buffer layer; wherein one of the plurality of protrusions comprises a first portion and a second portion formed on the first portion; wherein the first portion is integrated with the base portion and has a first material which is the same as that of the base portion; and wherein the buffer layer contacts side surfaces of the plurality of protrusions and a surface of the base portion.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: April 16, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Peng Ren Chen, Yu-Shan Chiu, Wen-Hsiang Lin, Shih-Wei Wang, Chen Ou
  • Publication number: 20240118316
    Abstract: A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: MPI Corporation
    Inventors: Chin-Yi Lin, Che-Wei Lin, Ting-Ju Wu, Chien-Kai Hung
  • Publication number: 20240118538
    Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. Alternatively or additionally, the seal may include an internal seal, such as a metal foil layer that extends between the first and second glass layers, within the optical component to reduce the width of the optical component.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Wei Lin, Boyi Fu, Nathan K Gupta
  • Publication number: 20240116033
    Abstract: The present invention relates to the technical field of catalyst preparation, disclosing a preparation method and application of a coated vanadium-tungsten-titanium oxide monolithic SCR catalyst. The method includes the steps of mixing a vanadium oxide precursor, a tungsten oxide precursor, titanium dioxide, an inorganic adhesive, an organic adhesive and a macromolecular surfactant with deionized water and stirring them to obtain a thick liquid; adding a pH adjuster to the thick liquid to make its pH 1.5-4.5; impregnating a cordierite honeycomb carrier in the thick liquid to obtain a preliminarily-impregnated catalyst and dried and calcined the preliminarily-impregnated catalyst to obtain a finished catalyst. The method has advantages such as simple operation, easy repetition and short time-consuming, so it can be applied to exhaust gas post-treatment of a marine diesel engine, and provide a good choice for catalysts used to denitrify medium and high temperature exhausted gas from marine engines.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 11, 2024
    Inventors: Mingyu GUO, Yidan HUANG, Boqun LIU, Shaoping CUI, Shipei DONG, Siqi CHEN, Bin LIU, Yingjie ZHAO, Fang LIN, Zhonghua TIAN, Junjie ZHAO, Wei YE, Yanjie WEI, Zhipeng ZHANG
  • Publication number: 20240121881
    Abstract: A heat dissipation apparatus is disclosed. In the dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. A peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. At least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Wei CHEN, Weice MA, Benwei LIN, Xiaoyuan YING
  • Publication number: 20240120203
    Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.
    Type: Application
    Filed: March 8, 2023
    Publication date: April 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Te-Chih HSIUNG, Yun-Hua CHEN, Bing-Sian WU, Yi-Hsuan CHIU, Yu-Wei CHANG, Wen-Kuo HSIEH, Chih-Yuan TING, Huan-Just LIN
  • Publication number: 20240120388
    Abstract: Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gate material to a recessed surface, wherein the recessed surface includes a first horn at a first edge, a second horn at a second edge, and a valley located between the first horn and the second horn; depositing an etch-retarding layer over the recessed surface, wherein the etch-retarding layer has a central region over the valley and has edge regions over the horns, and wherein the central region of the etch-retarding layer is thicker than the edge regions of the etch-retarding layer; and performing a second etch process to recess the horns to establish the gate material with a desired profile.
    Type: Application
    Filed: January 18, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wei Yin, Tzu-Wen Pan, Yu-Hsien Lin, Jih-Sheng Yang, Shih-Chieh Chao, Chia Ming Liang, Yih-Ann Lin, Ryan Chia-Jen Chen
  • Publication number: 20240119473
    Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.
    Type: Application
    Filed: December 27, 2022
    Publication date: April 11, 2024
    Applicant: DUN-QIAN Intelligent Technology Co., Ltd.
    Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
  • Publication number: 20240118787
    Abstract: A video generating method and apparatus, a storage medium, and a terminal device are provided. The method includes: acquiring current input data of a camera including audio input data and/or image input data; determining an icon to be rendered based on the current input data; rendering the icon to be rendered on a target capturing picture to obtain a capturing effect picture; and generating a target video based on the capturing effect picture. The audio input data includes a preset duration of continuous audio frame data with a current input audio frame of the camera as an ending frame, and the image input data includes a preset number of continuous video frame pictures with a current capturing picture of the camera as the ending frame. The target capturing picture includes the preset number of continuous video frame pictures with the current capturing picture of the camera as a starting frame.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Yajie YU, Qian CHEN, Zhiwei SU, Xin LIN, Wei JIANG
  • Publication number: 20240115650
    Abstract: The present invention features interferon-free therapies for the treatment of HCV. Preferably, the treatment is over a shorter duration of treatment, such as no more than 12 weeks. In one aspect, the treatment comprises administering at least two direct acting antiviral agents to a subject with HCV infection, wherein the treatment lasts for 12 weeks and does not include administration of either interferon or ribavirin, and said at least two direct acting antiviral agents comprise (a) Compound 1 or a pharmaceutically acceptable salt thereof and (b) Compound 2 or a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 11, 2024
    Applicant: ABBVIE INC.
    Inventors: Walid M. Awni, Barry M. Bernstein, Andrew L. Campbell, Sandeep Dutta, Chih-Wei Lin, Wei Liu, Rajeev M. Menon, Thomas J. Podsadecki, Tianli Wang, Sven Mensing
  • Patent number: D1023006
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 16, 2024
    Assignee: CHENBRO MICOM CO., LTD.
    Inventor: Chiung-Wei Lin