Abstract: A diagnostic card includes a circuit board, a connector, a controller, and a first display. The connector is coupled to a low pin count (LPC) to receive a reset signal outputted by a basic input output system as a server reboots. The controller is configured to record the total number of reboot times of the server and displays the total number of reboot times on the first display area.

Abstract: A keypad assembly includes a panel, a plurality of keys protruding from the panel, a light-emitting assembly, and a control unit. The light-emitting assembly includes a cover board and a plurality of light-emitting members mounted on the cover board. The cover board is hinged to the panel such that the cover board is capable of rotating relative to the panel to enable the light-emitting members to illuminate the keys. The control unit includes an angle sensor and a controller. The angle sensor senses an included angle between the cover board and the panel and creates signals of the included angle. The controller receives the signals and accordingly controls the light-emitting members to be turned on or turned off.

Abstract: An exemplary switch system includes a first central processing unit (CPU), a second CPU, a first switch unit, a second switch unit, and a microcontroller. The first CPU provides an identification signal to the first switch unit and the second switch unit when the first CPU is associated with a motherboard of an electronic device. Both the first switch unit and the second switch unit selectably and electronically connect to the first CPU or the second CPU according to whether or not both the first switch unit and the second switch unit detect the identification signal. The microcontroller is electronically connected between the first switch unit and the second switch unit, and accordingly communicates with the first CPU or the second CPU via the first switch unit and the second switch unit.

Abstract: A system for controlling fan speed, wherein fans are employed to dissipate heat generated by a plurality of hard disk drives divided into groups, includes a temperature sensor detecting an overall temperature where the hard disk drives are arranged, a control unit obtaining a number of operating hard disk drives in each group, and a baseboard management controller (BMC) storing ratios corresponding to different temperatures and different numbers of operating hard disk drives in each group. The BMC obtains the temperature from the temperature sensor and the number of operating hard disk drives in a group, and obtains a ratio from a preset table according to the temperature and the number of operating hard disk drives in the group, to adjust the speed of the fan.

Abstract: A mounting apparatus for a hard disk drive includes a bracket and a resilient plate. The bracket includes a first and a second side plates each defining two slanted first notches, and two first slots respectively extending from rear ends of the first notches. The resilient plate is slidably mounted to the first side plate. A front end of the resilient plate defines a slanted second notch, and a semicircular second slot extending from a rear end of the second notch. When the resilient plate is at a first position, the second notch and the second slot respectively align with one of the first notches and a corresponding first slot of the first side plate. When the resilient plate is slid to a second position, the second slot aligns with a rear end of said corresponding first slot, and the second notch is staggered from the corresponding first notch.

Abstract: An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

Abstract: A sequential voltage output circuit is connected between a power supply and a number of loads. The voltage sequence output circuit includes a complex programmable logic device (CPLD) and a number of switching circuits. When the CPLD receives a power on signal, the CPLD outputs a number of control signals sequentially through a number of outputs. When a switching circuit receives a control signal from the CPLD, the switching circuit allows the power supply to supply power to a corresponding load.

Abstract: A method of manufacturing a thin film transistor array substrate and a structure of the same are disclosed. The manufacturing method merely requires two steps of mask fabrication to accomplish the manufacture of thin film transistor array, in which the manufacturing method utilizes a first mask fabrication step to define a pattern of a source electrode and a drain electrode of the thin film transistor, and a partially-exposed dielectric layer, and utilizes a second mask fabrication step to define an arrangement of a transparent conductive layer. The manufacturing method and structure can dramatically reduce the manufacturing cost of masks and simplify the whole manufacturing process.

Abstract: A vortex reducing apparatus and method for drainage of a process tank are described. The vortex reducer including a keel having a longitudinal axis, a top flow foil coupled to the keel and a bottom flow foil coupled to the keel. The top flow foil and the bottom flow foil are each coupled to the keel at a first angle with respect to the longitudinal axis.

Abstract: A flash drive includes a casing and a main body slidably received in the casing. A universal serial bus (USB) connector mounted to an end of the main body may be extended from and retracted into the casing.

Abstract: A thin film transistor and a method for manufacturing the same are provided. A top-gate thin film transistor is fabricated by a process using two gray-tone photomasks and a lift-off method. Therefore, the method can save cost of photomasks and processes comparing to a conventional fabrication method.

Abstract: A method of manufacturing a thin film transistor array substrate and a structure of the same are disclosed. The manufacturing method merely requires two steps of mask fabrication to accomplish the manufacture of thin film transistor array, in which the manufacturing method utilizes a first mask fabrication step to define a pattern of a source electrode and a drain electrode of the thin film transistor, and a partially-exposed dielectric layer, and utilizes a second mask fabrication step to define an arrangement of a transparent conductive layer. The manufacturing method and structure can dramatically reduce the manufacturing cost of masks and simplify the whole manufacturing process.

