Patents by Inventor Wei Su

Wei Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296365
    Abstract: A display substrate, a method for forming the display substrate and a display device are provided. The display substrate includes: a first conductive pattern located on a base substrate, where a ring-shaped conductive protection structure is arranged at an edge of a preset region of the first conductive pattern and surrounds the preset region, and the conductive protection structure is made of an anti-dry-etching material; an insulation layer covering the first conductive pattern; and a second conductive pattern located on a side of the insulation layer away from the first conductive pattern, where the second conductive pattern is electrically connected to the first conductive pattern through the via-hole.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 23, 2021
    Applicants: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jun LIU, Liangchen YAN, Bin ZHOU, Yang ZHANG, Tongshang SU, Wei LI, Liusong NI
  • Publication number: 20210297898
    Abstract: A wireless communication method for reducing the receival of unwanted data is provided. The wireless communication method for a TCP session includes the steps of determining whether a TCP session associated with a first subscriber identity module (SIM) of the UE is not required; and in response to determining that the TCP session is not required, the processor terminates the TCP session.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 23, 2021
    Inventors: Chih-Yuan TSAI, I-Wei TSAI, Jun-Jie SU, Yi-Lun CHEN
  • Publication number: 20210294156
    Abstract: A reflective LCD panel includes a color filter substrate, an array substrate, a liquid crystal layer and a polarizing film. The array substrate and the color filter substrate are disposed oppositely. The liquid crystal layer is disposed between the color filter substrate and the array substrate and has an alignment direction. The polarizing film is disposed on the color filter substrate, and color coordinates of the polarizing film in the CIE1976 color space are (a, b), wherein 0.05?a?0.2 and ?5?b?0. The liquid crystal layer has a birefringence difference ?n, the liquid crystal layer has a thickness (d), when the reflective LCD panel is in a white frame, 2?n*d=?? is satisfied, ?? is the optical path difference obtained when a forward light vertically enters the liquid crystal layer and is reflected by the array substrate, and 120 nm??n*d?170 nm.
    Type: Application
    Filed: March 18, 2021
    Publication date: September 23, 2021
    Inventors: Ding-Wei LIU, Meng-Ju LI, Wei-Chih HSU, Chen-Hao SU, Sung-Chun LIN, Chia-Hua YU
  • Patent number: 11127341
    Abstract: A light emitting module including a circuit carrier and a plurality of light emitting devices is provided. The circuit carrier includes a first circuit layer, a second circuit layer, a dielectric layer and a plurality of conductive vias. The first circuit layer and the second circuit layer are located at two opposite sides of the dielectric layer. The conductive vias pass through the dielectric layer and two opposite end portions of each of the conductive vias are respectively connected to the first circuit layer and the second circuit layer. The light emitting devices are electrically bonded to the first circuit layer. Moreover, the light emitting devices are disposed in a device disposing area of the circuit carrier and the conductive vias are arranged outside the device disposing area. A display device is also provided.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: September 21, 2021
    Assignee: PlayNitride Inc.
    Inventors: Yun-Li Li, Tzu-Yang Lin, Yu-Hung Lai, Po-Jen Su, Hsuan-Wei Mai
  • Patent number: 11128382
    Abstract: The disclosure relates to a multi-modulation-format compatible high-speed laser signal generation system and method. The disclosure can greatly improve modulation format compatibility of a laser communication system and saves system upgrading costs and resource costs. The system mainly includes a control instruction unit, a serial-parallel changeover switch unit, a precoding switch unit, a power control unit, an IQ modulator, a narrow line width laser, and a bias point control unit, wherein the control instruction unit is respectively connected to the serial-parallel changeover switch unit, the precoding switch unit, the power control unit, and the bias point control unit; the serial-parallel changeover switch unit, the precoding switch unit, the power control unit, and the IQ modulator are electrically connected in sequence; the narrow line width laser is connected to an optical input end of the IQ modulator; and the bias point control unit is connected to the IQ modulator.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: September 21, 2021
    Assignee: XI'AN INSTITUTE OF OPTICS AND PRECISION MECHANICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Xiaoping Xie, Xinning Huang, Wei Wang, Tao Duan, Hui Hu, Yulong Su, Duorui Gao
  • Publication number: 20210285641
    Abstract: A low-pollution combustor and a combustion control method therefor. The low-pollution combustor includes a combustor head including a primary combustion stage and a precombustion stage, the primary combustion stage including a primary-combustion-stage channel and a primary-combustion-stage swirler disposed in the primary-combustion-stage channel. The primary combustion stage includes a pre-film plate disposed in the primary-combustion-stage channel, and the pre-film plate is radially divided into an outer-layer pre-film plate and an inner-layer pre-film plate.
