Abstract: A system for optical data interconnect of a source and a sink includes a first HDMI compatible electrical connector able to receive electrical signals from the source. A first signal converter is connected to the first HDMI compatible electrical connector and includes electronics for conversion of differential (including but not limited to TMDS and FRL) electrical signals to optical signals, with the electronics including an optical conversion device. At least one optical fiber is connected to the first signal converter. A second signal converter is connected to the at least one optical fiber and includes electronics for conversion of optical signals to HDMI standard TMDS or FRL electrical signals. A power module for the second signal converter includes a power tap connected to HDMI standard TMDS or FRL circuitry and a voltage regulator connected to the power tap to provide power to an electrical signal amplifier.

Abstract: A system for optical data interconnect of a source and a sink includes a first HDMI compatible electrical connector able to receive electrical signals from the source. A first signal converter is connected to the first HDMI compatible electrical connector and includes electronics for conversion of TMDS or FRL electrical signals to optical signals, with the electronics including an optical conversion device connectable to source ground to reduce noise. At least one optical fiber is connected to the first signal converter. A second signal converter is connected to the at least one optical fiber and includes electronics for conversion of optical signals to TMDS or FRL electrical signals. A power module for the second signal converter provides power to an electrical signal amplifier connectable to sink ground. A second HDMI compatible electrical connector is connected to the second signal converter and able to send signals to the sink.

Abstract: A system for optical data interconnect of a source and a sink includes a first HDMI compatible electrical connector able to receive electrical signals from the source. A first signal converter is connected to the first HDMI compatible electrical connector and includes electronics for conversion of TMDS or FRL electrical signals to optical signals, with the electronics including an optical conversion device. At least one optical fiber is connected to the first signal converter. A second signal converter is connected to the at least one optical fiber and includes electronics for conversion of optical signals to differential electrical signals. A power module for the second signal converter includes a power tap connected to TMDS or FRL circuitry and a first voltage regulator connected to the power tap to provide power to an electrical signal amplifier. A rechargeable battery module is used to trigger power activation of connected ports, with the battery module being connected to the power tap.

Abstract: A micro light-emitting diode (LED) display panel is provided. The micro LED display panel includes a substrate and a driving layer. The driving layer is disposed on the substrate. The driving layer includes a micro LED and a photo sensor. When the micro LED emits light to a finger of a user, the photo sensor generates a sensing signal.

Abstract: An electronic device is provided. The electronic device includes a substrate and the electronic device also includes a light-emitting element, a sensing element and a black matrix disposed on the substrate. The sensing element is disposed adjacent to the light-emitting element. The black matrix has a plurality of openings and a light-shielding portion. The electronic device further includes a driving element disposed adjacent to and electrically connected to the light-emitting element. The sensing element includes a first thin-film transistor, and the driving element includes a second thin-film transistor. In a normal direction of the substrate, one of the openings is disposed corresponding to the sensing element, and the light-shielding portion is disposed corresponding to the driving element.

Abstract: The disclosure provides a backlight module and a display device. The backlight module includes a substrate, a light-emitting element, a circuit element, and a reflective sheet. The light-emitting element is bonded onto the substrate. The circuit element is bonded onto the substrate and electrically connected to the light-emitting element. The reflective sheet is disposed on the substrate and has a first opening. The first opening at least exposes the light-emitting element. At least a portion of a surface of the circuit element is made reflective. The display device includes the backlight module and a display panel disposed on the backlight module. The backlight module and the display device of the embodiment of the disclosure may improve the mura or exhibit a more uniform brightness.

Abstract: A display device is provided. The display device includes a display panel that has a display region. The display device also includes at least one image sensor that overlaps with the display region. The at least one image sensor includes a light-sensing element and at least one light-receiving element disposed on the light-sensing element.

Abstract: Embodiments of a virtualized radio-access network (RAN) node configured to implement functions including an O-RAN Distributed Unit (DU), an O-RAN Radio Unit (RU), an O-RAN Central Unit-Control Plane (CU-CP), and an O-RAN Central Unit-User Plane (CU-UP), are described herein. In some embodiments, a reliability enhancement strategy is determined according to measurement reports collected from user equipment (UEs), the DU and the CU-UP.