Abstract: A robot control system includes a signal transmission device and a robot. The signal transmission device has two signal transmission elements that substantially transmit a first signal along a first direction and a second signal along a second direction respectively. The first signal defines a first signal area, and the second signal defines a second signal area. The overlap portion of the first and second signals defines a confinement area. The robot includes a detecting module and a control module. The detecting module detects the confinement area by detecting the first signal and the second signal simultaneously. When the detecting module detects the confinement area, the control module controls the robot to change direction and then move for a distance. Besides, a robot control method applied to the robot control system is also disclosed.

Abstract: In one aspect of the invention, an acoustic wave device includes a substrate, an acoustic isolator formed in or on the substrate, a bottom electrode formed on the acoustic isolator, a piezoelectric layer formed on the bottom electrode, a top electrode formed on the piezoelectric layer, and boundary means such as a gasket surrounding one of the first and second electrodes whose perimeter is aligned inside the perimeter of the acoustic isolator. The gasket has a lateral side having a wall profile, a curve profile, a multi-step profile, a gradually variable profile, or a combination of them.

Abstract: An acoustic resonator device includes a composite first electrode on a substrate, a piezoelectric layer on the composite electrode, and a second electrode on the piezoelectric layer. The first electrode includes a buried temperature compensating layer having a positive temperature coefficient. The piezoelectric layer has a negative temperature coefficient, and thus the positive temperature coefficient of the temperature compensating layer offsets at least a portion of the negative temperature coefficient of the piezoelectric layer.

Abstract: In one aspect of the invention, an acoustic wave device includes a substrate, and at least one acoustic wave resonator having a bottom electrode adjacent to the substrate, a top electrode, a piezoelectric layer sandwiched between the bottom and top electrodes, a passivation layer formed on the top electrode, and a mass load layer sandwiched between the substrate and the bottom electrode, or between the bottom electrode and the piezoelectric layer.

Abstract: A fan includes a plurality of blades and a motor. The motor includes a hub and a shaft having an end connected to the hub, a bushing, a bearing, and an oil-sealing structure. The blades are connected with and surrounding around the hub. The bushing is for supporting the other end of the shaft, and the bearing is disposed in the bushing and used to telescope the shaft. The shaft passes through the oil-sealing structure. The oil-sealing structure is telescoped to the shaft to fit tightly and the oil-sealing structure includes a main body and a barricade inwardly extending toward the shaft so that the oil-sealing structure is fixedly connected with the bushing.

Abstract: In one aspect of the invention, the acoustic wave resonator includes a resonator structure having a first electrode, a piezoelectric layer formed on the first electrode, and a second electrode formed on the piezoelectric layer, and a composite layered structure associated with the resonator structure such that the immunity of the acoustic wave resonator to environmental change and aging effects is improved, the trimming sensitivity is substantially minimized, and/or dispersion characteristics of the acoustic wave resonator is optimized.

Abstract: In one aspect of the present invention, an integrated wafer level package includes a first wafer and a second wafer spaced apart to define a first gap therebetween, a first bulk acoustic wave (BAW) filter disposed on the first wafer and a second BAW filter disposed on the second wafer, where the second BAW filter faces directly the first BAW filter to define a second gap therebetween, a seal ring disposed between the first wafer and the second wafer in the first gap such that a seal is formed surrounding the first BAW filter and the second BAW filter and defining a cavity between the seal ring and the first BAW filter and the second BAW filter, and at least one external contact accessible externally to the wafer level package and electrically coupled to at least one of the first BAW filter and the second BAW filter.

Abstract: In one aspect of the invention, an acoustic device has a first coupled resonator filter (CRF) and a second CRF electrically coupled to one another in series. Each CRF has an input port, an output port, a bottom film bulk acoustic resonator (FBAR), an acoustic decoupler formed on the bottom FBAR, and a top FBAR formed on the acoustic decoupler. Each FBAR has a bottom electrode, a piezoelectric layer formed on the bottom electrode, and a top electrode formed on the piezoelectric layer. The decoupling layer capacitance arising between the two electrodes enclosing the acoustic decoupler in a CRF is configured to achieve targeted filter response. A compensating capacitance is introduced to improve the amplitude and phase imbalance performance of an unbalanced to balanced CRF by eliminating the existence of asymmetric port-to-ground or feedback capacitance at the balanced output port produced by the decoupling layer capacitance.