    Type: Application
    Filed: June 28, 2019
    Publication date: September 16, 2021
    Applicant: AECC COMMERCIAL AIRCRAFT ENGINE CO., LTD.
    Inventors: Longfei DANG, Pei HE, Wei CHEN, Rong XU, Yajia E, Pan CHEN, Mingming SU, Hao CHEN
  • Publication number: 20210287904
    Abstract: A method includes forming a gate structure and an interlayer dielectric (ILD) layer over a substrate; selectively forming an inhibitor over the gate structure; performing an atomic layer deposition (ALD) process to form a dielectric layer over the ILD layer, wherein in the ALD process the dielectric layer has greater growing rate on the ILD than on the inhibitor; and performing an atomic layer etching (ALE) process to etch the dielectric layer until a top surface of the inhibitor is exposed, in which a portion of the dielectric layer remains on the ILD layer after the ALE process is complete.
    Type: Application
    Filed: May 28, 2021
    Publication date: September 16, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Wei SU, Fu-Ting YEN, Ting-Ting CHEN, Teng-Chun TSAI
  • Patent number: 11119258
    Abstract: A color filter substrate, a method of manufacturing the color filter substrate and a display device. The color filter substrate includes a base substrate, and a plurality of color resists on the base substrate, the plurality of color resists having at least two different heights. Roughness of top surfaces of the plurality of color resists is inversely proportional to the heights of the plurality of color resists.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: September 14, 2021
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Rui Yin, Qun Fang, Xing Su, Wenlong Mao, Wei Wu, Anxin Dong, Haibin Yin, Bin Li
  • Patent number: 11117323
    Abstract: A vat heating device is provided, including a vat and a heater. The vat has a bottom plate. The vat is used to accommodate a photosensitive resin. The heater is disposed on the bottom plate, adjacent to the photosensitive resin. The heater is used to heat the photosensitive resin. The heater is on an optical path of a light source for curing the photosensitive resin. A photocuring three-dimensional molding system containing the above vat heating device is also provided.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: September 14, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Keh-Su Chang, Yen-I Chou, Jau-Shiu Chen, Sheng-Kai Hsiao, Wei-Chih Hsiao, Chun-Fang Hsu
  • Patent number: 11120995
    Abstract: A method includes forming a bottom layer of a multi-layer mask over a first gate structure extending across a fin; performing a chemical treatment to treat an upper portion of the bottom layer of the multi-layer mask, while leaving a lower portion of the bottom layer of the multi-layer mask untreated; forming a sacrificial layer over the bottom layer of the multi-layer mask; performing a polish process on the sacrificial layer, in which the treated upper portion of the bottom layer of the multi-layer mask has a slower removal rate in the polish process than that of the untreated lower portion of the bottom layer of the multi-layer mask; forming middle and top layers of the multi-layer mask; patterning the multi-layer mask; and etching an exposed portion of the first gate structure to break the first gate structure into a plurality of second gate structures.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: September 14, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Wei Hsu, Yu-Chung Su, Chen-Hao Wu, Shen-Nan Lee, Tsung-Ling Tsai, Teng-Chun Tsai
  • Publication number: 20210279051
    Abstract: Systems and methods for upgrading the firmware of a wireless communication device (202). A wireless communication device (202) may comprise a first processor (204) and a first memory (206) configured to receive monitored data from one or more sensors (210), and wirelessly communicate the received monitored data.
    Type: Application
    Filed: September 14, 2016
    Publication date: September 9, 2021
    Inventors: Wei WU, Feng SU, Xiaozhong ZHANG, Zhiyu WANG
  • Publication number: 20210278171
    Abstract: The present invention relates to the field of handgun holster technologies, and in particular, to an easily lockable and unlockable handgun holster. When the handgun holster needs to be unlocked, it is only necessary to press a button with a finger to complete unlocking of a handgun. When the handgun holster needs to be locked, it is only necessary to insert an end portion of the handgun into the handgun holster through an opening to complete locking of the handgun. The handgun holster of the present invention has a simple structure and can be unlocked through the button. When the handgun is placed in the handgun holster, locking is automatically implemented, so that unlocking and locking are convenient and fast.