Abstract: An aspect of the present invention provides an optical imaging device including a first detecting unit. The first detecting unit includes a plurality of first pixels, a first opaque layer and at least one first micro-lens. The plurality of first pixels respectively has a plurality of first optoelectronic elements. The first opaque layer has at least one opening and is disposed over the plurality of first optoelectronic elements. The at least one first micro-lens is disposed over the first opaque layer, and overlaps at least one of the plurality of first pixels.

Abstract: A light-emitting device and display equipment are disclosed. The light-emitting device includes a light-emitting unit. The light-emitting unit includes a driving transistor and a light-emitting diode. The driving transistor includes a first terminal, a second terminal and a gate terminal. The first terminal is used to receive an operation voltage. The light-emitting diode is coupled to the second terminal and used to receive a driving current. The operation voltage is variable.

Abstract: An operation method of an electronic device for sensing an optical signal is provided. The electronic device includes a plurality of optical sensors and a plurality of light-emitting elements disposed adjacent to the plurality of optical sensors. The operation method of the electronic device for sensing the optical signal includes the following steps. The optical signal is provided to a first optical sensor of the plurality of optical sensors. The first optical sensor outputs a driving signal when dimming the plurality of light-emitting elements adjacent to the first optical sensor. Therefore, the accuracy of sensing the optical signal may be effectively increased.

Abstract: A display device is provided. The display device includes a display panel that has a display region. The display device also includes at least one image sensor that overlaps with the display region. The at least one image sensor includes a light-sensing element and at least one light-receiving element disposed on the light-sensing element.

Abstract: An electronic device including a plurality of light-emitting units, a driving circuit, and a controlling circuit is provided. The driving circuit is configured to drive at least one of the light-emitting units. The controlling circuit is configured to control the driving circuit. The plurality of light-emitting units, the driving circuit, and the controlling circuit are respectively disposed on different substrates.

Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In an embodiment, a barrier layer is formed along a sidewall. A portion of the barrier layer along the sidewall is etched back. After etching back the portion of the barrier layer, an upper portion of the barrier layer along the sidewall is smoothed. A conductive material is formed along the barrier layer and over the smoothed upper portion of the barrier layer.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface and a bottom surface. A top circuit is disposed on the top surface. A bottom circuit is disposed on the bottom surface and electrically connected to the top circuit. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The driver is disposed on the bottom surface of the circuit substrate and electrically connected to the bottom circuit.

Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.

Abstract: An electronic device is provided. The electronic device includes a plurality of light-emitting elements and a first thin-film transistor array. The first thin-film transistor array is used to drive at least a portion of the plurality of light-emitting elements, and the plurality of light-emitting elements and the first thin-film transistor array are disposed on different substrates.

Abstract: An optical element driving system is provided. The optical element driving system includes an optical element driving mechanism and a control assembly. The optical element driving mechanism includes a movable portion, a fixed portion, a driving assembly, and a position sensing assembly. The movable portion connects to an optical element. The movable portion is movable relative to the fixed portion. The movable portion is in an accommodating space in the fixed portion. The driving assembly is used for driving the movable portion to move relative to the fixed portion. The control assembly provides a driving signal to the driving assembly to control the driving assembly. The position sensing assembly is used for detecting the movement of the movable portion relation to the fixed portion and providing a motion sensing signal to the control assembly.

Abstract: A light emitting element includes a package substrate, a first light-emitting diode chip, an encapsulation material and a light-shielding layer. The first light-emitting diode chip is disposed on the package substrate, the encapsulation material is disposed on the first light-emitting diode chip and the package substrate, and the light-shielding layer is disposed on the encapsulation material and has a first opening. In a top-view direction, the area of the first opening of the light-shielding layer is less than the area of the light emitting element.

Abstract: An electronic device is disclosed and includes a base substrate, a first circuit layer and a plurality of light-emitting elements. The base substrate has a first surface and a second surface opposite to each other. The first circuit layer includes a first portion and a second portion. The first portion is disposed on the first surface of the base substrate, and the second portion is disposed on the second surface of the base substrate. The light-emitting elements are disposed on the first portion of the first circuit layer. At least one of the second surface of the base substrate and the first portion of the first circuit layer includes at least one microstructure.