    Type: Application
    Filed: May 26, 2021
    Publication date: September 9, 2021
    Inventor: WEI SU
  • Publication number: 20210280584
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC) having a device section and a pick-up section. The IC includes a semiconductor substrate. A first fin of the semiconductor substrate is disposed in the device section. A second fin of the semiconductor substrate is disposed in the pick-up section and laterally spaced from the first fin in a first direction. A gate structure is disposed in the device section and laterally spaced from the second fin in the first direction. The gate structure extends laterally over the semiconductor substrate and the first fin in a second direction perpendicular to the first direction. A pick-up region is disposed on the second fin. The pick-up region continuously extends from a first sidewall of the second fin to a second sidewall of the second fin. The first sidewall is laterally spaced from the second sidewall in the first direction.
    Type: Application
    Filed: March 4, 2020
    Publication date: September 9, 2021
    Inventors: Hsin-Wen Su, Lien Jung Hung, Ping-Wei Wang, Wen-Chun Keng, Chih-Chuan Yang, Shih-Hao Lin
  • Patent number: 11114612
    Abstract: A method for fabricating semiconductor device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, in which the MTJ stack includes a pinned layer on the substrate, a barrier layer on the pinned layer, and a free layer on the barrier layer. Next, part of the MTJ stack is removed, a first cap layer is formed on a sidewall of the MTJ stack, and the first cap layer and the MTJ stack are removed to form a first MTJ and a second MTJ.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: September 7, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Da-Jun Lin, Bin-Siang Tsai, Shih-Wei Su, Ting-An Chien
  • Patent number: 11114566
    Abstract: A semiconductor device includes a substrate, a first fin, a second fin, a dummy fin, a first metal gate, a second metal gate, and an isolation structure. The first, the second and the dummy fins are on the substrate, and the dummy fin is disposed between the first fin and the second fin. The first metal gate and the second metal gate are over the first fin and the second fin, respectively. The isolation structure is on the dummy fin, and the dummy fin and the isolation structure separate the first metal gate and the second metal gate.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: September 7, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Zhi-Chang Lin, Kai-Chieh Yang, Chia-Wei Su, Jia-Ni Yu, Wei-Hao Wu, Chih-Hao Wang
  • Publication number: 20210268672
    Abstract: A multifunctional utility knife includes a body and a blade housed by the body. The body has an open end surface. The open end surface extends on a reference plane. The blade has a cutting edge including a first cutting edge portion and a second cutting edge portion configured for different cutting tasks. The blade in a use position includes the first and the second cutting edge portions disposed outside the body. The first cutting edge portion extends arcuately. The second cutting edge portion extends linearly along a reference line which intersects with the reference plane.
    Type: Application
    Filed: May 20, 2021
    Publication date: September 2, 2021
    Inventor: Cheng-Wei SU
  • Publication number: 20210273089
    Abstract: A semiconductor device includes a substrate having at least two fins thereon and an isolation trench between the at least two fins; and an isolation structure in the isolation trench. The isolation structure consists of a liner layer covering a lower sidewall of each of the at least two fins and a bottom surface of the isolation trench, and a stress-buffer film on the liner layer. The stress-buffer film is a silicon suboxide film of formula SiOy, wherein y<2.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Inventors: Shih-Wei Su, Hao-Hsuan Chang, Chih-Wei Chang, Chi-Hsuan Cheng, Ting-An Chien, Bin-Siang Tsai
  • Patent number: 11105818
    Abstract: The present invention relates to the newly identified MIC-1 binding receptor, GFRAL. In vitro bioassays, for testing affinity and potency of GFRAL ligand, such as MIC- or MIC-1 variants, are provided.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 31, 2021
    Assignee: Novo Nordisk A/S
    Inventors: Jing Su, Wei Yang, Chih-Chuan Chang, Li Yang, Zhe Sun, Haibin Chen, Zhenhua He, Zhe Wang, Sebastian Beck Joergensen
  • Patent number: D929203
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: August 31, 2021
    Assignee: Hong Ann Tool Industries Co., Ltd.
    Inventor: Cheng-Wei Su
  • Patent number: D929204
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: August 31, 2021
    Assignee: Hong Ann Tool Industries Co., Ltd.
    Inventor: Cheng-Wei Su